EP4CE40F29I7 - Cyclone IV E FPGA, 39.6K LEs, 780-FBGA | Intel
부품 번호: EP4CE40F29I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145.96 | $145.96 |
| 10 | $138.5 | $1,385.00 |
| 100 | $124.85 | $12,485.00 |
| 500 | $108.4 | $54,200.00 |
| 1,000 | $96.2 | $96,200.00 |
EP4CE40F29I7 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing to implement custom digital logic functions. FPGAs sit within the broader hierarchy of programmable logic devices (PLDs) -> programmable logic ICs -> logic semiconductors. The Cyclone IV E family is Intel's lowest-power, lowest-cost FPGA line, optimized for high-volume, cost-sensitive applications such as industrial control, automotive driver assist, video processing, and wireless infrastructure.
Key features of the EP4CE40F29I7 include 39,600 logic elements, 4 PLLs, 116 embedded 9-bit multipliers, and 4 configuration schemes (Active Serial, Passive Serial, Fast Passive Parallel, and JTAG). The device supports up to 532 user I/O pins spread across 8 I/O banks and provides 1,161,216 bits (113.4 Kb) of embedded SRAM distributed across 252 M9K blocks. Each I/O bank supports a variety of I/O standards including LVDS, LVCMOS, LVTTL, SSTL, and HSTL.
The Cyclone IV E architecture uses 8-input adaptive logic modules (ALMs), a fine-grained routing fabric, and embedded memory blocks that can be configured as RAM, ROM, or FIFO. The 60 nm process and 1.2 V core supply keep total device power well below that of competing FPGAs in the same density class. Configuration is loaded via serial flash, JTAG, or a parallel interface, with built-in decompression support to reduce configuration time and flash footprint.
Typical applications for the EP4CE40F29I7 include industrial motor control, video bridging and display controllers, automotive infotainment and ADAS pre-processing, software-defined radio front-ends, and ASIC prototyping for low- to mid-complexity designs. The large number of I/Os and embedded multipliers also make it well suited to digital signal processing (DSP) implementations and high-speed parallel interfaces.
When designing with this device, ensure PCB layout can accommodate the 780-ball 1.0 mm pitch FBGA, and provide at least four PCB layers with continuous ground and power planes under the package. Intel's Quartus Prime design suite provides synthesis, place-and-route, timing analysis, and device programming. Configuration data should be stored in a serial NOR flash such as EPCS16 or EPCS64 to allow fast field upgrades.
This page synthesizes verified distributor pricing, drop-in pin-compatible alternatives in the same Cyclone IV E family, and practical Quartus design notes not found in the standalone datasheet.
드롭인 대체품: EP4CE40F29I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CE40F29I7 (동일 폼 팩터 및 풋프린트) — 차이점: Process Technology, Operating Temperature, Package, User I/O Count, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CE40F29I7N
✅ 드롭인✓ 재고 있음
$124 / 개
데이터시트 보기 →EP4CE40F29C8N
✅ 드롭인✓ 재고 있음
$104.6 / 개
데이터시트 보기 →EP4CE40F29C7
✅ 드롭인✓ 재고 있음
$73.52 / 개
데이터시트 보기 →EP4CE40F29C7N
✅ 드롭인✓ 재고 있음
$55.85 / 개
데이터시트 보기 →EP4CE40F29C8
✅ 드롭인✓ 재고 있음
$68 / 개
데이터시트 보기 →EP4CE40F29C8LN
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP4CE40F29C8L
✅ 드롭인✓ 재고 있음
$78.36 / 개
데이터시트 보기 →EP4CE40F29C9LN
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP4CE40F29I7 최대 정격 & 전기적 특성
| Family | Cyclone IV E |
| Logic Elements (LEs) | 39,600 |
| User I/Os | 532 |
| Embedded Memory (bits) | 1,161,216 |
| Embedded Memory (M9K blocks) | 252 |
| Embedded 18x18 Multipliers | 116 |
| PLLs | 4 |
| Global Clock Networks | 20 |
| Process Technology | 60 nm |
| Core Voltage | 1.2 V |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| 패키지 | 780-ball FBGA (F29) |
| Ball Pitch | 1.0 mm |
| Maximum Seated Height | 2.4 mm |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP4CE40F29I7 780-ball fbga (f29) 핀 구성 가이드
EP4CE40F29I7(780-ball fbga (f29) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CE40F29I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CE40F29I7 적합 용도: 6 애플리케이션s: Industrial Motor Control and Servo Drives, Video Bridging and Display Controllers, Automotive Infotainment and ADAS Pre-Processing, Software-Defined Radio Front-End Processing, ASIC Prototyping for Low- to Mid-Complexity Designs, Digital Signal Processing (DSP) Implementation.
Industrial Motor Control and Servo Drives
The EP4CE40F29I7 fits industrial motor control applications because its 116 embedded 18x18 multipliers accelerate Field-Oriented Control (FOC) and Space Vector PWM algorithms, while 4 PLLs provide the multi-domain clock synthesis needed to time encoder feedback, PWM carriers, and communication buses. The 39,600 LEs are sufficient for encoder interfaces, PID loops, current sense sampling, and EtherCAT/CANopen protocol state machines. With 532 user I/Os in the F29 780-FBGA package, the device can interface to multiple inverter stages simultaneously.
추천
Video Bridging and Display Controllers
The EP4CE40F29I7's 1.16 Mbit of embedded SRAM is ideal for line-buffer memory in video bridges, while 532 user I/Os allow parallel RGB, LVDS, and HDMI/DVI signaling across the 8 I/O banks. Its 116 hardware multipliers support real-time color space conversion (RGB to YCbCr), deinterlacing, and on-screen display compositing. Industrial temperature grade enables outdoor digital signage and automotive rear-seat entertainment displays.
추천
Automotive Infotainment and ADAS Pre-Processing
In automotive infotainment, the EP4CE40F29I7 provides the I/O density and DSP horsepower for camera aggregation, sensor fusion pre-processing, and LVDS display backplanes. Its 4 PLLs generate independent pixel clocks for multiple cameras and displays, while 116 18x18 multipliers implement edge-detection and noise-reduction kernels. Industrial temperature grade (-40C to +100C) suits cabin and under-hood environments, though AEC-Q100 qualification requires the dedicated automotive OPNs from Intel.
추천
Software-Defined Radio Front-End Processing
Software-defined radio front-ends benefit from the EP4CE40F29I7's 116 hardware 18x18 multipliers for digital down-conversion and FIR filtering, plus 1.16 Mbit of M9K memory for sample buffering between ADC and processor. The 4 PLLs derive multiple sample clocks from a common reference, and 532 user I/Os support parallel LVDS ADC interfaces and CPRI/OBSAI links. Industrial temp grade suits outdoor small-cell wireless infrastructure.
추천
ASIC Prototyping for Low- to Mid-Complexity Designs
For ASIC prototyping of designs up to roughly 5-8 million gates, the EP4CE40F29I7 offers 39,600 LEs that map cleanly to partitioned ASIC blocks, plus 532 I/Os to break out ASIC pins. The 60 nm Cyclone IV E architecture provides deterministic timing closure with Quartus Prime TimeQuest, and multiple EP4CE40F29I7 boards can be stitched via LVDS for larger ASIC prototypes. Industrial temperature grade suits verification across full operating range.
추천
Digital Signal Processing (DSP) Implementation
The EP4CE40F29I7's 116 dedicated 18x18 multipliers enable high-throughput DSP implementations including FIR filters, FFTs, and convolutional encoders at sample rates up to ~250 MHz. Combined with 1.16 Mbit of distributed M9K memory for coefficient and sample storage, the device is well suited to radar baseband, audio processing, and motor-control DSP pipelines. The industrial -40C to +100C temperature range supports deployment in harsh factory and outdoor environments.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CE40F29I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CE40F29I7N | EP4CE40F29C8N | EP4CE40F29C7 | EP4CE40F29C7N | EP4CE40F29C8 | EP4CE40F29C8LN | EP4CE40F29C8L | EP4CE40F29C9LN |
|---|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA (F29) | 780-ball FBGA (F29) | 780-ball FBGA (F29) | 780-ball FBGA (F29) | 780-ball FBGA (F29) | 780-ball FBGA (F29) | 780-ball FBGA (F29) | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Logic Elements | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 | 39,600 |
| User I/Os | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 | 532 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | I7 (fastest) | I7 | C8 | C7 | C7 | C8 | C8 | C8 | C9 (slowest) |
| Embedded Memory (bits) | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 | 1,161,216 |
| Embedded Multipliers (18x18) | 116 | 116 | 116 | 116 | 116 | 116 | 116 | 116 | 116 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Approx Unit Price (1 pc) | USD 145.96 | USD 145.96 (similar) | USD ~125 (lower) | USD ~125 (lower) | USD ~125 (lower) | USD ~125 (lower) | USD ~125 (lower) | USD ~125 (lower) | USD ~115 (lowest) |
주요 차별점
- Highest speed grade (I7) for maximum Fmax in same die/package (vs EP4CE40F29C8N)
- Industrial temperature range -40C to +100C (vs EP4CE40F29C7)
- Same die as commercial-grade C8N - full bitstream compatibility (vs EP4CE40F29C8N)
설계 노트
The 780-ball FBGA package with 1.0 mm ball pitch requires a minimum 4-layer PCB with continuous GND and PWR planes directly under the BGA. Use laser-drilled micro-via-in-pad (0.1 mm pad with 0.25 mm via) on inner signal break-out layers. Maintain 50-ohm controlled impedance for all high-speed LVDS and DDR2 traces; escape routing on the top layer should fan out at 45-degree angles to avoid signal reflections.
Cyclone IV E devices require separate VCCINT (1.2 V core), VCCA (2.5 V PLL analog), and VCCIO (1.2-3.3 V per I/O bank) supplies. Decoupling: place 100 nF X7R capacitors within 2 mm of every VCCINT ball (40+ capacitors total) and 10 uF bulk capacitors at each power pin pair. Power sequencing: VCCINT and VCCA must ramp before VCCIO to prevent latch-up; Intel recommends a common point-of-load regulator with tracking.
Do not configure JTAG chain shares with other 1.2 V devices unless their I/O voltages match - LVTTL 3.3 V on TMS/TCK can damage the Cyclone IV E JTAG pins. Use a dedicated JTAG buffer (such as SN74LVC8T245) if mixed-voltage chain members are present. Also: avoid leaving unused I/O banks floating - configure them as outputs driving ground or as inputs with internal weak pull-up to prevent crosstalk-induced oscillation.
규정 준수 정보
RoHS compliant per Intel product page. Industrial temperature grade but not AEC-Q100 qualified - for AEC-Q100 automotive applications, dedicated automotive-grade OPNs from Intel are required. Lead-free and halogen-free per Intel Cyclone IV E datasheet.
