EPF10K130EBC356-2 - FLEX 10KE FPGA, 130K Gates, 356-BGA | Altera
부품 번호: EPF10K130EBC356-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $256.5 | $2,565.00 |
| 100 | $228 | $22,800.00 |
| 500 | $205.2 | $102,600.00 |
| 1,000 | $185 | $185,000.00 |
EPF10K130EBC356-2 개요
A Field Programmable Gate Array (FPGA) is a programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs / LABs), programmable interconnect, and I/O cells, allowing engineers to implement arbitrary digital logic after PCB fabrication. Within the broader taxonomy, an FPGA belongs to the hierarchy: FPGA -> programmable logic device (PLD) -> digital logic IC -> semiconductor. The FLEX 10KE family was Altera's first embedded programmable logic platform, providing System-on-a-Programmable-Chip (SOPC) integration through embedded array blocks.
Key features include 0.22 um CMOS process technology, 333.33 MHz internal performance, 0.6 ns propagation delay, embedded SRAM bits in the Embedded Array Blocks (EABs), MultiVolt I/O support, JTAG-compliant boundary-scan testing (IEEE 1149.1), and in-system programmability via EPROM, EEPROM, or SRAM configuration schemes. The device is offered in commercial (0C to 70C) operating temperature and uses a 1.0 ns speed grade (the '-2' suffix).
The architecture combines 832 LABs, each with 8 logic elements, interconnected through FastTrack Interconnect routing. Embedded Array Blocks (EABs) provide up to 16 Kbits of dual-port RAM each, totaling 128 Kbits of embedded memory. The I/O structure supports 3.3 V PCI compliance and 5.0 V tolerant inputs on selected pins, configured via Altera's MAX+PLUS II or Quartus development software.
Typical applications include telecommunications line cards, glue logic in industrial control systems, ASIC prototyping, low-volume production replacement of gate arrays, DSP front-end preprocessing, and bus-interface bridging. The high gate count and embedded memory make it suitable for designs that previously required multiple discrete PLDs.
When designing with this device, ensure proper decoupling (0.1 uF + 10 uF per VCC pin group), use at least four PCB routing layers for signal integrity on the 356-BGA package, and configure the device using Altera's Quartus Prime (or legacy MAX+PLUS II) toolchain with the appropriate FLEX 10KE device library.
This page synthesizes distributor inventory, drop-in same-package alternatives, lifecycle observation, and practical design notes for the FLEX 10KE family - not a copy of the manufacturer datasheet.
드롭인 대체품: EPF10K130EBC356-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K130EBC356-2 (동일 폼 팩터 및 풋프린트) — 차이점: Operating Temperature, Package, Process Technology, Family, Core Supply Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K130EBC356-3
✅ 드롭인✓ 재고 있음
$35.2 / 개
데이터시트 보기 →EPF10K130EBC356-1
✅ 드롭인✓ 재고 있음
$95 / 개
데이터시트 보기 →EPF10K130EBC356-1N
✅ 드롭인✓ 재고 있음
$18.2 / 개
데이터시트 보기 →EPF10K130EBC356-1X
✅ 드롭인✓ 재고 있음
$132 / 개
데이터시트 보기 →EPF10K130EBC356-2X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K130EBC356-2 최대 정격 & 전기적 특성
| Family | FLEX 10KE |
| Logic Elements / Cells | 6,656 |
| Equivalent Gates | 130K |
| Logic Array Blocks (LABs) | 832 |
| Embedded Memory (EAB RAM) | 16 Kbits per EAB |
| User I/Os | 274 |
| Supply Voltage - Core | 2.375 V to 2.625 V (2.5 V nominal) |
| Logic Family | CMOS |
| Process Technology | 0.22 um |
| Maximum Internal Frequency | 333.33 MHz |
| Propagation Delay | 0.6 ns |
| Speed Grade | -2 |
| 동작 온도 | 0 C to +70 C (Commercial) |
| 패키지 | 356-LBGA (35x35 mm) |
| 실장 유형 | Surface Mount |
| Configuration | In-system programmable (SRAM) |
| JTAG (IEEE 1149.1) | Yes |
EPF10K130EBC356-2 356-lbga (35x35 mm) 핀 구성 가이드
EPF10K130EBC356-2(356-lbga (35x35 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K130EBC356-2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K130EBC356-2 적합 용도: 6 애플리케이션s: Telecommunications Line Cards, ASIC Prototyping and Emulation, Industrial Control Glue Logic, DSP Front-End Pre-Processing, Low-Volume Production Gate-Array Replacement, Legacy Board Maintenance and Field Upgrades.
Telecommunications Line Cards
The EPF10K130EBC356-2's 6,656 logic elements and 16-Kbit-per-EAB embedded memory make it well-suited for telecommunications line-card glue logic, where it can implement ATM segmentation/reassembly, Utopia framing, or HDLC controllers. The 274 user I/Os accommodate parallel bus glue between PHYs, ASICs, and network processors, while the FLEX 10KE MultiVolt I/O supports 3.3 V buses common in telecom backplanes. Per the FLEX 10KE datasheet, in-system programmability via JTAG (IEEE 1149.1) lets carriers update line-card logic remotely - valuable for deployed network equipment. With 130K gates the device handles medium-complexity protocol bridges without paying the ASIC NRE.
추천
ASIC Prototyping and Emulation
The EPF10K130EBC356-2 is widely used as an ASIC prototype vehicle, where designers map gate-level netlists into the 6,656 logic-element fabric to validate functionality before committing to a mask set. The 356-LBGA package supports high I/O count needed for ASIC pin emulation, while the 16-Kbit EABs allow designers to prototype on-chip RAM before the ASIC has it. Compared with discrete gate-array prototyping, the FLEX 10KE delivers faster design cycles with Quartus Prime synthesis and the same silicon revision-to-revision, reducing emulator integration risk.
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Industrial Control Glue Logic
The EPF10K130EBC356-2's 130K-gate capacity bridges mismatched interfaces in industrial controllers - for example, gluing parallel microcontrollers to ISA/PCI-style peripherals or driving industrial backplanes. The 333 MHz internal performance and 0.6 ns propagation delay ensure deterministic timing for motor-control state machines. The 274 user I/Os are sufficient to support 24 to 32-bit parallel buses plus per-channel GPIO expansion, while the commercial 0C-70C operating range covers factory-floor environments that are not thermally extreme.
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DSP Front-End Pre-Processing
In DSP front-end designs, the EPF10K130EBC356-2 acts as a high-speed data shaper between ADCs and a downstream DSP - performing decimation filtering, FFT pre-amble stages, and packet framing. Each EAB's 16 Kbits of dual-port RAM serves as a FIFO buffer for ADC sample streams, while the 6,656 logic cells implement FIR/coordinate-rotation stages at rates unachievable in software DSP alone. The 3.3 V MultiVolt I/O interfaces directly to common ADC/DAC logic levels without level shifters, simplifying PCB layout on 4-layer stack-ups.
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Low-Volume Production Gate-Array Replacement
For low-volume (<10K units/year) production where a gate-array ASIC NRE is uneconomic, the EPF10K130EBC356-2 provides equivalent capacity at no NRE. Designers can preserve their logic implementation and iterate via SRAM configuration, while the 356-LBGA footprint is a recognized industry-standard form factor. Lead-free variants (suffix -N, -X) satisfy RoHS production lines. The 832 LABs support designs that previously spanned 3-5 discrete 22V10/22V100 PLDs, lowering component count and improving MTBF.
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Legacy Board Maintenance and Field Upgrades
The EPF10K130EBC356-2 is NRND but remains a critical maintenance part for deployed telecom, industrial, and aerospace systems originally designed around the FLEX 10KE family. Long-term supply partners like Rochester Electronics stock the part, and identical-die speed-grade variants (-1, -3) provide same-footprint drop-in replacements during field repair. The JTAG boundary-scan (IEEE 1149.1) supports in-circuit test verification after board-level rework, which is essential for ATE-driven field repair stations.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K130EBC356-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K130EBC356-3 | EPF10K130EBC356-1 | EPF10K130EBC356-1N | EPF10K130EBC356-1X | EPF10K130EBC356-2X |
|---|---|---|---|---|---|---|
| Brand | Altera (now Intel PSG) | Altera | Altera | Altera | Altera | Altera |
| Package | 356-LBGA (35x35 mm) | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same | 356-LBGA - same |
| Speed Grade | -2 | -3 (slower) | -1 (slower) | -1 (slower) | -1 (slower) | -2 (same) |
| Equivalent Gates | 130K | 130K - same | 130K - same | 130K - same | 130K - same | 130K - same |
| Logic Elements / Cells | 6,656 | 6,656 - same | 6,656 - same | 6,656 - same | 6,656 - same | 6,656 - same |
| User I/Os | 274 | 274 - same | 274 - same | 274 - same | 274 - same | 274 - same |
| Supply Voltage | 2.375 V to 2.625 V | 2.375-2.625 V - same | 2.375-2.625 V - same | 2.375-2.625 V - same | 2.375-2.625 V - same | 2.375-2.625 V - same |
| Lead-Free Finish | Tin-lead (standard) | Tin-lead standard | Tin-lead standard | Lead-free (-N) | NiPdAu (-X) | NiPdAu (-X) |
주요 차별점
- Identical-die speed-grade variants preserve the 130K-gate logic content while offering slower timing for cost-sensitive designs (vs EPF10K130EBC356-1)
- Lead-free NiPdAu and -N variants satisfy RoHS production lines without redesign (vs EPF10K130EBC356-2X)
- Available through long-term-availability stocking distributors, mitigating NRND supply risk (vs EPF10K130EBC356-3)
설계 노트
Estimated: at VCCINT = 2.5 V, IccINT approximately 0.5 A under full toggle, plus VCCIO at 3.3 V with 274 I/Os switching 10 pF loads. Decoupling: place one 0.1 uF X7R 0402/0603 per VCC/VCCIO pin cluster, plus 4-6 bulk 10 uF X5R tantalum or ceramic caps distributed around the BGA footprint. The FLEX 10KE datasheet recommends separate analog and digital ground returns joined at a single point under the package.
The 356-LBGA (35x35 mm) requires a minimum 4-layer PCB with continuous VCC/VCCIO planes to deliver current to the inner balls. Microvia (laser-drilled, 0.1 mm) stack-ups are recommended for the inner rows of balls, while 0.5 mm pitch microvia-on-pad is required for the outer rows to break out the BGA. Maintain 50 ohm controlled impedance on clock and JTAG traces; series-terminate clock nets with a 33 ohm resistor at the driver.
Estimated: at VCCINT = 2.5 V and 50% toggle on 6,656 LEs, the device dissipates approximately 1-1.5 W. The 356-LBGA has a typical theta_JA of approximately 15-20 C/W with 4 PCB layers, yielding a junction-temperature rise of 15-30 C above ambient. Commercial (0C-70C) designs at moderate toggle rates require no heatsink, but the floor cabinet must have at least 1 square inch of inner copper connected to GND balls to spread heat.
Do not assume the FLEX 10KE I/O cells are 5 V tolerant on all pins - the datasheet MultiVolt I/O section specifies which pins support 5 V inputs and requires a 5V-tolerant reference voltage on the VREF pin. Mis-wiring 5 V signals to non-tolerant pins will damage the device. For JTAG configuration, route TCK with 10-33 ohm series termination and keep TDI/TMS/TDO short to avoid false-state issues during in-system programming.
규정 준수 정보
Base MPN has tin-lead ball finish (not lead-free). Lead-free variants exist with suffixes -N and -X. FLEX 10KE family is NRND (Not Recommended for New Designs); AEC-Q100 is not applicable to FPGAs.