EP3SL340F1517I4L - 337500-Cell Stratix III L FPGA | Intel
부품 번호: EP3SL340F1517I4L ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2640 | $26,400.00 |
| 100 | $2410 | $241,000.00 |
| 500 | $2195 | $1,097,500.00 |
| 1,000 | $1995 | $1,995,000.00 |
EP3SL340F1517I4L 개요
An FPGA (Field Programmable Gate Array) is a programmable semiconductor device that allows hardware designers to implement custom digital logic circuits after manufacturing. FPGAs combine configurable logic blocks (CLBs), programmable interconnects, dedicated DSP slices, embedded memory (BRAM/M9K/M144K), high-speed transceivers, and clock management circuitry on a single die. Within the broader semiconductor taxonomy, FPGAs sit between general-purpose microcontrollers and fixed-function ASICs: more flexible than ASICs, far more parallel than CPUs, and far faster than software-only solutions for parallel DSP and packet-processing workloads.
Key features of the EP3SL340F1517I4L include 13,500 LABs (Logic Array Blocks), 576 embedded 18x18 multipliers (DSP blocks), 4 PLLs, and support for external memory interfaces including DDR3, DDR2, QDR II+, and RLDRAM II. The device integrates 24 transceivers capable of up to 6.375 Gbps operation, which is the differentiator between the Stratix III L (low-power) and Stratix III GX variants. The 1517-BGA package supports 976 user I/Os - among the highest I/O count in the Stratix III family - and is appropriate for systems requiring wide external memory buses, parallel ASIC-emulation interfaces, or many LVDS channels.
Architecturally, the EP3SL340F1517I4L uses a 65 nm low-k dielectric process, multi-level copper interconnect, and an adaptive logic module (ALM) based on 8-input fracturable look-up tables, which gives finer-grained logic packing and shorter critical paths than the older 4-input LUT architecture used in Stratix II. The transceivers use a hardened PCS/PMA pipeline that supports protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, and CEI-6G.
Typical applications include wireline telecommunication line cards, software-defined radio (SDR) baseband processing, ASIC prototyping and emulation, high-performance computing (HPC) acceleration, broadcast video processing, and military/aerospace signal processing. The device is well-suited to designs that require the largest logic capacity and widest memory bandwidth in the Strat III L family.
When designing with this device, engineers should carefully manage power and thermal envelopes - even the L (low-power) variant of a 337k-LE FPGA can dissipate tens of watts under heavy transceiver and DSP utilization, requiring a multi-layer PCB with continuous ground and power planes, controlled-impedance routing for the 6 Gbps transceivers, and a substantial heatsink. Industrial-grade temperature range (-40C to +100C junction) is supported by the I4 speed grade.
This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, and practical design considerations beyond what the manufacturer datasheet alone provides, helping procurement and FPGA hardware engineers source the part more efficiently.
드롭인 대체품: EP3SL340F1517I4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL340F1517I4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Embedded Memory Bits, Operating Temperature, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL340F1517I4
✅ 드롭인✓ 재고 있음
$13500 / 개
데이터시트 보기 →EP3SL340F1517I3N
✅ 드롭인✓ 재고 있음
$2520 / 개
데이터시트 보기 →EP3SL340F1517I3
✅ 드롭인✓ 재고 있음
$18900 / 개
데이터시트 보기 →EP3SL340F1517C4N
✅ 드롭인✓ 재고 있음
$7044.96 / 개
데이터시트 보기 →EP3SL340F1517C4LN
✅ 드롭인✓ 재고 있음
$11200 / 개
데이터시트 보기 →EP3SL340F1517C4L
✅ 드롭인✓ 재고 있음
$14500 / 개
데이터시트 보기 →EP3SL340F1517I4L 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Core Logic Elements | 337,500 |
| Embedded Memory (bits) | 18,822,144 |
| Logic Array Blocks (LABs) | 13,500 |
| Maximum User I/Os | 976 |
| Maximum Core Frequency | 717 MHz |
| DSP Blocks (18x18 multipliers) | 576 |
| PLLs | 4 |
| Transceivers | 24 channels, up to 6.375 Gbps |
| Process Node | 65 nm CMOS (TSMC) |
| 패키지 | 1517-ball FBGA (FCBGA), 40 x 40 mm |
| Speed Grade | I4L (industrial, low-power) |
| Operating Temperature (Junction) | -40C to +100C |
| 습도 민감도 레벨 (MSL) | 4 |
| RoHS 상태 | Compliant |
| External Memory Interfaces | DDR3, DDR2, QDR II+, RLDRAM II |
| Configuration | FPGA (SRAM-based, volatile) |
EP3SL340F1517I4L 1517-ball fbga (fcbga), 40 x 40 mm 핀 구성 가이드
EP3SL340F1517I4L(1517-ball fbga (fcbga), 40 x 40 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL340F1517I4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL340F1517I4L 적합 용도: 6 애플리케이션s: ASIC Prototyping and Emulation, Wireless Baseband Signal Processing, Telecommunication Line Cards, Software Defined Radio (SDR), Broadcast Video Processing, Industrial Imaging and Machine Vision.
ASIC Prototyping and Emulation
The EP3SL340F1517I4L delivers 337,500 logic elements and 18.8 Mbits of embedded memory - the largest density in the Stratix III L family. This makes it an ideal target for ASIC prototyping platforms such as S2C, Synopsys Certus, and ProDesign, which often partition mid-size ASIC designs (5-10M gates) across one or two Stratix III FPGAs. Its 24 transceivers enable high-speed chip-to-chip links between prototyping boards, and the 976 user I/Os support wide external memory buses for mapping realistic ASIC testbenches onto real silicon.
추천
Wireless Baseband Signal Processing
The 576 DSP blocks (18x18 multipliers) and 24 transceivers up to 6.375 Gbps position the EP3SL340F1517I4L strongly for wireless baseband DSP in LTE, WiMAX, and proprietary OFDM stacks. Compared to a CPU or DSP processor, the FPGA delivers 10-50x higher throughput on parallel FFT and channel-estimation kernels. CPRI and OBSAI link rates up to 6.375 Gbps support direct connection to a Radio Equipment Controller (REC). The L (low-power) variant is preferred for thermally constrained remote radio heads.
추천
Telecommunication Line Cards
In telecom line-card applications, the EP3SL340F1517I4L typically handles packet classification, traffic shaping, and framer/MAC functions for multi-Gbps links. Its 18.8 Mbits of embedded memory is sufficient for 10G+ packet buffers, and the 976 user I/Os allow direct interfacing to external RLDRAM II or QDR II+ SRAM for deep queue tables. According to Intel's telecom reference designs, Stratix III FPGAs are commonly paired with external PHY and Network Processor ICs on ATCA or AMC modules.
추천
Software Defined Radio (SDR)
SDR platforms benefit from the EP3SL340F1517I4L's combination of high DSP block count, high-density logic, and 6.375 Gbps transceivers. A single device can implement multi-channel DDC/DUC chains, FFT-based spectrum sensing, and protocol stacks for waveforms such as LTE, WCDMA, or proprietary military radios. The 18.8 Mbits of BRAM holds wide coefficient tables for FIR filters. SDR vendors typically use Stratix III FPGAs for portable, low-power SDR platforms because of the L variant's reduced transceiver power.
추천
Broadcast Video Processing
Broadcast video routers and switchers use the EP3SL340F1517I4L for SDI crosspoint switching, up/down/cross-conversion, and color-space conversion. Its 976 user I/Os support very wide parallel video buses for uncompressed 4:4:4 video at 3G-SDI rates, and the 6.375 Gbps transceivers carry 3G-SDI/HD-SDI directly. The L variant's lower transceiver power is helpful in dense broadcast router chassis with dozens of FPGAs.
추천
Industrial Imaging and Machine Vision
In machine vision, the EP3SL340F1517I4L handles multi-channel Camera Link, CoaXPress, or GigE Vision aggregation and pre-processing. Its 337k logic elements can host a full image-processing pipeline (debayer, color correction, edge detection) on 8-16 simultaneous camera streams at 80 MHz pixel clock. The I4 industrial speed grade supports -40C to +100C junction temperature, suitable for factory-floor vision systems with elevated ambient temperatures.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL340F1517I4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL340F1517I4 | EP3SL340F1517I3N | EP3SL340F1517I3 | EP3SL340F1517C4N | EP3SL340F1517C4LN | EP3SL340F1517C4L |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 1517-FBGA (FCBGA), 40 x 40 mm | 1517-FBGA - same | 1517-FBGA - same | 1517-FBGA - same | 1517-FBGA - same | 1517-FBGA - same | 1517-FBGA - same |
| Logic Elements | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 | 337,500 |
| Embedded Memory (bits) | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 | 18,822,144 |
| Speed Grade | I4L (industrial, low-power) | I4 (industrial, standard) | I3N (industrial, fast, standard) | I3 (industrial, fast) | C4N (commercial, standard) | C4LN (commercial, low-power) | C4L (commercial, low-power) |
| Temperature Range (Junction) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | 0C to +85C | 0C to +85C | 0C to +85C |
| Transceiver Variant | Low-power (L) | Standard (non-L) | Standard (non-L) | Standard (non-L) | Standard (non-L) | Low-power (L) | Low-power (L) |
| User I/Os | 976 | 976 | 976 | 976 | 976 | 976 | 976 |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Largest logic density in the Stratix III L family (vs EP3SL200F1517I4L)
- Low-power transceiver variant (vs EP3SL340F1517I4 (N variant))
- Industrial temperature with full density (vs EP3SL340F1517C4L (commercial temp))
- Same-package scalability (vs EP3SL340F1517C4N (commercial non-L))
설계 노트
Estimated: a fully populated EP3SL340F1517I4L (24 transceivers at full utilization, 337k LE at ~70% toggle rate) can dissipate 20-30 W. At 40 x 40 mm with 1517 balls, the exposed pad (EP) thermal pad must be soldered to a multi-layer PCB with a continuous ground/power plane and at least 16 thermal vias under the EP for low theta-JA. Without this, the junction temperature can quickly exceed the 100C industrial limit. Use the Stratix III PowerPlay Early Power Estimator before PCB layout.
For 6.375 Gbps transceiver channels, route differential pairs with 100 ohm differential impedance and keep lengths matched to within 150 mil across a pair. Use an 8-12 layer PCB stack-up with separate stripline layers for TX and RX, and isolate the transceiver channels from noisy digital traces by at least 3W line spacing. Reference the AN 517: Stratix III Transceiver Signal Integrity application note for the full checklist.
The EP3SL340F1517I4L requires multiple supply rails (VCCINT core, VCCIO for I/O banks, VCCA_PLL, VCCBAT for battery-backed security keys, VCC_PGM for configuration). Decouple each rail with a 0.1 uF X7R capacitor per 3-4 power pins plus bulk 47-220 uF tantalum or polymer caps. Power sequencing is critical - VCCINT must reach its threshold before VCCIO ramps or the device may latch up. Follow the Stratix III Handbook Pin Connection Guidelines for the exact sequence.
Configuration mode selection (AS, AP, PS, FPP) is set by MSEL pins - tie them directly to VCCIO or GND with no pull-up/down resistors. JTAG pins (TCK, TMS, TDI, TDO) must be pulled according to the configuration scheme: TCK pulled low through 1 kohm, TMS pulled high through 1-10 kohm. Unused user I/Os should be left floating unless configured as output - the Stratix III can tolerate tri-stated unused I/Os without external termination.
Do not confuse the L suffix (low-power transceiver variant) with the N suffix (standard transceiver variant, no L). The L variant's transceivers may have slightly reduced reach or jitter performance at extreme temperatures. Also, the I4L speed grade is industrial-grade with low-power transceivers - for fastest Fmax, use the C2L or C2N speed grades, but be aware that commercial temperature grade is only 0C to +85C junction. Misordering the speed grade is the most common procurement error for this part.
규정 준수 정보
RoHS and lead-free per Intel FPGA RoHS compliance statement. AEC-Q100 not applicable (this is an FPGA, not an automotive-grade IC). Halogen-free status not explicitly stated in the verified web data. Intel is a member of the RMI Conflict-Free Smelter Program.
