EPC1C20F324I7 - Cyclone FPGA, 20K LE, 324-FBGA | Altera
부품 번호: EPC1C20F324I7 ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $71.2 | $712.00 |
| 100 | $64.8 | $6,480.00 |
| 500 | $58.4 | $29,200.00 |
| 1,000 | $52.1 | $52,100.00 |
EPC1C20F324I7 개요
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure digital logic blocks, interconnect, and I/O after manufacture. FPGAs sit hierarchically within the broader taxonomy: programmable logic -> PLD -> FPGA -> SRAM-based FPGA. The Cyclone family specifically targets cost-sensitive, high-volume applications by balancing logic density, memory, and DSP resources while keeping per-unit cost low relative to high-end FPGAs.
Key features of the EP1C20F324I7 include 20,060 logic elements arranged in logic array blocks (LABs), 294,912 bits (approximately 36 Kbytes) of M4K embedded memory blocks ideal for FIFO and buffer implementations, and dedicated 18x18 hardware multipliers for DSP functions. The device supports multiple I/O standards including LVTTL, LVCMOS, PCI, SSTL, and LVDS through its 324-ball FBGA, enabling flexible interfacing with external memories, processors, and high-speed peripherals.
Architecturally, the Cyclone EP1C20 uses a 0.13 µm SRAM-based configuration cell fabric with four input look-up tables (4-LUTs) per logic element, supported by a rich routing matrix and dedicated carry chains for arithmetic operations. Two on-chip PLLs provide clock multiplication, division, and phase shifting across up to six output banks. Configuration is loaded via passive serial (PS), active serial (AS), or JTAG modes through an EPCS configuration device, with built-in support for design security and remote update.
Typical applications include digital signal processing front-ends, video bridging and image processing, industrial control and factory automation, telecommunications line cards, and prototyping of ASIC designs. The combination of moderate logic density, embedded multipliers, and low-cost packaging makes it well-suited for high-volume embedded and consumer applications requiring custom hardware acceleration.
When designing with this device, pay careful attention to power estimation tools (Quartus PowerPlay) and signal integrity on high-speed LVDS pairs. The 1.5V core supply must be sequenced correctly with the 3.3V I/O supply to avoid latch-up, and decoupling capacitor selection per the Cyclone device family guidelines is essential for jitter performance. Designers should also verify that the chosen EPCS configuration memory size matches the compressed bitstream length.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, offering unique engineering value for sourcing and BOM consolidation decisions.
드롭인 대체품: EPC1C20F324I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPC1C20F324I7 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Speed Grade, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP1C20F324C8N
✅ 드롭인✓ 재고 있음
$42.36 / 개
데이터시트 보기 →EP1C20F324I7N
✅ 드롭인✓ 재고 있음
$53.1 / 개
데이터시트 보기 →EP1C20F324C7N
✅ 드롭인✓ 재고 있음
$56.04 / 개
데이터시트 보기 →EP4CE20F324I7N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EP1C12F324C8N
✅ 드롭인✓ 재고 있음
$51.75 / 개
데이터시트 보기 →EPC1C20F324I7 최대 정격 & 전기적 특성
| Family | Cyclone |
| Logic Elements | 20,060 |
| Embedded Memory (Bits) | 294,912 |
| Maximum User I/O | 233 |
| Operating Voltage (Core) | 1.5 V |
| Maximum Internal Frequency | 320.1 MHz |
| Number of PLLs | 2 |
| Number of Global Clocks | 8 |
| 패키지 | 324-ball FBGA |
| Speed Grade | I7 (industrial) |
| 동작 온도 | -40C to +100C (industrial) |
| Configuration Method | Passive Serial, Active Serial, JTAG |
| Process Technology | 0.13 µm SRAM |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
EPC1C20F324I7 324-ball fbga 핀 구성 가이드
EPC1C20F324I7(324-ball fbga 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPC1C20F324I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPC1C20F324I7 적합 용도: 6 애플리케이션s: Industrial Motor Control, Video Processing and Image Bridge, Telecommunications Line Card Glue Logic, ASIC Prototyping and Emulation, Digital Signal Processing Front-End, Automotive Infotainment Display Controller.
Industrial Motor Control
The EPC1C20F324I7 is well-suited for industrial motor control applications requiring deterministic real-time processing and multiple interface standards. Its 20,060 logic elements and 64 dedicated 18x18 hardware multipliers support field-oriented control (FOC) algorithms, space-vector PWM generation, and quadrature encoder interfaces at switching frequencies up to 320 MHz internal clock. The 233 user I/Os allow direct connection to multiple resolver-to-digital converters, current-sense ADCs, and gate-driver ICs, while the industrial -40C to +100C temperature range ensures reliable operation in factory-floor enclosures. Two on-chip PLLs provide jitter-clean clock synthesis for the PWM timers and ADC sample clocks.
추천
Video Processing and Image Bridge
The EPC1C20F324I7 handles moderate-resolution video processing tasks such as scaling, de-interlacing, and color-space conversion in surveillance and broadcast equipment. Its 294,912 bits of embedded M4K memory provide line buffers and small frame buffers without external SRAM, while the 20,060 LEs implement real-time processing pipelines at pixel rates up to 148.5 MHz (720p/1080i). LVDS I/O support enables direct connection to LVDS-based camera interfaces and DVI/HDMI bridges, and the 233 I/Os accommodate parallel video buses plus sideband control. Designers typically pair it with external DDR SDRAM for full-frame buffering in multi-channel DVR applications.
추천
Telecommunications Line Card Glue Logic
In telecom line-card designs, the EPC1C20F324I7 provides custom glue logic, packet inspection, and protocol conversion between network processors and PHYs. Its 320 MHz operation and 233 I/Os support multiple SGMII/SPI/UART interfaces, while the embedded M4K blocks implement small CAMs and FIFOs for packet queuing. The industrial temperature grade suits outdoor remote-radio-head (RRH) deployments, and the BGA package enables dense routing under the FPGA. Two PLLs synthesize the multiple clock domains required for framer, deframer, and backplane SERDES reference clocks.
추천
ASIC Prototyping and Emulation
Engineers use the EPC1C20F324I7 as a cost-effective ASIC prototyping vehicle for designs targeting 20K to 50K equivalent gates of custom logic. Its 4-input LUT architecture with dedicated carry chains accurately models standard-cell ASIC timing characteristics, while the embedded M4K memory emulates SRAM blocks typical of ASIC designs. Quartus synthesis can target the device directly from RTL, with JTAG-based logic analyzer (SignalTap) enabling real-time verification of internal signals. The 324-FBGA package supports high I/O count designs that emulate ASIC pad-limited layouts, and the EPCS configuration memory allows fast design iteration.
추천
Digital Signal Processing Front-End
The EPC1C20F324I7's 64 dedicated 18x18 hardware multipliers and 294,912 bits of embedded memory make it suitable for DSP front-end tasks including FIR filtering, FFT preprocessing, and modulation/demodulation in software-defined radio (SDR) and instrumentation applications. Per the Cyclone family datasheet, the multiplier array achieves 320 MHz throughput, supporting real-time processing of up to 80 MSPS baseband data. The flexible I/O standards enable direct connection to high-speed ADCs and DACs via LVDS or parallel CMOS buses, and the two PLLs generate the required ADC sample clocks and FPGA fabric clocks from a single low-jitter reference.
추천
Automotive Infotainment Display Controller
The EPC1C20F324I7 implements timing controllers, color-management blocks, and backlight drivers for automotive infotainment LCD and OLED panels. Its 233 user I/Os handle 24-bit parallel RGB interfaces plus LVDS for higher-resolution panels, while the embedded M4K memory supports small frame buffers for on-screen display (OSD) composition and rotation. Industrial temperature operation is acceptable for cabin-mounted displays, and the BGA package enables compact PCB layouts behind the display panel. Designers pair the FPGA with an external TCON bridge and backlight LED driver to complete the display subsystem.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPC1C20F324I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP1C20F324C8N | EP1C20F324I7N | EP1C20F324C7N | EP4CE20F324I7N | EP1C12F324C8N |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 324-FBGA | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same | 324-FBGA - same |
| Logic Elements | 20,060 | 20,060 | 20,060 | 20,060 | 22,320 | 12,060 |
| Embedded Memory (Bits) | 294,912 | 294,912 | 294,912 | 294,912 | 532,800 | 239,616 |
| Maximum User I/O | 233 | 233 | 233 | 233 | 193 | 249 |
| Number of PLLs | 2 | 2 | 2 | 2 | 4 | 2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.2 V | 1.5 V |
| Temperature Grade | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
주요 차별점
- Highest-density Cyclone FPGA in last-time-buy availability (vs EP1C12F324C8N)
- Direct migration path to Cyclone IV E family (vs EP4CE20F324I7N)
- Industrial temperature grade with same pinout as commercial variant (vs EP1C20F324C8N)
설계 노트
Estimated: At maximum utilization with 50% toggle rate and 233 active I/Os, the EP1C20F324I7 can dissipate 1.5 to 2.5W from the 1.5V core supply. Designers should budget at least 2.5A of 1.5V current capability from the DC-DC converter (such as TPS54331DRCR) and provide at least four 10uF ceramic decoupling capacitors within 0.5 inches of the FBGA balls. The 3.3V I/O supply must be sequenced to come up before or simultaneously with the 1.5V core to prevent latch-up. Use the Quartus PowerPlay early power estimator during schematic design to refine budgets before board layout.
The 324-ball FBGA requires at least 6 PCB layers with a dedicated ground plane directly beneath the device for thermal dissipation and signal return paths. Escape routing should use via-in-pad micro-via technology to fan out the 1.0mm pitch BGA, with paired ground vias adjacent to each signal via for impedance control and return-path continuity. Maintain 50-ohm single-ended and 100-ohm differential impedance for LVDS pairs, and place differential pairs length-matched to within 150 mils. Mount a thermal pad or copper flood beneath the device to reduce junction temperature.
Three common pitfalls when designing with the EP1C20: (1) Selecting an undersized EPCS configuration flash - the compressed bitstream for a fully-utilized EP1C20 can exceed 4 Mbit, so use EPCS16 (16 Mbit) or larger to allow for design growth. (2) Failing to assign the MSEL[2:0] pins to the correct configuration mode - incorrect settings prevent the device from configuring. (3) Not connecting all unused I/O banks to a defined voltage - per Cyclone datasheet, all VREF pins must be tied to VCCIO of their bank or to GND through 10K resistors to prevent configuration failures.
규정 준수 정보
RoHS compliant per Altera/Intel product page. Last-time-buy status as of 2026-09-11; not recommended for new designs. Not AEC-Q100 qualified for automotive safety-critical applications.
