EP4CE22E22I7N - 22K-LE Cyclone IV E FPGA | Intel
부품 번호: EP4CE22E22I7N ✗ 단종EP4CE22E22I7N 개요
A field-programmable gate array, or FPGA, is a reconfigurable digital semiconductor. Unlike a fixed-function application-specific integrated circuit, an FPGA combines programmable logic blocks, embedded RAM, and programmable I/O into a device whose behavior can be defined after manufacture. Within the product hierarchy, the EP4CE22E22I7N belongs to the Cyclone IV E FPGA family and the broader FPGA and CPLD category. Its 144-lead LQFP package supports compact, surface-mount PCB integration while exposing a substantial central resource array for mid-complexity designs.
The E22 device designation identifies a Cyclone IV E resource configuration built around 22,320 logic elements. This density allows designers to implement parallel data paths, control logic, communication interfaces, and state machines in one programmable device. The device also contains 47 logic blocks and 608,256 bits of RAM, providing on-chip storage for buffers, lookup tables, packet data, and other working memory. The 1.2 V core supply supports integration into modern low-voltage digital systems.
The 144-LQFP exposed-pad package is significant both electrically and thermally. Its exposed pad must be connected to the appropriate power and ground structure on the PCB, following the manufacturer’s package guidance. Because an FPGA combines many programmable logic and memory resources in a compact area, careful power-distribution-network design, thermal management, and signal-integrity practices are essential for reliable operation.
Typical applications include industrial control and automation, communications infrastructure, test and measurement equipment, embedded instrumentation, sensor-processing modules, and general-purpose digital prototyping. The programmable architecture allows product revisions and field configuration changes without changing the PCB layout. In a control system, for example, the FPGA can implement multiple digital interfaces and real-time data-processing channels in parallel rather than dividing the workload among several fixed-function processors.
For a new design, engineers should select the correct Quartus device and pin-assignment package files, confirm the board’s supply and I/O design against the device documentation, and complete timing and thermal analysis before release. The exact operating-temperature, I/O-standard, speed-grade, and power specifications for this ordering code must be taken from the manufacturer’s ordering-part-number information and Cyclone IV device documentation.
This page consolidates the verified device identity, package information, resource counts, supply voltage, manufacturer documentation, strict same-package alternatives, and practical integration guidance. It distinguishes confirmed parameters from details that require package-specific verification so procurement and engineering teams can assess the EP4CE22E22I7N efficiently.
드롭인 대체품: EP4CE22E22I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE22E22I7N (동일 폼 팩터 및 풋프린트) — 차이점: Device Type, Logic Elements, Package.
EP4CE22E22A7N
✅ 드롭인가격 문의
데이터시트 보기 →EP4CE22E22C6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4CE22E22C7N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP4CE22E22C8N
✅ 드롭인 ⚠️ 사양 미검증가격 문의
데이터시트 보기 →EP4CE22E22I6N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EP4CE22E22I7N 최대 정격 & 전기적 특성
| Device Type | Field Programmable Gate Array (FPGA) |
| FPGA Family | Cyclone IV E |
| Device Designation | E22 |
| Logic Elements | 22,320 LE |
| Logic Blocks | 47 blocks |
| Embedded Memory | 608,256 bits |
| Core Supply Voltage | 1.2 V |
| Package Type | 144-LQFP Exposed Pad |
| Total Pins | 144 pins |
| 실장 유형 | Surface Mount |
| Programming Technology | Reconfigurable SRAM-based FPGA architecture |
EP4CE22E22I7N 144-lqfp exposed pad 핀 구성 가이드
EP4CE22E22I7N(144-lqfp exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE22E22I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE22E22I7N 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Communications Interface Consolidation, Test and Measurement Instrumentation, Embedded Sensor Processing, Digital Prototyping and Education, Industrial Networking Gateway.
Industrial Control and Automation
The EP4CE22E22I7N fits programmable machine-control systems that require several deterministic digital channels on one device. Its 22,320 logic elements can implement state machines, interlocks, sequencing logic, and interface bridges, while 608,256 bits of embedded memory can support counters, data buffers, and lookup functions. The 1.2 V core supply fits modern control electronics, and the 144-LQFP exposed-pad package permits a conventional surface-mount layout. The exposed pad and power network must follow the manufacturer package guidance, while every external I/O voltage must be checked against the selected bank and device limits before schematic approval.
추천
Communications Interface Consolidation
The EP4CE22E22I7N is suitable for communication equipment that must combine parallel data handling, protocol conversion, and buffering in a compact FPGA. Its 47 logic blocks and 22,320 logic elements can support multiple parallel data paths, while 608,256 bits of embedded memory can provide transmit and receive buffering. The 144-LQFP exposed-pad package reduces board-space requirements relative to larger FPGA packages, but high-speed interfaces still require disciplined trace routing, controlled impedance, and a power-distribution network designed for simultaneous switching activity.
추천
Test and Measurement Instrumentation
The EP4CE22E22I7N can implement timing, sequencing, data capture, and stimulus-control functions within modular test equipment. The 22,320 logic elements allow multiple measurement channels or a sophisticated control pipeline to share one programmable device, while 608,256 bits of embedded memory can be allocated to sample buffers and intermediate results. Its 1.2 V core operation supports contemporary mixed-signal test boards, although analog front ends, high-speed I/O standards, clocking, calibration, and external memory interfaces must be designed as separate blocks around the FPGA.
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Embedded Sensor Processing
The EP4CE22E22I7N is appropriate for sensor nodes that perform filtering, feature extraction, event detection, or local data reduction before transmitting results. Parallel FPGA logic can process several sensor channels concurrently, and the 608,256-bit embedded-memory capacity can hold recent samples or intermediate vectors. The compact 144-LQFP exposed-pad package supports integration into embedded control boards, but sensor analog sections, I/O voltage domains, clock accuracy, and low-power operating modes should be evaluated independently from the core resource specification.
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Digital Prototyping and Education
The EP4CE22E22I7N provides a practical platform for FPGA education, digital design prototypes, and algorithm demonstrations because the E22 device combines 22,320 logic elements with 608,256 bits of embedded memory in a widely used surface-mount package. Students and engineers can implement processors, finite-state machines, filters, and peripheral interfaces while retaining sufficient logic and memory capacity for nontrivial demonstrations. Quartus compilation, board-level constraints, and pin assignments must match the exact device and package, and the exposed pad should be connected according to the manufacturer layout guidance.
추천
Industrial Networking Gateway
The EP4CE22E22I7N can serve as the programmable control element in a compact industrial networking gateway, where it may implement frame classification, protocol conversion, command parsing, and status monitoring. Its 47 logic blocks and 22,320 logic elements allow parallel handling of data paths, while embedded memory can support packet buffering. The 144-LQFP exposed-pad package simplifies board integration, although Ethernet or other high-speed interfaces require validated I/O standards, controlled-impedance routing, clocking, isolation requirements, and an EMC-conscious power and grounding strategy.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE22E22I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE22E22A7N | EP4CE22E22C6 | EP4CE22E22C7N | EP4CE22E22C8N | EP4CE22E22I6N |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad |
| FPGA Family | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E | Cyclone IV E |
| Logic Elements | 22,320 LE | 22,320 LE | 22,320 LE | 22,320 LE | 22,320 LE | 22,320 LE |
| Logic Blocks | 47 blocks | 47 blocks | 47 blocks | 47 blocks | 47 blocks | 47 blocks |
| Embedded Memory | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits | 608,256 bits |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Pin Count | 144 pins | 144 pins | 144 pins | 144 pins | 144 pins | 144 pins |
| Ordering-Suffix Difference | I7N | A7N; different grade or qualification suffix | C6; one speed-grade step lower than -7 | C7N; same numeric speed grade with a different suffix | C8N; one speed-grade step higher than -7 | I6N; one speed-grade step lower than -7 |
주요 차별점
- Matches the E22 resource configuration without reducing logic or memory capacity (vs EP4CE22E22A7N)
- Directly comparable ordering variants retain the same exposed-pad LQFP footprint (vs EP4CE22E22C6)
- Provides the same core resource density with a selectable same-family speed-grade variant (vs EP4CE22E22C8N)
- Uses a 1.2 V core supply and a 144-pin surface-mount package (vs EP4CE22E22I6N)
설계 노트
Build the power network around the 1.2 V core requirement and the separate I/O supply domains listed for the exact ordering code. Place decoupling capacitance at the device supply pins according to the manufacturer layout guidance, connect the exposed pad to the intended ground structure, and reserve copper area for current return paths. Estimated power depends on logic utilization, clocking, I/O activity, voltage, and temperature, so complete a Quartus power estimate before choosing regulators and copper geometry.
Treat the 144-LQFP exposed pad as a mandatory thermal and electrical connection. Use the package drawing and land pattern to determine pad geometry, vias, solder-process requirements, and the permitted connection arrangement. A calculated junction-temperature rise is not possible without the exact power dissipation and board thermal data; after those inputs are known, compare the calculated junction temperature with the device limit and revise copper, via count, airflow, or placement if necessary.
Assign signals with the Quartus device and package files for EP4CE22E22I7N, then constrain clocks, high-speed interfaces, and external memory buses before releasing PCB routing. Maintain continuous return paths beneath high-speed signals, avoid routing over split power or ground planes, and apply the manufacturer’s guidance for simultaneous-switching-noise-sensitive pins. Validate the final escape routing around the 144-LQFP package and confirm that assembly clearances remain compatible with the selected exposed-pad footprint.
Do not treat identical logic counts as proof that every EP4CE22 suffix is interchangeable. The target uses the I7N ordering code, while listed alternatives use A7N, C6, C7N, C8N, or I6N suffixes that can change speed grade, temperature range, or other qualification details. Before substitution, compare the complete ordering table, timing specifications, operating-temperature limits, power behavior, and lifecycle status, then recompile the design and repeat post-layout timing analysis.
규정 준수 정보
The available device pages confirm the family, resource configuration, supply voltage, and package but do not state the compliance status for this ordering code. Verify RoHS, REACH, AEC-Q100 qualification, lead-free, halogen-free, and conflict-minerals declarations against the manufacturer declaration or product documentation before qualification.