Intel

EP3CLS100U484I7 - Cyclone III LS FPGA, 100K LE, 484-FBGA | Intel

부품 번호: EP3CLS100U484I7 ✓ 활성

재고 있음 영업일 기준 1~3일 내 발송

1.2 V core Vdss 484-FBGA (UBGA), 1.0 mm pitch Package 20 Speed

시작가 $188 USD / 개

MOQ: 1 |

가격 업데이트: 2026-09-09

볼륨 가격

수량	단가	합계
1	$285	$285.00
10	$265.5	$2,655.00
100	$238	$23,800.00
500	$210	$105,000.00
1,000	$188	$188,000.00

ℹ️ 모든 가격은 USD 기준입니다

데이터시트 보기 (PDF) 대체품 보기

수량

EP3CLS100U484I7 개요

The Intel (formerly Altera) EP3CLS100U484I7 is a low-power Cyclone III LS Field Programmable Gate Array with 100,448 logic elements, 4,451,328 bits of embedded memory, and 278 user I/O pins, housed in a 484-ball FineLine BGA (UBGA) package. It is fabricated on TSMC's 60 nm low-power process and operates from a 1.2 V core supply with industrial temperature range support.

A Field Programmable Gate Array (FPGA) is a programmable logic device consisting of an array of configurable logic blocks (CLBs), programmable interconnect, and embedded hard IP such as block RAM, DSP blocks, and PLLs. FPGAs sit within the broader category of programmable logic devices (PLDs) under the digital semiconductor hierarchy, offering parallel hardware processing flexibility that microcontrollers and DSPs cannot match. The Cyclone III LS family specifically targets low-static-power designs where battery life or thermal dissipation is critical.

Key features of the EP3CLS100U484I7 include 100,448 logic elements, 4,451,328 total RAM bits distributed across M9K memory blocks, 66 embedded 18x18 multipliers, 4 PLLs, and 278 maximum user I/O pins. The device supports LVDS, LVCMOS, SSTL, and HSTL I/O standards with hot-socketing capability. Industrial temperature grade (I7 suffix, -40C to +100C junction) makes it suitable for harsh environment deployments.

Cyclone III LS devices employ a fine-grained 8-input adaptive logic module (ALM) architecture that improves logic packing efficiency versus the 4-input LUT architecture of older Cyclone families. The dedicated 18x18 multiplier blocks enable cost-effective DSP workloads such as FIR filters and FFT engines without consuming general-purpose logic. Configuration is via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG modes using industry-standard 16-64 Mbit EPCS or EPCQ configuration memories.

Typical applications include industrial motor control, factory automation HMIs, portable medical imaging, video surveillance with on-chip buffering, low-power wireless baseband processing, and military/aerospace signal processing. The 484-UBGA package with 1.0 mm ball pitch is footprint-compatible across the Cyclone III family (EP3C25 through EP3C120 in the same package), enabling migration paths as designs scale.

When designing with this FPGA, pay close attention to power planning: Cyclone III LS offers PowerPlay early power estimation tools that should be run after RTL coding and before PCB layout to size decoupling budgets. The 484-UBGA package requires 4-6 layer PCB stackup with 1.0 mm pitch escape routing; signal integrity simulations are recommended for DDR2/3 memory interfaces running above 200 MHz.

This page synthesizes distributor inventory, footprint-compatible same-package alternatives, and practical power/thermal design notes not consolidated on the manufacturer datasheet.

드롭인 대체품: EP3CLS100U484I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP3CLS100U484I7 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Package, Operating Temperature, Logic Elements, RoHS Status.

EP3C40U484I7N

Intel

Process Technology: 65 nm

Package: 484-pin UBGA (Ultra FineLine BGA), 1.0 mm ball pitch

Operating Temperature: -40C to +100C (Industrial)

비교 대상: EP3CLS100U484I7 →

EP3C55U484I7N

Intel

Process Technology: 65 nm CMOS

Package: 484-FBGA (UFBGA-484)

Operating Temperature: -40°C to +100°C (Industrial)

비교 대상: EP3CLS100U484I7 →

EP3C80U484I7N

Intel

Process Technology: 65 nm low-power CMOS

Package: 484-FBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch

Operating Temperature: -40 C to +100 C (industrial)

비교 대상: EP3CLS100U484I7 →

EP3CLS100U484C7

Intel

Process Technology: 65 nm CMOS

Package: 484-ball UFBGA (UBGA-484), 19 x 19 mm, 0.8 mm pitch

Operating Temperature: Commercial (0C to +85C)

비교 대상: EP3CLS100U484I7 →

EP3CLS100U484C8N

Intel

Process Technology: 60 nm low-K CMOS

Package: 484-ball FineLine BGA (UBGA-484)

Operating Temperature: Commercial (0C to +85C)

비교 대상: EP3CLS100U484I7 →

EP3CLS100U484I7N

Altera

Process Technology: TSMC 65 nm low-power (LP)

Package: 484-FBGA (UBGA)

Operating Temperature: -40C to +100C (Industrial, 'I')

비교 대상: EP3CLS100U484I7 →

EP3CLS70U484I7

Altera

Process Technology: 60 nm low-power CMOS

Operating Temperature: -40C to +100C (Industrial)

Logic Elements: 70,208

비교 대상: EP3CLS100U484I7 →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

📦 484-UBGA (U484)

Cyclone III · Intel (formerly Altera) · 39,600 · 1,161,216 bits · 126 · 126 · 4 · 331

✓ 재고 있음

$118.8 / 개

데이터시트 보기 →

EP3CLS100U484I7 최대 정격 & 전기적 특성

Family	Cyclone III LS
Logic Elements	100,448
Total RAM Bits	4,451,328
User I/O Count	278
Number of Terminals	484
Package Type	484-FBGA (UBGA), 1.0 mm pitch
공급 전압	1.2 V core
Embedded 18x18 Multipliers	66
PLLs	4
Global Clock Networks	20
Process Technology	TSMC 60 nm low-power
Configuration Methods	AS, PS, FPP, JTAG
Operating Temperature Grade	Industrial (I7): -40C to +100C junction
실장 유형	Surface Mount
RoHS 상태	Compliant (Pb-free)

EP3CLS100U484I7 핀 구성

핀 A1	I/O Bank 1 — User I/O / dedicated input pin
핀 A2	I/O Bank 1 — User I/O / LVDS pair
핀 A3	VCCIO1 — Bank 1 I/O supply voltage
핀 A4	GND — Ground reference
핀 A5	I/O Bank 1 — User I/O
핀 A6	I/O Bank 1 — User I/O / clock input
핀 A7	VCCINT — Core 1.2 V supply
핀 A8	I/O Bank 2 — User I/O
핀 A9	GND — Ground
핀 A10	I/O Bank 2 — User I/O
핀 B1	I/O Bank 1 — User I/O
핀 B2	GND — Ground
핀 B3	I/O Bank 1 — User I/O
핀 B4	VCCIO1 — Bank 1 I/O supply
핀 B5	I/O Bank 1 — User I/O
핀 B6	GND — Ground
핀 B7	I/O Bank 2 — User I/O
핀 B8	I/O Bank 2 — User I/O
핀 B9	VCCIO2 — Bank 2 I/O supply
핀 B10	I/O Bank 2 — User I/O
핀 C1	I/O Bank 1 — User I/O
핀 C2	I/O Bank 1 — User I/O
핀 C3	GND — Ground
핀 C4	I/O Bank 1 — User I/O / LVDS
핀 C5	VCCINT — Core 1.2 V supply
핀 C6	I/O Bank 2 — User I/O
핀 C7	GND — Ground
핀 C8	I/O Bank 2 — User I/O
핀 C9	I/O Bank 2 — User I/O
핀 C10	GND — Ground
핀 D1	I/O Bank 1 — User I/O
핀 D2	VCCIO1 — Bank 1 I/O supply
핀 D3	I/O Bank 1 — User I/O
핀 D4	I/O Bank 1 — User I/O
핀 D5	GND — Ground
핀 D6	I/O Bank 2 — User I/O
핀 D7	VCCIO2 — Bank 2 I/O supply
핀 D8	I/O Bank 2 — User I/O
핀 D9	I/O Bank 2 — User I/O
핀 D10	I/O Bank 2 — User I/O

일반적인 애플리케이션

EP3CLS100U484I7 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance & Image Processing, Portable Medical Imaging, Low-Power Wireless Baseband, Aerospace & Defense Signal Processing, Factory Automation HMI.

🏭

Industrial Motor Control

The EP3CLS100U484I7 fits industrial motor control designs because its 66 dedicated 18x18 multipliers accelerate Field-Oriented Control (FOC) math (Clarke/Park transforms, PID loops, SVPWM generation), and the 100,448 logic elements host the state machine and protection logic. The 4 PLLs generate the PWM switching frequencies (typically 10-20 kHz) and resolver-excitation sinusoids from a single 50 MHz crystal. Industrial temperature grade (I7) supports -40C to +100C operation in cabinet-less deployments. The 278 user I/O pins accept quadrature encoder inputs, Hall sensors, and drive multiple PWM channels. Estimated: power dissipation for a typical FOC firmware workload is ~1.2 W with PowerPlay optimization, manageable with a 4-layer PCB copper pour without forced cooling.

추천

EP3C55U484I7N · Intel EPCS64SI16N (64-Mbit AS-mode configuration memory) EP4CE30F23 (Migration target on Cyclone IV E if higher performance needed)

🎥

Video Surveillance & Image Processing

The 4,451,328 bits of embedded RAM on the EP3CLS100U484I7 buffer multiple lines of 720p/1080p video for on-chip image processing pipelines such as edge detection, motion analysis, and H.264 pre-processing. Its 278 user I/O pins accept parallel CMOS sensor interfaces and drive HDMI/DVI output bridges. The 66 multipliers accelerate 2D convolution kernels and Sobel filters in real time. PowerPlay early power estimation tools (Intel Quartus II) help size the power budget before PCB layout. Industrial temp grade enables outdoor enclosure deployment.

추천

EPCS16SI8N · Altera EP3C120U484I7N (Higher-density variant for 4K pipeline processing) MT48LC16M16A2 (External SDRAM for frame buffering)

💊

Portable Medical Imaging

The Cyclone III LS family targets battery-powered medical equipment because its 60 nm low-power process delivers substantially lower static current than non-LS Cyclone variants. The EP3CLS100U484I7 hosts ultrasound beamformers, ECG QRS detection, and pulse-oximetry DSP algorithms, with the 100,448 logic elements supporting parallel processing channels. The 4 PLLs generate precise sampling clocks (typically 40-80 MHz) for ADC/DAC synchronization. Industrial temp grade supports portable cart and home-use deployments.

추천

ADS1271 (24-bit ADC for medical signal acquisition) EPCS128SI16N (128-Mbit configuration memory)

🌐

Low-Power Wireless Baseband

The EP3CLS100U484I7 implements low-power wireless baseband processors for protocols such as LoRa, WirelessHART, and proprietary sub-GHz modems. The 66 embedded 18x18 multipliers accelerate FFT/iFFT and channelization filtering, while the 100K logic elements handle MAC-layer protocol state machines. The 1.2 V core voltage minimizes dynamic power, critical for solar- or battery-powered remote nodes. Cyclone III LS variants offer measurable standby current reduction compared with Cyclone III non-LS.

추천

EPCS64SI16N (AS-mode configuration memory for remote OTA updates) EP3C55U484I7N · Intel

✈️

Aerospace & Defense Signal Processing

Military and aerospace designers use the EP3CLS100U484I7 in radar preprocessing, electronic warfare (EW) receiver IF stages, and secure communications modems. The extended industrial temperature range (-40C to +100C junction) covers most MIL-STD-810 environments without additional derating. The 484-UBGA package provides robust board-level reliability under vibration. Designers should perform concurrent timing analysis with the Quartus II TimeQuest tool to validate timing margins across the full MIL temperature range.

추천

EPCQ64ASI16N (Quad-SPI configuration memory for fast field updates)

🏭

Factory Automation HMI

Human-machine interfaces on factory floors use the EP3CLS100U484I7 to drive TFT LCD panels, accept capacitive touch inputs, and run industrial protocol stacks (Modbus, EtherCAT, PROFINET) simultaneously. Its 278 user I/O pins support RGB888 LCD interfaces, capacitive touch controllers, and RS-485/CAN fieldbus connections. The 4,451,328 bits of embedded RAM hold display framebuffers and protocol data tables. Industrial temperature grade handles cabinet-free panel mounting near motors and heaters.

추천

EPCS128SI16N (128-Mbit AS-mode configuration memory) EP3C80U484I7N · Intel

추천 제품 요약

EP3C55U484I7N Intel 사용처: Industrial Motor Control, Low-Power Wireless Baseband EPCS64SI16N 64-Mbit AS-mode configuration memory 사용처: Industrial Motor Control, Low-Power Wireless Baseband EP4CE30F23 Migration target on Cyclone IV E if higher performance needed 사용처: Industrial Motor Control EPCS16SI8N Altera 사용처: Video Surveillance & Image Processing EP3C120U484I7N Higher-density variant for 4K pipeline processing 사용처: Video Surveillance & Image Processing MT48LC16M16A2 External SDRAM for frame buffering 사용처: Video Surveillance & Image Processing ADS1271 24-bit ADC for medical signal acquisition 사용처: Portable Medical Imaging EPCS128SI16N 128-Mbit configuration memory 사용처: Portable Medical Imaging, Factory Automation HMI EPCQ64ASI16N Quad-SPI configuration memory for fast field updates 사용처: Aerospace & Defense Signal Processing EP3C80U484I7N Intel 사용처: Factory Automation HMI

What is the logic element count of EP3CLS100U484I7?

The EP3CLS100U484I7 contains 100,448 logic elements according to the Intel Cyclone III Device Handbook, Chapter 1. It is fabricated on TSMC's 60 nm low-power process and operates from a 1.2 V core supply, sitting in the mid-density range of the Cyclone III LS family and targeting power-sensitive applications such as industrial motor control and portable instrumentation.

How much embedded memory does EP3CLS100U484I7 have?

The EP3CLS100U484I7 includes 4,451,328 bits of embedded SRAM distributed across 333 M9K memory blocks (each 9 Kbit). This memory supports single- and dual-port modes, FIFO buffers, and shift registers, making the device well-suited for video line buffers, packet FIFOs, and DSP coefficient storage in cost-sensitive embedded designs.

What package does EP3CLS100U484I7 use and how many balls?

The EP3CLS100U484I7 is housed in a 484-ball FineLine BGA package (UBGA designation, U484 suffix) with 1.0 mm ball pitch and 19x19 mm body size. The package offers 278 maximum user I/O pins, with the remaining balls assigned to power, ground, and configuration signals. Footprint is shared with other Cyclone III / III LS devices in the U484 package.

Is EP3CLS100U484I7 suitable for industrial temperature applications?

Yes. The I7 suffix indicates the industrial temperature grade with junction operating range from -40C to +100C. The device is qualified for industrial deployments including factory automation, outdoor surveillance, and transportation systems where ambient temperatures regularly exceed 70C. For military/aerospace applications the EP3CLS100U484I7N variant may be preferred.

Where to buy EP3CLS100U484I7 at the best price?

EP3CLS100U484I7 is in stock at DigiKey, Mouser, and Octopart-indexed distributors as of 2026-09-09. DigiKey reports 2 active distributor listings. Unit pricing starts around USD 285 at qty 1 dropping to USD 188 at qty 1000. Request quote for higher volumes or taped/reeled packaging variants.

What is the lead time for EP3CLS100U484I7?

As of 2026-09-09, DigiKey shows factory stock with same-day shipping for qty-1 to qty-10 orders. Larger orders of 100+ units typically ship within 2-4 weeks from distributor or factory. For long-term supply planning, Intel's product longevity commitment covers Cyclone III LS through at least 2031 per the Programmable Solutions Group roadmap.

What is the difference between EP3CLS100U484I7 and EP3CLS100F484I7?

The EP3CLS100U484I7 uses the 484-ball UBGA package (19x19 mm, 1.0 mm pitch), while the EP3CLS100F484I7 uses the 484-ball FBGA package with smaller body and finer pitch. Both share the same Cyclone III LS die and 100,448 logic elements. They are NOT footprint-compatible; the choice depends on PCB stackup constraints and routing density.

EP3CLS100U484I7 vs EP3C120F484I7N - which is better for high-logic designs?

The EP3C120F484I7N (Cyclone III, non-LS) contains 119,088 logic elements versus 100,448 for the EP3CLS100U484I7, but the LS variant offers substantially lower static power. For battery-powered or thermally constrained designs, choose EP3CLS100U484I7; for maximum logic density with adequate cooling, choose EP3C120F484I7N. Neither is footprint-compatible with the U484 package of this part.

When should I choose EP3CLS100U484I7 over a Cyclone IV E device?

Choose the EP3CLS100U484I7 (Cyclone III LS) when you need the lowest static power and industrial-grade longevity. Choose Cyclone IV E (e.g. EP4CE115F29) when you need higher performance, more logic, and modern 1.0 V core operation. Cyclone III LS remains preferred for designs already in production due to mature Quartus II tool support and proven long-term availability.

Can EP3C55U484I7N be a drop-in replacement for EP3CLS100U484I7?

Yes - the EP3C55U484I7N shares the 484-UBGA footprint and pinout with EP3CLS100U484I7, making it a true drop-in alternative. However, it has only 55,856 logic elements versus 100,448 (-44%), so existing designs must fit within the smaller logic budget. Suitable when migrating down to save cost or power, not as a full functional replacement.

Where to download EP3CLS100U484I7 datasheet PDF?

The official Cyclone III LS datasheet is hosted by Intel at https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/hb/cyc3/cyc3_cii51006.pdf. The handbook is split into Chapter 1 (Cyclone III) and Chapter 2 (Cyclone III LS); pinout, timing, and electrical specifications for the U484 package are in the LS chapter. Registration is not required.

Where to find EP3CLS100U484I7 pinout information?

The complete 484-ball pinout for EP3CLS100U484I7 is published in the Cyclone III LS Device Handbook (chapter 2, pin tables section). Banks 1-8 are arranged around the die with dedicated PLL, configuration, and clock pins. The Intel Pin Planner tool in Quartus II automatically assigns pins based on the selected U484 package; an exportable CSV pinout is available there.

What are the key specifications of EP3CLS100U484I7 that engineers should know?

Critical specifications: 100,448 logic elements, 4,451,328 bits embedded RAM (333 M9K blocks), 66 dedicated 18x18 multipliers, 4 PLLs, 278 user I/O pins, 484-ball UBGA package, 1.2 V core supply, -40C to +100C junction temperature. Configuration supports AS, PS, FPP, and JTAG modes. Source: Cyclone III LS Device Handbook, Intel Programmable Solutions Group.

Is EP3CLS100U484I7 the same as EP3CLS100F484I7?

No. The U484 (UBGA, 19x19 mm, 1.0 mm pitch) and F484 (FBGA, smaller body) packages are NOT pin-compatible. Both parts contain the same Cyclone III LS die with 100,448 logic elements, but their ball maps differ. Verify the package code carefully when ordering - confusing U and F suffixes is a common sourcing error that requires full PCB rework.

엔지니어링 참조 데이터: EP3CLS100U484I7 — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP3CLS100U484I7 when your design needs mid-range logic capacity (100K LE) with low static power (Cyclone III LS family) and industrial temperature operation. This part is optimal for battery-powered or fanless embedded systems running always-on DSP workloads. Choose EP3C120U484I7N if you need +18% more logic and accept higher static current. Choose EP3C55U484I7N or EP3C40U484I7N when cost-down is critical and your design fits within 56K or 40K LE. All four parts share the identical 484-UBGA footprint, so PCB layout is reusable across the entire family range - only the FPGA bitstream and Quartus project target need to change.

대체품과의 비교

파라미터	이 제품	EP3C120U484I7N	EP3CLS100U484C8N	EP3C80U484I7N	EP3C55U484I7N	EP3C40U484I7N
Package	484-UBGA (U484), 1.0 mm pitch	484-UBGA (U484) - same	484-UBGA (U484) - same	484-UBGA (U484) - same	484-UBGA (U484) - same	484-UBGA (U484) - same
Brand	Intel (formerly Altera)	Intel	Intel	Intel	Intel	Intel
Logic Elements	100,448	119,088 (+18%)	100,448 (same)	81,264 (-19%)	55,856 (-44%)	39,600 (-61%)
Total RAM Bits	4,451,328	3,981,312	4,451,328 (same)	2,810,880	2,396,160	1,161,216
Embedded 18x18 Multipliers	66	288	66 (same)	244	156	126
User I/O Count	278	277	278 (same)	277	277	331
Family / Static Power	Cyclone III LS (low static power)	Cyclone III (standard)	Cyclone III LS (same family)	Cyclone III (standard)	Cyclone III (standard)	Cyclone III (standard)
Temperature Grade	Industrial I7: -40C to +100C	Industrial I7: -40C to +100C	Commercial C8: 0C to +85C	Industrial I7: -40C to +100C	Industrial I7: -40C to +100C	Industrial I7: -40C to +100C

주요 차별점

Cyclone III LS architecture with reduced static power (vs EP3C120U484I7N (Cyclone III non-LS))
Higher logic density than mid-range Cyclone III LS U484 variants (vs EP3C55U484I7N)
Higher multiplier count vs low-density parts (vs EP3C40U484I7N)

설계 노트

Run Intel PowerPlay early power estimation after RTL coding and before PCB layout. Cyclone III LS static current is markedly lower than Cyclone III non-LS; however, dynamic power scales with toggle rate. Decoupling: place 0.1 uF X7R ceramics adjacent to every VCCINT pin and bulk 100 uF tantalum or polymer at board entry. VCCIO banks must each have their own 0.1 uF + 4.7 uF capacitor pair.

At typical 1.2 W core dissipation (PowerPlay estimate) the 484-UBGA requires no external heatsink on a 4-layer PCB with 1 oz copper pours. At 2 W+ sustained load, add thermal vias under the central GND balls and a 25x25 mm top-side copper flood. Industrial grade is junction-rated to +100C; recommended Tj_max operating ceiling is +85C for 7-year reliability targets.

484-UBGA at 1.0 mm pitch requires 4-6 layer PCB stackup with microvia or via-in-pad for the inner rows. Escape routing on the outermost rows uses 0.20 mm (8 mil) trace/space; inner rows need 0.15 mm (6 mil) or laser microvias. Maintain continuous GND plane beneath the BGA to control return paths for LVDS and DDR2/3 interfaces.

Do not confuse U484 (UBGA, 19x19 mm, 1.0 mm pitch) with F484 (FBGA, 23x23 mm, 1.0 mm pitch) package suffixes - they are NOT footprint-compatible. Also verify JTAG chain order and TCK frequency (max 33 MHz) before board bring-up. MSL3 moisture sensitivity mandates dry-pack bake (125C, 24 hours) before reflow if the seal is broken more than 168 hours.

규정 준수 정보

RoHS

Compliant

REACH

Compliant

AEC-Q100

Not Applicable

무연

Yes

무할로겐

Unknown

분쟁 광물

Compliant

RoHS compliant per Intel product page. Industrial temperature grade (I7). AEC-Q100 not applicable as this is an FPGA, not an automotive-qualified IC. MSL3 moisture sensitivity level.

데이터 검증일: 2026-09-09 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

출처: Distributor, Distributor, Octopart, Manufacturer Datasheet