EP4CE15E22I8L - 15,408-Cell Cyclone IV E FPGA | Intel
부품 번호: EP4CE15E22I8L ✓ 활성EP4CE15E22I8L 개요
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor that combines programmable logic elements, memory, and input/output resources on one device. An FPGA belongs to the programmable-logic hierarchy, above basic logic gates and below application-specific programmable controllers. Cyclone IV E devices provide a platform for implementing parallel data paths, protocol bridges, control logic, signal acquisition, and general-purpose digital systems.
The EP4CE15E22I8L provides 15,408 logic elements and 81 I/O in the 144-LQFP exposed-pad package. The listed device information identifies the supply voltage as 1.2 V. Its 81-I/O count is useful for systems requiring numerous digital connections without moving to a larger ball-grid-array package. The exposed pad supports improved thermal transfer when the board provides suitable copper and thermal-via coverage.
Within the Cyclone IV E family, the EP designation identifies the device family, while the numerical portion of the MPN identifies its resource level. The I8L suffix selects the listed package, temperature, and speed-related ordering configuration. Exact programming, timing, and pin-assignment decisions must be based on the device pin list and the Intel Quartus design flow used for the completed design.
Typical applications include industrial control, instrumentation, communications interfaces, data-acquisition systems, embedded control, and general-purpose digital logic. Its 81 available I/O can support parallel digital buses, status and control signals, memory interfaces, and peripheral connections when the selected board-level interface voltage is electrically compatible.
For a new PCB, preserve the exposed-pad land pattern, assign a solid ground or thermal pad according to the device guidance, and connect unused pins as directed in the pin-assignment tables. PCB signal-integrity and power-distribution design should also account for simultaneous switching across many I/O and the device’s 1.2 V core supply requirements.
This page consolidates the verified device identity, package details, resource figures, sourcing information, comparison constraints, and practical implementation guidance. It distinguishes directly confirmed Cyclone IV E variants from broader family devices whose logic-element and package differences prevent them from being treated as drop-in replacements.
드롭인 대체품: EP4CE15E22I8L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청EP4CE15E22I8L 최대 정격 & 전기적 특성
| Device Type | Cyclone IV E FPGA |
| Logic Elements | 15,408 logic elements |
| Logic Blocks | 47 logic blocks |
| I/O Count | 81 I/O |
| Embedded Memory | 270 Kbits |
| Multiplier Blocks | 55 multiplier blocks |
| PLLs | 11 PLLs |
| 공급 전압 | 1.2 V |
| Process Technology | 60 nm |
| 패키지 | 144-LQFP exposed pad |
| 핀 수 | 144 pins |
| 실장 유형 | Surface mount |
| Device Family | Cyclone IV E |
| Temperature Grade | Industrial grade |
| Programmable Logic Type | SRAM-based configurable logic |
EP4CE15E22I8L 144-lqfp exposed pad 핀 구성 가이드
EP4CE15E22I8L(144-lqfp exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE15E22I8L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE15E22I8L 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Data Acquisition and Signal Conditioning, Communications Protocol Bridging, Embedded Data Processing, Programmable Logic and Test Equipment, Instrumentation and Measurement Control.
Industrial Control and Automation
The EP4CE15E22I8L fits industrial controllers that coordinate sensors, actuators, interlocks, and machine-state logic in one programmable device. Its 15,408 logic elements provide substantial capacity for parallel control paths, while 81 I/O support discrete inputs, outputs, counters, and industrial-bus connections. The 1.2 V core supply and 144-LQFP exposed-pad package support compact control-board designs, although system qualification depends on enclosure temperature, grounding, and EMC design.
추천
Data Acquisition and Signal Conditioning
The EP4CE15E22I8L can implement the digital control and data-processing portion of a mixed-signal acquisition system. Its 15,408 logic elements are useful for parallel sampling coordination, filtering, triggering, timestamp capture, and communication formatting. The 270 Kbits of embedded memory, 55 multiplier blocks, and 11 PLLs add local storage and arithmetic resources. Interface voltage standards and acquisition-device timing must be checked independently before connecting external converters to this 1.2 V FPGA.
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Communications Protocol Bridging
The EP4CE15E22I8L is suitable for dual-protocol bridges, packetizers, and test equipment that must transform data between serial and parallel interfaces. Its 81 I/O can support multiple buses and control signals, while the logic elements accommodate framing, buffering, checksum generation, and state management. The 11 PLLs help derive interface clocks, and embedded memory provides local buffering. Pin-level protocol timing, I/O standards, and signal-integrity requirements must be confirmed in the final design.
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Embedded Data Processing
The EP4CE15E22I8L can implement parallel datapaths, digital filters, counters, and embedded control functions without relying on a separate processor for every function. Its 15,408 logic elements, 55 multiplier blocks, 270 Kbits of embedded memory, and 11 PLLs provide a balanced resource mix for fixed-function digital processing. The 144-LQFP exposed-pad package also simplifies expansion beyond complex ball-grid-array devices, while a 60 nm Cyclone IV E design can be combined with external memory when larger buffers are required.
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Programmable Logic and Test Equipment
The EP4CE15E22I8L can serve as the programmable control core in automated test equipment, interface fixtures, and pattern generators. Its 81 I/O allow direct connection to scan chains, relay-control signals, status inputs, and data buses, while the logic elements implement sequencing and pattern logic. Embedded memory and multipliers support local data manipulation, and PLLs support multiple clock domains. For high-speed analog or mixed-signal paths, add dedicated converters and preserve controlled routing and grounding across the FPGA and analog sections.
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Instrumentation and Measurement Control
The EP4CE15E22I8L is suitable for programmable instrumentation front ends that need deterministic digital control, calibration tables, status reporting, and communication. Its 15,408 logic elements can implement sequencers and correction algorithms, while the 81 I/O support sensor inputs, relay or switch control, displays, and isolated communication links. The exposed-pad package promotes thermal transfer on the PCB, but accuracy in analog measurement systems still depends on separate converter precision, reference quality, isolation, calibration, and careful power-ground partitioning.
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추천 제품 요약
엔지니어링 참조 데이터: EP4CE15E22I8L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 |
|---|---|
| Package | 144-LQFP exposed pad |
| Brand | Intel |
| Device Family | Cyclone IV E |
| Logic Elements | 15,408 logic elements |
| Logic Blocks | 47 logic blocks |
| I/O Count | 81 I/O |
| Embedded Memory | 270 Kbits |
| Multiplier Blocks | 55 multiplier blocks |
| PLLs | 11 PLLs |
| Supply Voltage | 1.2 V |
| Process Technology | 60 nm |
주요 차별점
- Higher logic capacity than the smaller EP4CE10 family option (vs EP4CE10E22I7N)
- Substantially more logic capacity than the EP4CE6 family option (vs EP4CE6E22C8)
- 81-I/O integration in a 144-LQFP exposed-pad package (vs EP4CE10E22I7N)
설계 노트
Use the manufacturer’s 144-LQFP exposed-pad land pattern without changing pad dimensions or solder-mask clearances. Connect the exposed pad to the specified ground plane and provide thermal vias or copper paths that carry heat away from the device. Keep the exposed-pad area free of unintended voids because it is the primary thermal path from the 60 nm FPGA into the PCB.
Plan the 1.2 V core rail and all bank supplies separately according to the device power architecture. Place bulk and high-frequency decoupling close to the associated power pins, use a low-impedance distribution structure, and avoid sharing return paths with noisy switching converters. Verify voltage tolerances, sequencing requirements, and power-up behavior against the manufacturer’s electrical tables before schematic release.
Assign I/O standards from the actual board voltage plan and inspect each external interface for edge-rate, capacitive-loading, and return-path concerns. With 81 I/O available, simultaneous switching can affect power and ground integrity even when the logic design is correct. Route clocks separately, provide solid reference planes, control edge rates where appropriate, and evaluate the most demanding interfaces with the target external devices and PCB stack-up.
Do not substitute another Cyclone IV E device solely because its family name and package appear similar. Validate the exact pin list, bank supplies, I/O standards, embedded-memory resources, multiplier count, PLLs, timing grade, configuration method, and Quartus device support. A smaller EP4CE10 or EP4CE6 variant can lack the logic, I/O, or memory capacity required by a design even when it appears electrically related.
규정 준수 정보
Compliance attributes were not established for this exact MPN. The industrial-grade ordering designation does not by itself establish AEC-Q100 qualification.