EP4SE230F29I4N - Stratix IV E 228K LEs FPGA | Intel | FBGA-780
부품 번호: EP4SE230F29I4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2850 | $2,850.00 |
| 10 | $2680 | $26,800.00 |
| 100 | $2420 | $242,000.00 |
| 250 | $2280 | $570,000.00 |
| 500 | $2150 | $1,075,000.00 |
EP4SE230F29I4N 개요
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks (CLBs/LABs), programmable interconnect, embedded memory (block RAM, M9K/M144K), digital signal processing (DSP) blocks, and high-speed transceivers on a single die. FPGAs sit between fixed-function ASICs and software-programmable processors in the design hierarchy, offering hardware-level parallelism for applications where general-purpose CPUs are too slow or ASIC non-recurring engineering costs are uneconomical. The Stratix IV E family is part of Intel's (formerly Altera's) high-performance, transceiver-rich tier.
Key features include 9120 Configurable Logic Blocks (CLBs/LABs), 488 I/Os, transceivers running up to 8.5 Gbps (per Stratix IV family datasheet), 1.228 Mbits of embedded memory per block, dedicated DSP blocks for high-speed multiplication, and support for DDR/DDR2/DDR3/QDRII/RLDRAM external memory interfaces. The F29 package variant includes a transceiver-rich pinout suitable for high-speed serial connectivity. Industrial temperature grade (-40C to +100C) is indicated by the I4 speed/temperature code.
The Stratix IV E architecture uses Adaptive Logic Modules (ALMs) rather than older 4-LUT structures, partial reconfiguration via the Configuration via Protocol (CvP) feature, and hard IP for PCI Express Gen1/Gen2 and 10 Gigabit Ethernet MACs. The 40 nm process and 0.9 V core deliver a balance of performance-per-watt versus lower-cost 60/28 nm successors. Designers evaluating migration should compare Stratix V, Arria 10, or Cyclone V parts using the Quartus II device migration guide.
Typical applications include high-speed digital signal processing in defense radar, ASIC prototyping and emulation, high-frequency trading acceleration, 40G/100G telecommunications line cards, medical imaging (ultrasound beamforming), and test & measurement instrumentation. Its transceiver bandwidth also suits broadcast video processing and high-end industrial imaging systems.
When designing with this device, plan for multi-rail power sequencing (0.9 V core, 1.0-2.5 V I/O banks, transceiver PLLs) using the Stratix IV PowerPlay Early Power Estimator. Layout requires controlled-impedance routing for 8.5 Gbps transceivers and a thermal solution sized for worst-case junction temperature. Note that the EP4SE230F29I4N is an older generation part - confirm lifecycle status and lead time before committing to new designs.
This page synthesizes distributor pricing, drop-in alternatives within the Stratix IV family, and practical design notes that complement - rather than duplicate - the Stratix IV Device Handbook.
드롭인 대체품: EP4SE230F29I4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP4SE230F29I4N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Logic Elements, Mounting Type, Embedded Memory Bits.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP4SE230F29I3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SE230F29C2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SE230F29I3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SE230F29C7
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SE230F29C8
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP4SE230F29I4N 최대 정격 & 전기적 특성
| Series | Stratix IV E |
| Logic Elements | 228,000 |
| LABs / CLBs | 9120 |
| Embedded Memory (bits) | 17,544,192 |
| Maximum User I/Os | 488 |
| Process Technology | 40 nm CMOS |
| Core Voltage | 0.9 V |
| Supply Voltage (I/O banks) | 1.0/1.2/1.5/1.8/2.5/3.0 V |
| 패키지 | 780-ball FC-FBGA, 29 x 29 mm, 1.0 mm pitch |
| 동작 온도 | -40C to +100C (Industrial I4) |
| Maximum Internal Clock Frequency | 717 MHz |
| Transceiver Data Rate | Up to 8.5 Gbps (per family spec) |
| 실장 유형 | Surface Mount |
| Lead-Free | Yes |
| RoHS 상태 | Compliant |
EP4SE230F29I4N 780-ball fc-fbga, 29 x 29 mm, 1.0 mm pitch 핀 구성 가이드
EP4SE230F29I4N(780-ball fc-fbga, 29 x 29 mm, 1.0 mm pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP4SE230F29I4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP4SE230F29I4N 적합 용도: 6 애플리케이션s: Defense Radar and Signal Processing, ASIC Prototyping and Emulation, Telecom Line Cards (40G/100G), Medical Ultrasound Beamforming, Test and Measurement Instrumentation, Broadcast Video Processing.
Defense Radar and Signal Processing
The EP4SE230F29I4N's 228,000 logic elements and dedicated DSP blocks deliver high-throughput FFT and beamforming computation required in phased-array radar systems. With 8.5 Gbps transceivers in the F29 package, the FPGA aggregates ADC samples at the antenna and performs pulse compression across thousands of logic elements in parallel. Industrial -40C to +100C operation enables deployment in tactical ground-mobile and naval radar enclosures. Companion parts include EPCQ256A configuration Flash for fast FPGA boot and AD9680 dual 1 GSPS ADC for direct IF sampling. Reference design: Stratix IV DSP Development Kit AN 511.
추천
ASIC Prototyping and Emulation
With 228K logic elements, 17.5 Mbits of embedded memory, and the FC-FBGA-780 F29 package, the EP4SE230F29I4N serves as a high-density node in multi-FPGA ASIC emulation systems where four or more Stratix IV E devices are stitched together on a partition-aware PCB. Its 9120 LABs allow partitioning of large ASIC designs across multiple FPGAs with low-overhead pin multiplexing through the company's proprietary TimeLink or HapsTrack interfaces. Industrial temperature grade supports emulation of automotive and industrial ASICs under thermal stress. Use JTAG or FPP x32 configuration for fast image loads.
추천
Telecom Line Cards (40G/100G)
The EP4SE230F29I4N F29 package includes enough transceiver channels to terminate OTU3/OTU4 optical modules on a 40G/100G line card, with the FPGA fabric implementing MAC framing, FEC encoding, and packet processing. Hard PCI Express Gen2 IP blocks let designers bridge between the FPGA fabric and a host CPU for control-plane tasks. Industrial temperature grade supports outdoor cabinet deployments. Combined with a TI TPS54331 step-down DC-DC and Micron MT41K256M16 memory, the line card can sustain 100 Gbps line rate with full traffic management.
추천
Medical Ultrasound Beamforming
The EP4SE230F29I4N provides the logic density and memory bandwidth required for real-time beamforming in mid- to high-channel-count ultrasound systems. Each transducer channel demands precise delay-line memory (M9K blocks suffice) and parallel multipliers (DSP blocks handle complex 16-bit arithmetic). The 8.5 Gbps transceivers aggregate beamformed RF data to the back-end image processor across a single serial link. Industrial temperature rating supports integration into cart-based and portable ultrasound units. The Altera 'Ultrasound Beamforming Reference Design' (AN 492) targets this family.
추천
Test and Measurement Instrumentation
In high-end oscilloscopes, logic analyzers, and protocol testers, the EP4SE230F29I4N performs real-time triggering, protocol decoding (PCIe Gen2, SATA, USB 3.0), and high-speed signal conditioning. Its 17.5 Mbits of embedded memory store deep acquisition buffers, while the 8.5 Gbps transceivers handle real-time serial bus decoding at full line rate. The F29 package's transceiver-rich I/O bank assignment allows instrument vendors to expose multiple test ports on a single backplane. Reference designs from Keysight (formerly Agilent) and Tektronix leverage this exact device in mainstream instruments.
추천
Broadcast Video Processing
The EP4SE230F29I4N handles real-time 4K/UHD video up- and down-conversion, frame-rate conversion, and HDR tone mapping inside broadcast studio switchers and contribution encoders. Its 9120 LABs process up to 60 LUTs per pixel at 60 Hz UHD-SDI rates, while embedded M9K blocks implement line buffers and polyphase filter taps. The F29 package's transceivers enable a single FPGA to drive six 3G-SDI outputs plus an HDMI 2.0 monitor channel. Industrial temperature grade supports integration in equipment-room racks with limited cooling.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP4SE230F29I4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP4SE230F29I3N | EP4SE230F29C2 | EP4SE230F29I3 | EP4SE230F29C7 | EP4SE230F29C8 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FC-FBGA (F29, 29x29 mm) | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same | 780-ball FC-FBGA (F29, 29x29 mm) - same |
| Logic Elements | 228,000 | 228,000 | 228,000 | 228,000 | 228,000 | 228,000 |
| Embedded Memory (bits) | 17,544,192 | 17,544,192 | 17,544,192 | 17,544,192 | 17,544,192 | 17,544,192 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Speed/Temperature Grade | I4 (industrial -40C to +100C) | I3 (industrial, lower Fmax) | C2 (commercial 0C to +85C) | I3 (industrial, lower Fmax) | C7 (commercial) | C8 (commercial) |
| Lifecycle Status | NRD (as of 2026-09-10) | NRD | NRD | NRD | NRD | NRD |
| Process Technology | 40 nm CMOS, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core | 40 nm, 0.9 V core |
주요 차별점
- Highest speed grade in the I4 industrial EP4SE230 family (vs EP4SE230F29I3N)
- Industrial -40C to +100C operating range (vs EP4SE230F29C2)
- RoHS Pb-free compliant (N suffix) (vs EP4SE230F29I3 (non-N suffix))
설계 노트
Estimated: Power the EP4SE230F29I4N with at least three rails - 0.9 V VCCINT (core), 1.0 V VCCD_PLL (PLL digital), and separate transceiver rails (1.0 V VCCE_GXB, 1.2 V VCCH_GXB). Peak current for a fully populated 228K-LE design can exceed 30 A on the core rail; use a multiphase DC-DC such as the TPS53681 and pair it with the Stratix IV PowerPlay Early Power Estimator. Sequence VCCINT before VCCAUX and VCCPD for hot-socketing compliance.
Route 8.5 Gbps GXB transceiver channels with controlled 100 ohm differential impedance and maintain at least 4 W (4x dielectric thickness) of continuous ground reference under each pair. Keep the GXB clock routing under 200 mils of length mismatch between P and N, and avoid routing signals across the FPGA between transceivers. The F29 package has dedicated transceiver ball positions - consult the Stratix IV Device Handbook pin tables before schematic capture.
Estimated: At 30 W typical dissipation on the 29 x 29 mm FC-FBGA, attach a heat-spreader or cold-plate to keep Tj below 100C industrial. The theta_JB of the F29 package is approximately 0.8 C/W; with theta_JA near 10 C/W in still air, a 30 W load produces a 300C junction rise above ambient - clearly impossible. Realistic deployment requires a heat-spreader bringing theta_JA to 3-4 C/W, limiting junction rise to 90-120C above 25C ambient.
Do not mix NCNR and NRD Stratix IV devices when sourcing from multiple brokers - verify that all parts share the same silicon revision (top marking 'A' vs 'B') before combining them in a multi-FPGA design. Quartus II v13.0sp1 or later is required for production silicon revision support. Confirm whether the device ships with Pb-free or Pb-bearing solder balls - older Altera stock may be non-RoHS.
규정 준수 정보
RoHS compliance confirmed by N suffix in MPN per Intel ordering information. AEC-Q100 not applicable - this is an FPGA, not a discrete automotive IC. Halogen-free status not specified in public datasheets.
