EP4CGX150DF27I7N - 149K LE Cyclone IV GX FPGA, 672-BGA | Intel
부품 번호: EP4CGX150DF27I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $287.5 | $287.50 |
| 10 | $264 | $2,640.00 |
| 100 | $232.4 | $23,240.00 |
| 500 | $198.75 | $99,375.00 |
| 1,000 | $175.6 | $175,600.00 |
EP4CGX150DF27I7N 개요
An FPGA (field-programmable gate array) is a semiconductor device built around a matrix of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, multipliers, and memory controllers. Within the broader programmable logic family hierarchy, FPGAs sit alongside CPLDs (smaller, non-volatile) and SoC FPGAs (which add a hard application processor), and they belong to the wider category of programmable logic devices (PLDs) used in digital system design for prototyping, glue logic, and full custom silicon replacement.
Key features of the EP4CGX150DF27I7N include 149,760 logic elements, 720 embedded 18x18 multipliers (suitable for DSP workloads), 8 high-speed transceivers supporting data rates up to 3.125 Gbps, and on-chip memory bandwidth backed by 6.6 Mbits of RAM distributed across 720 M9K blocks. The F27 FBGA-672 package offers a 27 mm x 27 mm body with 1.0 mm ball pitch, suitable for production PCB manufacturing with standard surface-mount processes. Industrial temperature grade (-40 C to +100 C junction) is supported with the 'I7' speed grade and 'N' lead-free suffix.
Architecturally, Cyclone IV GX devices leverage a low-power 60 nm process and an enhanced ALM (adaptive logic module) structure that delivers higher logic efficiency than the previous Cyclone III generation. The integrated 3.125 Gbps transceivers, PCI Express hard IP, and dedicated DDR/QDR memory controllers reduce bill-of-materials cost and PCB complexity compared with discrete solutions.
Typical applications include industrial motor control, video surveillance and image processing, low-cost serial backplane aggregation, software-defined radio, and embedded prototyping for wireless base stations and factory automation. The combination of high logic density and integrated transceivers is particularly attractive in designs that need a single-chip solution for control-plane plus high-speed data path.
When designing with this device, ensure your PCB layout supports the 1.0 mm pitch BGA with microvia or via-in-pad technology. Power estimation should be performed in the Quartus II PowerPlay tool before final design, and the FPGA must be configured via JTAG, AS, or PS mode using an external configuration device such as the EPCQ-L.
This page synthesizes Intel/Altera datasheet data, distributor pricing, drop-in alternative candidates, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: EP4CGX150DF27I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4CGX150DF27I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Speed Grade, Transceivers, Process Technology, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4CGX150DF27I7
✅ 드롭인✓ 재고 있음
$460 / 개
데이터시트 보기 →EP4CGX150DF27C7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP4CGX150DF27C8N
✅ 드롭인✓ 재고 있음
$305 / 개
데이터시트 보기 →EP4CGX150DF27C7
✅ 드롭인✓ 재고 있음
$390 / 개
데이터시트 보기 →EP4CGX150CF23I7N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →EP4CGX150DF27I7N 최대 정격 & 전기적 특성
| Series | Cyclone IV GX |
| Device Family | EP4CGX150 |
| Logic Elements (LE) | 149,760 |
| Embedded Memory Bits | 6,635,520 bits |
| Embedded Memory Blocks | 720 M9K blocks |
| User I/O Pins | 393 |
| Embedded 18x18 Multipliers | 720 |
| Transceivers | 8 (up to 3.125 Gbps) |
| Process Technology | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V (typical) |
| 동작 온도 | -40 C to +100 C (industrial, 'I' grade) |
| Speed Grade | 7 |
| 패키지 | 672-ball FBGA (F27), 27x27 mm, 1.0 mm pitch |
| 실장 유형 | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (suffix N) |
| Configuration Mode | JTAG / Active Serial / Passive Serial |
EP4CGX150DF27I7N 672-ball fbga (f27), 27x27 mm, 1.0 mm pitch 핀 구성 가이드
EP4CGX150DF27I7N(672-ball fbga (f27), 27x27 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4CGX150DF27I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4CGX150DF27I7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Surveillance / Image Processing, Software-Defined Radio / Wireless Base Station, Cost-Optimized Serial Backplane Aggregation, ASIC Prototyping / Pre-Silicon Validation, Low-Cost Embedded Vision in Factory Automation.
Industrial Motor Control
The EP4CGX150DF27I7N fits industrial motor control designs because its 720 18x18 multipliers and 6.6 Mbits of embedded memory deliver the DSP throughput needed for field-oriented control (FOC) loops. Its 393 user I/Os connect to multi-axis encoder inputs, gate-driver PWM channels, and resolver feedback without external logic. The integrated 3.125 Gbps transceivers also support industrial EtherCAT or SERCOS III master bridges on the same silicon, eliminating a companion ASIC. Industrial -40 C to +100 C junction range allows deployment in factory cabinets and outdoor drive enclosures.
추천
Video Surveillance / Image Processing
The EP4CGX150DF27I7N suits video surveillance and image-processing pipelines because 149,760 logic elements can implement multi-channel video scaling, de-interlacing, and basic analytics in a single chip. Its 720 M9K blocks (6.6 Mbits) hold line buffers and frame statistics without external SRAM, reducing BOM cost. The 3.125 Gbps transceivers handle MIPI-CSI, SDI, or GigE Vision serialization directly. Industrial temperature grade ensures operation in uncooled outdoor camera housings.
추천
Software-Defined Radio / Wireless Base Station
The EP4CGX150DF27I7N fits software-defined radio and small-cell wireless base stations because its 8 transceivers up to 3.125 Gbps support CPRI, OBSAI, and custom digital-IF links between the radio unit and baseband. The 720 18x18 multipliers implement up- and down-conversion FIRs, crest-factor reduction, and digital pre-distortion in real time. Combined with 393 user I/Os for parallel ADC/DAC interfaces, the device replaces a DSP-plus-FPGA two-chip solution in small-cell designs.
추천
Cost-Optimized Serial Backplane Aggregation
The EP4CGX150DF27I7N targets cost-sensitive serial backplane aggregation switches where 8 transceivers up to 3.125 Gbps are needed but full Stratix-class FPGAs are over-spec. Its integrated PCIe hard IP block enables a Gen1 x1 root-port or endpoint for host CPU attachment. The 6.6 Mbits of embedded memory store packet descriptors and statistics, reducing dependence on external RLDRAM. Industrial temperature grade supports deployment in central-office or outdoor-cabinet equipment.
추천
ASIC Prototyping / Pre-Silicon Validation
The EP4CGX150DF27I7N is a useful ASIC prototyping vehicle because 149,760 logic elements can map mid-complexity ASIC RTL (typically up to 5-7 million ASIC gates) for pre-silicon validation. Industrial temperature grade enables prototype operation in real environment thermal envelopes. The 8 transceivers support real-world SERDES traffic at production rates, catching SERDES-related bugs before tape-out. Pin-compatible commercial-temp variants allow engineering-build vs production-build differentiation without PCB changes.
추천
Low-Cost Embedded Vision in Factory Automation
The EP4CGX150DF27I7N supports embedded vision nodes on factory floors where its 393 user I/Os connect directly to MIPI-CSI-2 image sensors or parallel CMOS cameras, and its 8 transceivers stream compressed video to central PLCs over industrial Ethernet. The 6.6 Mbits of on-chip memory buffer line data for histogram and edge-detection pre-processing without external SRAM, reducing system cost. Industrial -40 C to +100 C operation withstands factory-floor thermal swings.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4CGX150DF27I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4CGX150DF27I7 | EP4CGX150DF27C7N | EP4CGX150DF27C8N | EP4CGX150DF27C7 | EP4CGX150CF23I7N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 672-FBGA (F27), 27x27 mm | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 672-FBGA (F27) - same | 484-FBGA (F23) - smaller |
| Logic Elements | 149,760 | 149,760 | 149,760 | 149,760 | 149,760 | 149,760 |
| Transceivers | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) | 8 (up to 3.125 Gbps) |
| Embedded Memory | 6,635,520 bits (720 M9K) | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits | 6,635,520 bits |
| User I/Os | 393 | 393 | 393 | 393 | 393 | 290 (approx, smaller package) |
| Temperature Grade | Industrial (-40C to +100C) | Industrial | Commercial (0C to +85C) | Commercial | Commercial | Industrial |
| Speed Grade | 7 | 7 | 7 | 8 (slower) | 7 | 7 |
| Lead-Free ('N' suffix) | Yes | No | Yes | Yes | No | Yes |
주요 차별점
- Industrial temperature grade with lead-free Pb-free assembly suffix (vs EP4CGX150DF27C7N)
- Higher speed grade (-7) vs lower-cost -8 grade in same package (vs EP4CGX150DF27C8N)
- F27 672-BGA package exposes 393 user I/Os vs smaller F23 484-BGA (vs EP4CGX150CF23I7N)
설계 노트
The F27 672-ball FBGA package uses 1.0 mm ball pitch, which is at the practical limit for standard 4-mil laser-drilled vias on 1.6 mm FR-4 stack-ups. For prototypes use via-in-pad with filled and plated-over vias; for HDI production consider microvia-in-pad (stacked microvias). Use escape routing of one signal trace between adjacent balls (1.0 mm pitch gives ~0.5 mm channel). Plan the BGA break-out region on at least 6 routing layers.
Estimated: at typical toggle rates (50% logic utilization, 100 MHz) the Cyclone IV GX core draws around 1.5 to 2 W. With the F27 package theta_JA around 14 C/W (with 4-layer JEDEC test board) junction-to-ambient rise is approximately 21 to 28 C above ambient. Industrial -40 C to +100 C junction range leaves headroom for sealed enclosures but verify with PowerPlay thermal analysis for your design's utilization.
Do not confuse EP4CGX150DF27I7N (672-FBGA F27) with EP4CGX150CF23I7N (484-FBGA F23); the F23 package has ~100 fewer user I/Os and is NOT pin-compatible. When migrating between speed grades (-7 vs -8) timing closure on multi-cycle paths must be re-checked. Configuration mode selection (AS vs PS) drives the external flash device choice (EPCQ for AS mode); do not leave MODE pins floating.
규정 준수 정보
RoHS compliant and lead-free per 'N' suffix in MPN. Industrial temperature grade (not AEC-Q100 automotive qualified). Conflict-minerals compliance per Intel supplier declarations.
