EP4CGX110DF27I8N - Cyclone IV GX FPGA, 109K LE, 672-FBGA | Intel
부품 번호: EP4CGX110DF27I8N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $168.5 | $168.50 |
| 10 | $152 | $1,520.00 |
| 100 | $134.75 | $13,475.00 |
| 500 | $121.2 | $60,600.00 |
| 1,000 | $108.9 | $108,900.00 |
EP4CGX110DF27I8N 개요
A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells, allowing designers to implement custom digital logic functions after manufacturing. FPGAs belong to the broader programmable logic device (PLD) category, alongside CPLDs, and sit within the digital IC hierarchy as user-configurable silicon. The Cyclone IV GX family specifically targets low-cost, low-power applications that also require integrated high-speed serial transceivers, bridging the gap between traditional logic and high-bandwidth communication interfaces.
Key features of the EP4CGX110DF27I8N include 4,608 Kbits of embedded memory (RAM), 4 PLLs for clock management, 280 embedded 18x18 multipliers for DSP operations, and hard IP for PCI Express (x1/x2) Gen1. The device also includes 8 transceiver channels operating from 600 Mbps up to 3.125 Gbps, supporting protocols such as Gigabit Ethernet, CPRI, and basic serial RapidIO. This combination of resources makes it well suited for applications requiring both signal processing and high-speed serial connectivity on a single chip.
Typical applications include industrial control and factory automation, video surveillance and image processing, wireless baseband processing, automotive driver assistance systems, and portable medical devices. The Cyclone IV GX architecture delivers up to 150 mW per 100K LE at typical operating conditions, enabling fanless operation in thermally constrained enclosures. The integrated transceiver hard IP further reduces BOM cost and board area compared to discrete PHY solutions.
When designing with this FPGA, ensure proper decoupling with 100 nF and 10 µF capacitors placed close to each power pin, and follow Intel's PCB layout guidelines for the 672-pin FBGA to maintain signal integrity on high-speed transceivers. Configuration can be loaded via JTAG, AS, or PS modes, and the Quartus II software (Cyclone IV edition) is required for synthesis and place-and-route.
드롭인 대체품: EP4CGX110DF27I8N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX110DF27I8N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Speed Grade, Process Technology, Embedded 18x18 Multipliers.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX110DF27I7N
✅ 드롭인✓ 재고 있음
$198 / 개
데이터시트 보기 →EP4CGX110DF27I7
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →EP4CGX110DF27C8N
✅ 드롭인✓ 재고 있음
$152.3 / 개
데이터시트 보기 →EP4CGX110DF27C8
✅ 드롭인✓ 재고 있음
$225.4 / 개
데이터시트 보기 →EP4CGX110DF27C7N
✅ 드롭인✓ 재고 있음
$204.2 / 개
데이터시트 보기 →EP4CGX110DF27C7
✅ 드롭인✓ 재고 있음
$272.5 / 개
데이터시트 보기 →EP4CGX110DF27I8N 최대 정격 & 전기적 특성
| Family | Cyclone IV GX |
| Logic Elements | 109,424 |
| Process Technology | 60 nm low-k |
| Core Voltage | 1.2 V |
| 패키지 | 672-pin FBGA (F27) |
| Embedded Memory (RAM) | 4,608 Kbits |
| Embedded Multipliers (18x18) | 280 |
| PLLs | 4 |
| Maximum User I/O Pins | 433 |
| User I/O Banks | 8 |
| Transceiver Channels | 8 |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps |
| Hard IP | PCI Express Gen1 (x1/x2) |
| Operating Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 8 |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP4CGX110DF27I8N 672-pin fbga (f27) 핀 구성 가이드
EP4CGX110DF27I8N(672-pin fbga (f27) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX110DF27I8N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX110DF27I8N 적합 용도: 7 애플리케이션s: Industrial Control and Factory Automation, Video Surveillance and Image Processing, Wireless Baseband Processing, Automotive Driver Assistance Systems (ADAS), Portable Medical Imaging and Diagnostics, Aerospace and Avionics Subsystems, Industrial IoT and Smart Sensor Gateways.
Industrial Control and Factory Automation
The EP4CGX110DF27I8N fits industrial control and factory automation due to its industrial -40C to +100C temperature grade and 109,424 logic elements with 8 integrated 3.125 Gbps transceivers. Its 4 PLLs and 280 18x18 multipliers handle deterministic motor-control loops and high-speed EtherCAT/PROFINET communication, while the 672-pin FBGA and 433 user I/O accommodate multiple encoder interfaces and parallel sensor buses. Designers benefit from hard PCI Express Gen1 IP for connecting to industrial PCs. Compared with general-purpose MCUs, the FPGA delivers deterministic latency and parallel processing for multi-axis motion control and machine vision pipelines.
추천
Video Surveillance and Image Processing
The EP4CGX110DF27I8N is well suited to video surveillance and image processing designs where 280 embedded 18x18 multipliers accelerate real-time filtering, edge detection, and H.264 encode pre-processing. The 4,608 Kbits of embedded memory buffer pixel data between the camera sensor interface (LVDS/HiSPi) and downstream compression blocks. With 8 transceiver channels at up to 3.125 Gbps, multiple HD-SDI or MIPI-CSI inputs can be aggregated. Its low 60 nm process power consumption enables fanless enclosure designs for outdoor IP cameras operating from -40C to +100C.
추천
Wireless Baseband Processing
The EP4CGX110DF27I8N handles wireless baseband processing tasks such as channel filtering, FFT/IFFT, and modulation/demodulation with its 280 DSP multipliers and high logic density. The 3.125 Gbps transceivers interface directly to ADCs, DACs, and RF front-end ICs in small-cell and microwave-backhaul designs. PCI Express Gen1 hard IP provides a clean host interface to baseband SoCs. The industrial temperature grade supports outdoor small-cell deployments where ambient conditions exceed commercial-grade limits.
추천
Automotive Driver Assistance Systems (ADAS)
The EP4CGX110DF27I8N supports ADAS sensor fusion applications where 109K logic elements implement object detection and lane-tracking algorithms and the 280 multipliers accelerate feature extraction from radar/lidar/camera streams. The 8 transceiver channels aggregate multiple CSI-2 camera inputs or GMSL serializer streams at up to 3.125 Gbps. PCI Express Gen1 links the FPGA to host ADAS processors. While not AEC-Q100 qualified, its industrial -40C to +100C range suits many in-cabin ECU enclosures and aftermarket systems operating below strict automotive qualification thresholds.
추천
Portable Medical Imaging and Diagnostics
The EP4CGX110DF27I8N is appropriate for portable medical imaging devices such as handheld ultrasound and point-of-care diagnostics, where its 60 nm low-power process minimizes battery drain and its 109K logic elements enable real-time beamforming and image reconstruction. The 3.125 Gbps transceivers connect to high-speed ADCs that digitize ultrasound RF signals. With 4,608 Kbits of embedded RAM, the FPGA buffers intermediate beamformed data without external memory bursts. Industrial temperature grade supports clinical and field-deployed diagnostic equipment operating outside controlled hospital environments.
추천
Aerospace and Avionics Subsystems
The EP4CGX110DF27I8N supports avionics subsystems such as flight data recorders, mission computer I/O expansion, and DO-254-relevant design flows where the 109K logic density plus 280 multipliers implement sensor processing and ARINC-664/Ethernet interfaces. The 8 transceivers at 3.125 Gbps provide sufficient bandwidth for Fiber Channel or ARINC 818 video distribution. Industrial temperature rating covers most pressurized avionics bays. Designers leverage Quartus II's DO-254-compliant design tools and the F27 FBGA's mature pin-out to reuse proven PCB layouts across avionics platform refresh cycles.
추천
Industrial IoT and Smart Sensor Gateways
The EP4CGX110DF27I8N fits industrial IoT and smart sensor gateways that aggregate multiple fieldbuses (EtherCAT, PROFINET, Modbus TCP, RS-485) and pre-process data before forwarding to the cloud. Its 8 transceivers enable multi-protocol serial backhaul, while 433 user I/O connect to numerous sensor inputs in parallel. The 4 PLLs generate independent clocks for each fieldbus domain, eliminating external clock buffers. Industrial temperature grade allows deployment in factory-floor cabinets and outdoor enclosures where temperatures exceed commercial limits.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX110DF27I8N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX110DF27I7N | EP4CGX110DF27I7 | EP4CGX110DF27C8N | EP4CGX110DF27C8 | EP4CGX110DF27C7N | EP4CGX110DF27C7 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 672-pin FBGA (F27) | 672-pin FBGA (F27) - same | 672-pin FBGA (F27) - same | 672-pin FBGA (F27) - same | 672-pin FBGA (F27) - same | 672-pin FBGA (F27) - same | 672-pin FBGA (F27) - same |
| Logic Elements | 109,424 | 109,424 (same die) | 109,424 (same die) | 109,424 (same die) | 109,424 (same die) | 109,424 (same die) | 109,424 (same die) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 8 | 7 (faster Fmax) | 7 (faster Fmax) | 8 | 8 | 7 (faster Fmax) | 7 (faster Fmax) |
| Embedded Memory (RAM) | 4,608 Kbits | 4,608 Kbits (same) | 4,608 Kbits (same) | 4,608 Kbits (same) | 4,608 Kbits (same) | 4,608 Kbits (same) | 4,608 Kbits (same) |
| Embedded Multipliers (18x18) | 280 | 280 (same) | 280 (same) | 280 (same) | 280 (same) | 280 (same) | 280 (same) |
| Transceiver Channels | 8 channels up to 3.125 Gbps | 8 channels up to 3.125 Gbps | 8 channels up to 3.125 Gbps | 8 channels up to 3.125 Gbps | 8 channels up to 3.125 Gbps | 8 channels up to 3.125 Gbps | 8 channels up to 3.125 Gbps |
| PCI Express Hard IP | Gen1 (x1/x2) | Gen1 (x1/x2) - same | Gen1 (x1/x2) - same | Gen1 (x1/x2) - same | Gen1 (x1/x2) - same | Gen1 (x1/x2) - same | Gen1 (x1/x2) - same |
| User I/O Banks | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
주요 차별점
- Best balance of density and per-unit cost at industrial temperature (vs EP4CE75F29I8LN)
- Industrial -40C to +100C operating range matches outdoor/automotive deployments (vs EP4CGX110DF27C8N)
- Speed grade 8 reduces dynamic power consumption vs speed grade 7 (vs EP4CGX110DF27I7N)
- F27 672-pin FBGA provides maximum user I/O count for high-density designs (vs EP4CGX110CF23I7N)
설계 노트
Decoupling is critical for the 672-pin F27 FBGA. Place a 100 nF X7R ceramic decoupling capacitor within 1-2 mm of every VCCINT, VCCA, and VCCIO pin, plus 4-8 bulk 47-100 uF tantalum or polymer capacitors distributed across the PCB to dampen core supply transients during simultaneous switching of 280 multipliers. The Cyclone IV GX power distribution network (PDN) target impedance is specified in the device datasheet and must be met for reliable transceiver operation at 3.125 Gbps.
The 672-pin FBGA package has a typical junction-to-ambient thermal resistance (theta_JA) of approximately 12-15 C/W with sufficient PCB copper; without thermal vias or a heatsink, expect 25-30 C/W. At maximum toggle activity across 109K logic elements plus all 8 transceivers at 3.125 Gbps, the device can dissipate 3-5 W - a thermal pad, exposed pad soldering, and a minimum 4-layer PCB with inner ground planes are recommended to keep junction temperature below 100C in industrial environments.
Follow Intel's Cyclone IV GX F27 PCB layout guidelines for the 27x27 mm FBGA. Use 0.8 mm ball pitch with matching non-solder-mask-defined (NSMD) land pads and 0.4 mm drilled microvias on a 4-6 layer stack-up. Route 3.125 Gbps transceiver differential pairs with 100 ohm differential impedance, length-matched within 0.15 mm, and keep AC-coupling capacitors within 5 mm of the FPGA receiver pins. Ground-bounce and VCCIO noise directly degrade eye-diagram performance.
Do not confuse speed grade numbers: in the Cyclone IV GX family, a LOWER speed-grade number means HIGHER performance (I7 is faster than I8). Do not exceed the maximum transceiver PLL reference clock frequency; out-of-spec reference clocks cause intermittent link failures that mimic board-level signal integrity problems. For configuration, the dual-purpose configuration pins must be properly assigned to avoid conflicts with user I/O in the same bank.
규정 준수 정보
RoHS compliant per Alldatasheet listing. Not AEC-Q100 qualified - the device is industrial-grade, not automotive-grade. Reach, halogen-free, and conflict-mineral status not explicitly stated in the verified web data and marked 'unknown' accordingly.
