Intel

EP4CE40F29C6N - Cyclone IV E FPGA 39.6K LE | Intel | 780-BGA

부품 번호: EP4CE40F29C6N ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
1.2 V (internal regulated) Vdss 780-ball FBGA (F29) Package 6 Speed 1,161,216 Memory
시작가 $77.51 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-09
볼륨 가격
수량 단가 합계
1 $129.19 $129.19
10 $116.27 $1,162.70
100 $103.35 $10,335.00
500 $90.43 $45,215.00
1,000 $77.51 $77,510.00
ℹ️ 모든 가격은 USD 기준입니다

EP4CE40F29C6N 개요

The Intel (formerly Altera) EP4CE40F29C6N is a Cyclone IV E Field Programmable Gate Array (FPGA) with 39,600 logic elements, 1,161,216 bits of embedded memory, and 532 user I/Os, packaged in a 780-ball FineLine BGA (F29) at commercial 0°C–85°C temperature grade with speed grade 6. It is a member of the low-cost, low-power Cyclone IV E family built on a 60 nm process.

What is an FPGA? A Field Programmable Gate Array is a digital semiconductor containing an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as memory blocks, DSP blocks, PLLs, and SERDES. FPGAs sit in the programmable-logic tier of the broader digital-semiconductor hierarchy: ASIC < FPGA < programmable SoC < microprocessor. The Cyclone IV E family was engineered for cost-sensitive, high-volume applications that previously used ASICs or CPLDs.

Key features of the EP4CE40F29C6N include 39,600 logic elements arranged into 4-input adaptive logic modules (ALMs), 4 M9K embedded memory blocks (113 blocks total) totaling 1,161,216 RAM bits, 66 18x18 hardware multipliers, four general-purpose PLLs, and 532 maximum user I/Os. The 780-BGA (F29) package provides the highest I/O count and largest pin pitch of the EP4CE40 family, suitable for high-density board designs.

Architecturally, the Cyclone IV E device uses a 1.2 V core supplied by an on-die linear regulator. Configuration is via serial (AS) flash, JTAG, or passive serial. Static power consumption is among the lowest in its class, and the device supports hot-socketing and octal configuration modes. The 60 nm TSMC process allows operation down to 1.0 V core with internal regulation.

Typical applications include industrial motor control and machine vision, automotive infotainment prototypes, video processing and display controllers, communications line cards, software-defined radio front-ends, and ASIC prototyping. The wide logic and DSP capacity also make it useful for embedded data acquisition and DSP co-processing.

Designers should plan FPGA power sequencing with the 1.2 V core supply ramped first and the I/O banks following, follow Altera's recommended decoupling scheme, and use the Quartus II/Prime toolchain for place-and-route.

This page consolidates Cyclone IV E pricing, drop-in FPGA alternatives, and design notes that complement the official datasheet.

드롭인 대체품: EP4CE40F29C6N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE40F29C6N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Configuration Modes.

Intel
Operating Temperature: 0C to +85C (Commercial, C7 speed grade)
Process Technology: 60 nm (TSMC low-power)
Configuration Modes: Passive Serial, Active Serial, JTAG
비교 대상: EP4CE40F29C6N →
Altera
Operating Temperature: 0 C to +85 C (Commercial)
Speed Grade: -7
Process Technology: 60 nm
비교 대상: EP4CE40F29C6N →
Intel
Package: 780-ball FBGA
Speed Grade: C8
Process Technology: 60 nm low-power
비교 대상: EP4CE40F29C6N →
Intel
Package: 780-ball FBGA (F29), 23x23 mm, 1.0 mm pitch
Operating Temperature: 0C to +85C (commercial, per speed-grade suffix)
Speed Grade: C8 (commercial, slowest)
비교 대상: EP4CE40F29C6N →
Altera
Process Technology: 60 nm
비교 대상: EP4CE40F29C6N →
Altera
Package: 780-ball FBGA (FineLine BGA)
Speed Grade: -9 (fastest)
Process Technology: 60 nm low-power CMOS
비교 대상: EP4CE40F29C6N →
Altera
Operating Temperature: -40 C to +100 C (industrial)
Speed Grade: 7
Process Technology: 60 nm (low-power)
비교 대상: EP4CE40F29C6N →
Intel
Package: 780-ball FBGA (29 mm x 29 mm)
Operating Temperature: Commercial (0C to +85C)
Process Technology: 60 nm (low-power)
비교 대상: EP4CE40F29C6N →
Intel
Package: 780-BGA (FBGA-780), 29 x 29 mm, 1.0 mm pitch
Process Technology: 60 nm low-power
비교 대상: EP4CE40F29C6N →

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

EP4CE40F29I7N

✅ 드롭인
Altera
📦 780-ball FBGA (F29)
Cyclone IV E · 39,600 · 1,161,216 · 126 · 116 · 532 · 4 · 20

✓ 재고 있음

$124 / 개

데이터시트 보기 →

EP4CE40F29C7N

✅ 드롭인
Altera
📦 780-ball FBGA (F29)
Cyclone IV E · 39,600 · 1,161,216 · 270 · 116 · 4 · 532 · 8

✓ 재고 있음

$55.85 / 개

데이터시트 보기 →

EP4CE40F29C8N

✅ 드롭인
Altera
📦 780-ball FBGA (F29)
Cyclone IV E · 39,600 · 1,161,216 bits · 116 · 532 · 4

✓ 재고 있음

$104.6 / 개

데이터시트 보기 →

EP4CE30F29C7N

✅ 드롭인
📦 780-ball FBGA (F29)
Smaller die - 28,848 LE vs 39,600 (-27%); same F29 780-ball footprint, same family, drop-in with reduced capacity

📋 참조 대체품 (카탈로그에 없음)

EP4CE55F29C6N

✅ 드롭인
Intel
📦 780-ball FBGA (F29)
Cyclone IV E · 55,856 · 3491 · 239,6160 · 374 · 472.5 MHz · 4 · 20

✓ 재고 있음

$49.95 / 개

데이터시트 보기 →

EP4CE40F29C6N 최대 정격 & 전기적 특성

Family Cyclone IV E
Logic Elements 39,600
Embedded Memory (bits) 1,161,216
Embedded Memory Blocks 113 M9K blocks
18x18 Hardware Multipliers 66
PLLs 4 general-purpose
Maximum User I/Os 532
패키지 780-ball FBGA (F29)
Process Node 60 nm
Core Voltage 1.2 V (internal regulated)
동작 온도 0°C to +85°C (commercial)
Speed Grade 6
Configuration Modes Serial, JTAG, Passive Serial, AS
실장 유형 Surface Mount
MSL 레벨 3
RoHS 상태 Compliant

EP4CE40F29C6N 780-ball fbga (f29) 핀 구성 가이드

EP4CE40F29C6N(780-ball fbga (f29) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

EP4CE40F29C6N의 780-ball fbga (f29) 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: EP4CE40F29C6N.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

EP4CE40F29C6N 적합 용도: 7 애플리케이션s: Industrial Motor Control, Machine Vision and Video Processing, Software-Defined Radio Front-End, ASIC Prototyping, Communications Line Cards, Embedded Data Acquisition and DSP Co-Processing, Automotive Infotainment Prototyping.

🏭

Industrial Motor Control

The EP4CE40F29C6N is well suited to industrial motor-control applications where multiple encoder interfaces, PWM generators, and PID control loops must run deterministically. Its 66 dedicated 18x18 hardware multipliers enable real-time field-oriented control (FOC) algorithms without taxing the fabric, while 113 M9K memory blocks (1.16 Mbit) hold commutation tables and current-loop state. The 532 user I/Os of the F29 package accept many simultaneous quadrature-encoder and resolver channels, and the commercial 0–85°C grade covers most factory-floor enclosures.

🎥

Machine Vision and Video Processing

With 39,600 logic elements and 66 hardware multipliers, the EP4CE40F29C6N can perform real-time pixel processing, color-space conversion, and edge detection for industrial camera pipelines. The 1.16 Mbit of embedded memory buffers line-scan data at typical Camera Link rates, while 532 I/Os let designers parallel-route multiple MIPI-CSI2 or LVDS sensor lanes directly into the F29 BGA. Quartus IP for VIP and Video Bridging accelerates integration with external image sensors.

🌐

Software-Defined Radio Front-End

The EP4CE40F29C6N's 66 18x18 hardware multipliers and four general-purpose PLLs make it a flexible baseband processor for software-defined radio (SDR) front-ends below 100 MHz bandwidth. Designers implement digital down-conversion, filtering, and demodulation in fabric while the PLLs synthesize the local-oscillator and sampling clocks. The large F29 BGA exposes enough LVDS pairs to interface directly with ADC eval boards, and the 1.16 Mbit embedded RAM holds sample buffers for short bursts.

🖥️

ASIC Prototyping

The 39,600 logic elements, 1.16 Mbit memory, and 66 multipliers of the EP4CE40F29C6N make it a cost-effective vehicle for prototyping mid-complexity ASICs. Designers map RTL from the target ASIC, run real-world firmware, and validate I/O behavior before committing to silicon. The F29 780-BGA exposes enough user I/Os to mirror most ASIC signal pads, and the same die scales within the Cyclone IV E family (EP4CE55, EP4CE75, EP4CE115) for design exploration.

📡

Communications Line Cards

Telecom line-card designs leverage the EP4CE40F29C6N for glue logic, TDM switching, and SERDES-adjacent protocol conversion where deterministic latency matters. The four PLLs synthesize independent clock domains for backplane, framer, and processor interfaces, while 532 I/Os of the F29 package accommodate parallel TDM buses, SPI/parallel peripheral buses, and management interfaces. Quartus IP for UTOPIA / Serial RapidIO eases integration with legacy line-card ASICs.

📊

Embedded Data Acquisition and DSP Co-Processing

The 66 hardware multipliers of the EP4CE40F29C6N deliver up to ~250 MHz of 18x18 multiply-accumulate throughput, ideal as a DSP co-processor beside a microcontroller or ARM host. The 1.16 Mbit of embedded memory stores FIR/IIR coefficient banks and circular sample buffers, while the 532 I/Os expose parallel ADC/DAC buses and SPI/I2C control. The Cyclone IV E family is supported by the Quartus II / Quartus Prime toolchain with mature DSP Builder integration.

🚗

Automotive Infotainment Prototyping

Designers prototype CAN/LIN bridging, LVDS display pipelines, and audio-routing fabrics on the EP4CE40F29C6N before committing to an automotive-grade ASIC. The 39,600 logic elements handle multiple display layers and audio mixers simultaneously, while 113 M9K memory blocks provide frame-buffer storage. Although the EP4CE40F29C6N is commercial 0–85°C, the same die is offered in industrial (EP4CE40F29I7N) for cabin environments and validated through Intel's automotive FPGA program.

What are the logic elements and memory resources of EP4CE40F29C6N?
The EP4CE40F29C6N integrates 39,600 logic elements built from 4-input adaptive logic modules, 113 M9K embedded memory blocks totaling 1,161,216 RAM bits, and 66 dedicated 18x18 hardware multipliers. According to the Cyclone IV E Device Handbook, this places it in the mid-density tier of the family, suitable for mid-range DSP and control applications.
How many user I/Os does EP4CE40F29C6N provide?
The EP4CE40F29C6N provides up to 532 user I/Os across 8 I/O banks in the 780-ball FBGA (F29) package. The F29 package is the largest in the EP4CE40 family and offers the highest I/O count, making it suitable for high-density board designs where many LVDS, LVCMOS, or memory interfaces are required.
What is the operating temperature range of EP4CE40F29C6N?
The EP4CE40F29C6N operates across 0°C to +85°C, which corresponds to the commercial temperature grade per the Cyclone IV E ordering code. For industrial -40°C to +100°C operation, the corresponding order code is the I-suffix variant (for example EP4CE40F29I7N).
Where can I buy EP4CE40F29C6N online?
The EP4CE40F29C6N is in stock at DigiKey (sku 2288400), Mouser, Arrow, LCSC, Heisener, and Octopart as of 2026-09-10. Pricing varies by quantity; LCSC quotes approximately USD 32.92 per unit at low volume, while Heisener lists USD 129.19 with lead-time can-ship-immediately. Authorized distributors provide traceable stock.
What is the price of EP4CE40F29C6N?
The EP4CE40F29C6N unit price is approximately USD 129.19 at qty 1 from Heisener, USD 32.92 from LCSC, and varies across authorized channels as of 2026-09-10. Bulk pricing drops below USD 80 per unit at qty 1000. Always request a current distributor quote because FPGA pricing fluctuates with wafer allocation.
Is EP4CE40F29C6N in stock and what is the lead time?
The EP4CE40F29C6N is currently listed in stock at LCSC (C1550641), DigiKey, Mouser, Arrow, and Heisener as of 2026-09-10. Heisener explicitly states Can Ship Immediately with estimated delivery 2026-06-03 to 2026-06-08 (already in the past, treat as immediate from the source timestamp). Octopart aggregates real-time stock across distributors.
EP4CE40F29C6N vs EP4CE30F29C6N - which is better for high-density logic?
The EP4CE40F29C6N has 39,600 logic elements, 113 M9K blocks (1.16 Mbit), and 66 multipliers, while the EP4CE30F29C6N has 28,848 logic elements, 66 M9K blocks (594 Kbit), and 66 multipliers. Choose EP4CE40F29C6N when you need the higher LE count and 95% more embedded memory; both share the same F29 780-BGA package.
EP4CE40F29C6N vs EP4CE115F29C8N - which is better for high-volume designs?
The EP4CE115F29C8N has 114,480 logic elements and 3.9 Mbit of memory in the same F29 780-BGA package as the EP4CE40F29C6N (which has 39,600 LE / 1.16 Mbit). For designs that fit within 39,600 LE, the EP4CE40F29C6N is the more cost-effective choice. EP4CE115F29C8N is the right selection for higher-density applications.
When should I choose EP4CE40F29C6N over EP4CE55F29C6N?
Choose the EP4CE40F29C6N for cost-sensitive designs that fit within 39,600 logic elements and 1.16 Mbit of embedded memory. Choose the EP4CE55F29C6N (55,856 LE / 2.34 Mbit) when you need roughly 41% more logic capacity while staying in the same F29 780-BGA footprint. Both use identical Quartus toolchains.
What is the best drop-in replacement for EP4CE40F29C6N?
The closest drop-in replacement for the EP4CE40F29C6N in the same F29 780-BGA package is the industrial-temperature EP4CE40F29I7N, which has identical logic, memory, multiplier, and PLL counts but supports -40°C to +100°C. Another drop-in is the faster speed grade EP4CE40F29C7N, identical in resources but with higher performance.
Can I use EP4CE40F23C6N as a drop-in replacement for EP4CE40F29C6N?
No. The EP4CE40F23C6N uses a 484-ball FBGA (F23) package, not the F29 780-ball package, so it is NOT a drop-in for the EP4CE40F29C6N. The two parts share the same die but have different ball maps and I/O counts (EP4CE40F23C6N: 328 user I/Os vs EP4CE40F29C6N: 532 user I/Os). Board layout requires a redesign.
Where to download EP4CE40F29C6N datasheet PDF?
The official Cyclone IV E datasheet is published by Intel at the Altera product page (altera.com/products/fpga/cyclone/iv/e/ep4ce40-f29/EP4CE40F29C6N). The same document is mirrored on datasheets.com and on the Intel FPGA support portal under the Cyclone IV E Device Handbook, which includes pinout, DC characteristics, and timing specifications.
Where to find EP4CE40F29C6N pinout?
The full pinout for the EP4CE40F29C6N (780-ball F29 package) is published in the Cyclone IV E Device Handbook, Pin Information section, and in the dedicated EP4CE40 Pin Table file on the Intel/Altera support site. Ball assignments are also embedded in the Quartus II / Quartus Prime pin planner for the F29 device variant.
Is the EP4CE40F29C6N the same as EP4CE40F29C7N?
No. Both are the same die in the same F29 780-ball package and same commercial 0°C–85°C grade, but they differ in speed grade: EP4CE40F29C6N is speed grade 6, while EP4CE40F29C7N is speed grade 7 (faster Fmax). Pin-to-pin and parametrically they are drop-in compatible except for the speed improvement.
What are the key specifications of EP4CE40F29C6N that engineers should know?
The EP4CE40F29C6N integrates 39,600 logic elements, 1,161,216 RAM bits across 113 M9K blocks, 66 18x18 multipliers, 4 PLLs, and 532 user I/Os. It uses a 60 nm process with 1.2 V internal core regulation, supports serial/JTAG/AS configuration, and operates 0°C–85°C commercial. Package: 780-ball F29 FBGA, speed grade 6.

엔지니어링 참조 데이터: EP4CE40F29C6N — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose EP4CE40F29C6N when you need 39,600 logic elements and 1.16 Mbit of embedded memory in a 780-ball F29 FBGA at the lowest commercial-grade cost. For industrial temperature (–40°C to +100°C) with identical resources, choose EP4CE40F29I7N. For higher Fmax at the same density, choose EP4CE40F29C7N (speed grade 7) or EP4CE40F29C8N (speed grade 8). For cost-reduced designs that fit within ~28k LE, choose EP4CE30F29C7N. For higher capacity (55,856 LE / 2.34 Mbit), choose EP4CE55F29C6N - all five alternatives share the same F29 780-ball footprint, enabling reuse of PCB land pattern and Quartus pin assignments.

대체품과의 비교

파라미터 이 제품 EP4CE40F29I7N EP4CE40F29C7N EP4CE40F29C8N EP4CE30F29C7N EP4CE55F29C6N
Package 780-ball FBGA (F29) 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same 780-ball FBGA (F29) - same
Brand Intel (formerly Altera) Intel - same Intel - same Intel - same Intel - same Intel - same
Logic Elements 39,600 39,600 (same die) 39,600 (same die) 39,600 (same die) 28,848 (-27%) 55,856 (+41%)
Embedded Memory (bits) 1,161,216 1,161,216 1,161,216 1,161,216 608,256 (-48%) 2,343,936 (+102%)
18x18 Multipliers 66 66 66 66 66 156
User I/Os 532 532 532 532 532 532
Speed Grade 6 7 7 8 (fastest) 7 6
Temperature Grade Commercial 0C to +85C Industrial -40C to +100C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C Commercial 0C to +85C

주요 차별점

  • Same F29 780-ball footprint as the rest of the EP4CE40/30/55 family (vs EP4CE40F23C6N)
  • Mid-density Cyclone IV E with 1.16 Mbit embedded memory (vs EP4CE30F29C7N)
  • Speed grade 6 with Quartus Prime support (vs EP4CE40F29C8N)

설계 노트

Cyclone IV E devices derive their 1.2 V core from an internal linear regulator powered by VCCINT. The regulator requires a 0.1 uF decoupling capacitor as close as physically possible to the VCCINT pins, plus a bulk 4.7 uF–22 uF tantalum or ceramic capacitor. Estimated: VCCINT current for the EP4CE40F29C6N at full utilization is roughly 500–800 mA; design the 3.3 V VCCIO supply with at least 1 A headroom if many I/O banks toggle simultaneously.

The 780-ball F29 FBGA uses a 1.0 mm ball pitch. Route all signals on inner layers with microvias (stacked or staggered) and escape the perimeter balls through the top layer. Use a 4–6 layer stack-up with continuous GND planes beneath the package for thermal spreading and return-path integrity. Follow Intel/Altera's recommended land pattern and via-in-pad guidelines for BGA fan-out.

Do not hot-plug JTAG or configuration signals without series resistors; the Cyclone IV E configuration pins are not 5 V-tolerant unless documented. Always program the configuration mode pins MSEL[3..0] correctly for the selected mode (AS, PS, JTAG, FPP) - misprogramming causes the device to fail configuration. Verify the AS configuration clock (DCLK) does not exceed 100 MHz and that the serial flash is rated for the read mode selected.

Estimated: at 100% resource utilization with 66 multipliers at 250 MHz, the EP4CE40F29C6N junction temperature can rise 15–25°C above ambient on a 4-layer JEDEC test board. For enclosed industrial enclosures, derate to 70% utilization or add a small heatsink / thermal via array under the package thermal pad. Use the Quartus PowerPlay early power estimator before PCB commit.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS and lead-free per Intel/Altera Cyclone IV E product page. AEC-Q100 not applicable (FPGA, not automotive-grade IC). Halogen-free status not explicitly stated in the provided data.

데이터 검증일: 2026-09-10 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

EP4CE40F29C6N EP4CE40F29C6N datasheet Intel Cyclone IV E FPGA EP4CE40 780 BGA FPGA Cyclone IV E 39600 logic elements EP4CE40F29C6N price buy EP4CE40F29C6N vs EP4CE55F29C6N EP4CE40F29C6N drop-in replacement Cyclone IV E F29 pinout low cost FPGA 40000 logic elements EP4CE40F29C6N industrial variant Cyclone IV E DSP motor control

관련 부품 & 용어

Intel Altera EP4CE40F29C6N EP4CE40 Cyclone IV E FPGA Field Programmable Gate Array programmable logic FineLine BGA FBGA logic element ALM adaptive logic module M9K memory block embedded memory 18x18 multiplier DSP block PLL phase-locked loop LVDS LVCMOS JTAG Quartus II Quartus Prime RoHS BGA-780 industrial temperature grade commercial temperature grade machine vision ASIC prototyping software-defined radio 60 nm process
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