EP3SL340F1517C4L - Stratix III L FPGA, 337K LEs, 1517-FCBGA | Intel
부품 번호: EP3SL340F1517C4L ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $19234.06 | $19,234.06 |
| 10 | $17500 | $175,000.00 |
| 50 | $16000 | $800,000.00 |
| 100 | $15200 | $1,520,000.00 |
| 250 | $14500 | $3,625,000.00 |
EP3SL340F1517C4L 개요
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose function is defined by customer-written configuration data after manufacture. The Stratix III architecture places it within the broader hierarchy: programmable logic -> FPGA -> high-performance FPGA with embedded transceivers and DSP blocks -> 65-nm low-power node -> complex system-on-chip platform. Designers use FPGAs when ASIC NRE costs cannot be amortized, when time-to-market dominates, or when in-system reprogrammability is required.
Key specifications include up to 1.4 Gbps LVDS performance, dedicated 9-bit DSP blocks for high-throughput arithmetic, 18x18 multipliers, embedded memory blocks up to 1,152 Kbits per block, and 12 PLLs for clock synthesis. The 1517-FCBGA package provides sufficient I/O density for parallel interface buses, memory controllers, and high-speed serial aggregation in a single device.
The 65-nm process node and proprietary logic structure yield a typical static power reduction versus the Stratix III E variant. The architecture supports up to 12.5 Gbps transceivers (where applicable in E variants), hard PCI Express and external memory controllers, and partial reconfiguration for power-managed systems. The device integrates 4 hard memory controllers and 8 PLLs standard.
Typical applications include high-end telecommunications line cards, ASIC prototyping, broadcast video processing, military signal processing, and high-performance computing accelerators. Designers benefit when 337K LEs of logic capacity and 18 Mbits of memory are required within a single low-power device.
When designing with this FPGA, confirm PCB footprint compatibility with the 1517-ball 1.0 mm pitch FCBGA land pattern. Use the Altera Quartus II or Intel Quartus Prime design suite; older versions are required because Stratix III is in maintenance status. Provide adequate decoupling on all VCC/VCCPD/PWR rails.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving engineers a consolidated reference for sourcing, replacement, and selection decisions.
드롭인 대체품: EP3SL340F1517C4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340F1517C4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Embedded Memory Bits, Mounting Type, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL340F1517C4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$7044.96 / 개
데이터시트 보기 →EP3SL340F1517C4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3300 / 개
데이터시트 보기 →EP3SL340F1517C3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3750 / 개
데이터시트 보기 →EP3SL340F1517C3
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →EP3SL340F1517I4L
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1995 / 개
데이터시트 보기 →EP3SL340F1517C4L 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 337,500 |
| Embedded Memory Bits | 18,822,144 |
| User I/Os | 976 |
| LABs (Logic Array Blocks) | 13,500 |
| 패키지 | 1517-BBGA, FCBGA |
| Pin/Pitch Count | 1517 ball, 1.0 mm pitch |
| Speed Grade | C4 |
| Temperature Grade | Commercial (0 °C to +85 °C) |
| Process Node | 65 nm |
| Transceivers | None (L variant: logic-only) |
| 실장 유형 | Surface Mount (BGA) |
| Lead Free / RoHS | Yes / Compliant |
| Configuration Memory | SRAM-based, external |
EP3SL340F1517C4L 1517-bbga, fcbga 핀 구성 가이드
EP3SL340F1517C4L(1517-bbga, fcbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL340F1517C4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL340F1517C4L 적합 용도: 7 애플리케이션s: High-End Telecommunications Line Cards, ASIC Prototyping and Emulation, Broadcast Video Processing, Military Signal Processing and SDR, High-Performance Computing Accelerators, Industrial Automation and Machine Vision, Medical Imaging (Ultrasound, CT, MRI).
High-End Telecommunications Line Cards
The EP3SL340F1517C4L is well matched to high-density line-card FPGA designs where its 337,500 logic elements support complex packet-processing datapaths and its 18,822,144 bits of embedded memory buffer traffic at wire speed. Its 976 user I/Os provide the parallel interconnect bandwidth needed between the FPGA, network processors, and SERDES framer ICs, while the Stratix III L architecture minimises static power across thousands of line-card instances in a chassis. Designers place the device between the framer and the switch fabric, where its hard memory controllers and 12 PLLs handle multi-rate clocking and large external TCAM/QDR memories.
추천
ASIC Prototyping and Emulation
With 337,500 LEs, the EP3SL340F1517C4L emulates large ASICs and SoCs that have not yet taped out, allowing software development and verification months before silicon is available. The 18 Mbits of embedded memory mirror typical SoC SRAM blocks, and the 976 I/Os are subdivided in the FPGA fabric to break out ASICs, USB, DDR, and PCIe pins. Designers use multiple EP3SL340 devices in a multi-FPGA prototyping board with high-speed serial links stitching them together; the C4 speed grade eases timing closure on these complex partition boundaries.
추천
Broadcast Video Processing
The EP3SL340F1517C4L's high logic density and large embedded memory make it suitable for broadcast video processing, including 4K video format conversion, multi-stream transcoding, and real-time video effect engines. The 976 user I/Os support parallel video buses (BT.1120, BT.656, DisplayPort) and the embedded memory buffers full frames for low-latency processing. Compared with smaller FPGAs, the EP3SL340 lets designers integrate the entire pipeline in one chip, eliminating inter-chip serialization latency and simplifying board design.
추천
Military Signal Processing and SDR
The EP3SL340F1517C4L serves military signal-processing and software-defined radio (SDR) applications requiring high logic density and large memory bandwidth. Its DSP blocks accelerate FFTs and channelisation filters, while 976 I/Os interface to ADC/DAC banks, RF front-end ICs, and timing subsystems. Although the L variant lacks transceivers, system architects pair it with external SERDES, and the 65-nm node provides good radiation tolerance when paired with mitigation flows. Use the EP3SL340F1517I4L industrial variant for MIL-spec temperature environments.
추천
High-Performance Computing Accelerators
The EP3SL340F1517C4L accelerates HPC workloads in financial trading, scientific simulation, and machine learning inference, where its 337K LEs and DSP blocks deliver parallel compute throughput that exceeds general-purpose CPUs. The 18 Mbits of embedded memory hold weights and intermediate activations close to the compute fabric, and 976 I/Os connect to PCIe-edge host processors and DDR memory banks. Designers leverage the Stratix III L architecture's lower static power to pack more compute into thermal-constrained 1U accelerator cards.
추천
Industrial Automation and Machine Vision
The EP3SL340F1517C4L is a strong fit for multi-camera machine vision systems where its 976 I/Os accept parallel LVDS/CML image-sensor data and its DSP blocks perform real-time image preprocessing, feature extraction, and object detection. The 18 Mbits of embedded memory buffer full-resolution frames, and the C4 speed grade supports the high pixel-clock frequencies used by modern CMOS sensors. Combined with industrial-grade companions like the EP3SL340F1517I4L, designers cover factory-floor and outdoor deployments with a single FPGA family.
추천
Medical Imaging (Ultrasound, CT, MRI)
The EP3SL340F1517C4L accelerates beamforming in ultrasound, image reconstruction in CT, and signal processing in MRI, where its DSP blocks and embedded memory handle the parallel arithmetic and data buffering required for real-time imaging. The 976 I/Os accept high-channel-count ADC data from transducer arrays and detector banks, while the low-power Stratix III L architecture supports fan-less medical device enclosures. The commercial C4 speed grade suffices for medical imaging clocks, and the FCBGA package's thermal performance supports high-DSP utilization without exotic cooling.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL340F1517C4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL340F1517C4N | EP3SL340F1517C4 | EP3SL340F1517C3N | EP3SL340F1517C3 | EP3SL340F1517I4L |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-BBGA, FCBGA | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) | 1517-BBGA, FCBGA (same) |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory (bits) | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| User I/Os | 976 | 976 | 976 | 976 | 976 | 976 |
| Speed Grade | C4 | C4 | C4 | C3 (slower) | C3 (slower) | I4 (industrial, same timing class as C4) |
| Temperature Grade | Commercial (0 °C to +85 °C) | Commercial (same) | Commercial (same) | Commercial (same) | Commercial (same) | Industrial (-40 °C to +100 °C) |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
주요 차별점
- Highest logic and memory density in the Stratix III L family (vs EP3SL200F1517C4L)
- Lower static power than Stratix III E with same process node (vs EP3SE260F1517C4L)
- Industry-leading 976 user I/Os in a single BGA (vs EP3SL200F1152C4L)
- Drop-in compatibility across speed grades and temperature grades (vs EP3SL340F1517I4L)
설계 노트
Estimated: At full logic utilization (337,500 LEs at ~70% switching) the EP3SL340F1517C4L can dissipate 5-8 W static plus 8-12 W dynamic power, requiring thermal relief on the FCBGA. Provide at least four thermal vias per ball grid under the die, a copper-filled keep-out on inner planes, and consider a heatsink or heat spreader for high-utilization designs. The 1517-FCBGA package does not have an integrated metal heat slug; thermal performance is dominated by PCB copper area and airflow.
Estimated: The Stratix III L architecture reduces static leakage versus the E variant by roughly 30-50%, but designers must still sequence VCCINT (core), VCCPD (I/O pre-driver), and VCCIO (I/O) rails per the Stratix III handbook power-up sequence. Each rail requires its own decoupling network: 0.1 µF + 10 µF + bulk per supply pin group. Failing to sequence correctly can latch up the device or trigger POR faults that prevent configuration.
The 1517-ball FCBGA uses a 1.0 mm pitch, which requires high-density interconnect (HDI) PCB fabrication with microvias and 4-6 mil trace/space rules. Use the Intel/Altera-provided land pattern and via-in-pad geometry; conventional dog-bone fanout is too dense for breakout routing. Verify stackup with your PCB vendor for via-in-pad plating reliability and consider ENIG or ENEPIG surface finish to minimize BGA solder joint defects.
Route high-speed LVDS pairs (up to 1.4 Gbps per the device datasheet) as 100-ohm differential pairs with matched length (typically <50 mil skew for byte clocks). Keep LVDS traces on adjacent inner layers with continuous reference planes; never cross a plane split. Place PLL power filters (ferrite bead + 10 µF + 0.1 µF) within 100 mil of each PLL analog supply pin, and isolate PLL analog ground from digital ground at a single point near the PLL.
Estimated: The EP3SL340F1517C4L is in Last Time Buy status, so do not start new production designs on this part number. For new designs choose the Cyclone V GX, Arria 10, or newer Stratix family with active lifecycle. For in-service boards, secure lifetime-buy inventory now because Stratix III L remaining stock can deplete within 12-24 months and lead times can stretch to 26+ weeks once exhausted.
규정 준수 정보
RoHS compliant per the 'L' suffix in the part ordering code. AEC-Q100 not applicable for FPGAs in this family. Halogen-free status not explicitly confirmed in the verified distributor data; treat as unknown unless verified against the Intel material declaration.