EPF10K20RC208-4N - FLEX 10K FPGA, 20K Gates, 208-RQFP | Intel
부품 번호: EPF10K20RC208-4N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $23.4 | $11,700.00 |
| 1,000 | $19.95 | $19,950.00 |
EPF10K20RC208-4N 개요
A FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit that can be configured by the customer or designer after manufacturing. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) and are widely used for digital logic prototyping, glue logic, signal processing, and hardware acceleration. The FLEX 10K family specifically introduced Look-Up Table (LUT)-based logic combined with embedded array blocks (EABs) that implement RAM, ROM, and FIFO functions, bridging the gap between earlier PLDs and modern SRAM-based FPGAs.
Key features include 147 user I/Os, 12 EABs for memory implementation, SRAM-based configuration cells, in-system programmability via the ByteBlaster or JTAG interfaces, and support for multi-volt I/O standards including 5.0 V, 3.3 V, and 2.5 V with proper configuration. The 'N' suffix indicates lead-free / Pb-free construction consistent with RoHS requirements. The exposed thermal pad on the 208-BFQFP package aids heat dissipation in moderate-power designs.
From an architectural standpoint, the EPF10K20RC208-4N uses 0.42 µm CMOS process technology with four-input LUTs, dedicated carry chains for arithmetic, and a continuous interconnect fabric routed across LABs. Configuration data is stored in SRAM cells, allowing unlimited re-programmability, which is essential for design iteration and field upgrades. The 208-RQFP footprint is the largest QFP variant in this family, maximizing I/O access for parallel interfaces.
Typical applications include telecommunications line cards, industrial control glue logic, data-acquisition pre-processing, PCI bridge prototypes, and legacy system emulation where large gate counts and abundant I/O are required. Newer Cyclone or MAX series parts generally supersede this device in new designs, but it remains valuable for maintenance of installed systems.
When designing with this device, consider using the Quartus II (legacy) or MAX+PLUS II development environment for synthesis, place-and-route, and bitstream generation. The exposed pad must be soldered to a copper pour for thermal relief and to maintain the mechanical integrity of the fine-pitch RQFP package.
드롭인 대체품: EPF10K20RC208-4N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K20RC208-4N (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Method, Typical Gates, Operating Temperature, Series, Speed Grade.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K20RC208-4
✅ 드롭인✓ 재고 있음
$19.85 / 개
데이터시트 보기 →EPF10K20RC208-3N
✅ 드롭인✓ 재고 있음
$21.95 / 개
데이터시트 보기 →EPF10K20RC208-3
✅ 드롭인✓ 재고 있음
$21.5 / 개
데이터시트 보기 →EPF10K30RC208-4N
✅ 드롭인✓ 재고 있음
$24.9 / 개
데이터시트 보기 →EPF10K20RC208-4N 최대 정격 & 전기적 특성
| Series | FLEX 10K |
| Family | Embedded Programmable Logic Device (EPLD) |
| Typical Gates | 20,000 |
| Logic Cells | 1,152 |
| Logic Array Blocks (LABs) | 144 |
| Embedded Array Blocks (EABs) | 12 |
| Embedded Memory | 12,288 bits |
| User I/O Pins | 147 |
| 핀 수 | 208 |
| 패키지 | 208-BFQFP (RQFP) with exposed pad, 28 x 28 mm |
| 실장 유형 | Surface Mount |
| Speed Grade | -4 (0.6 ns typical propagation delay) |
| 동작 온도 | 0 °C to +70 °C (commercial) |
| 공급 전압 | 4.75 V to 5.25 V (5 V nominal) |
| Technology | 0.42 µm CMOS, SRAM-based configuration |
| Configuration Interface | JTAG / ByteBlaster |
| RoHS 상태 | Compliant (Pb-free, 'N' suffix) |
| Lead-Free | Yes |
EPF10K20RC208-4N 208-bfqfp (rqfp) with exposed pad, 28 x 28 mm 핀 구성 가이드
EPF10K20RC208-4N(208-bfqfp (rqfp) with exposed pad, 28 x 28 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K20RC208-4N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K20RC208-4N 적합 용도: 6 애플리케이션s: Legacy Telecom Line Card Glue Logic, Industrial Control State Machines, Data Acquisition Pre-Processing, Legacy PCI Bridge Prototype, Custom Peripheral Controllers for Embedded Systems, Maintenance of Installed FLEX 10K Systems.
Legacy Telecom Line Card Glue Logic
The EPF10K20RC208-4N fits legacy 5 V telecom line-card designs because its 1,152 logic cells and 147 user I/Os can absorb the bus-bridging, framing, and control-plane glue logic that earlier Altera FLEX 10K designs performed. With 12.288 kbits of embedded memory distributed across 12 EABs, it can implement small FIFO buffers for HDLC-style packet queues without external SRAM. The 208-RQFP footprint exposes enough I/O to drive parallel PCM/E1 framers, TDM buses, and a microprocessor bus simultaneously. Compared with newer Cyclone IV/V parts, the 5 V tolerance and the existing Quartus II bitstream reuse are decisive advantages when keeping installed base hardware alive.
추천
Industrial Control State Machines
Industrial PLC and motion-controller subsystems use the EPF10K20RC208-4N to host deterministic state machines, encoder/decoder logic, and safety interlocks. The 0.6 ns per-element propagation delay of speed grade -4 supports sub-100 MHz control loops, while the 147 I/Os comfortably fan out to stepper drivers, opto-isolated digital I/O, and RS-485 transceivers on the same board. The 0 to 70 °C commercial temperature range is adequate for factory-floor enclosures with air cooling. Designers appreciate that legacy PLC firmware can be ported without migrating the toolchain, shortening validation cycles for long-lifecycle industrial SKUs.
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Data Acquisition Pre-Processing
Multi-channel data-acquisition boards use the EPF10K20RC208-4N to perform front-end preprocessing - decimation, channel multiplexing, gain control, and trigger sequencing - before delivering a serial stream to a host DSP or FPGA. The 12 EABs of the device hold coefficient tables or small cache memories, and 147 user I/Os can interface with parallel ADC/DAC data buses up to 16 bits wide. The exposed thermal pad and 28x28 mm RQFP package spread heat evenly across a 4-layer FR-4 board, supporting sustained throughput in instrumentation chassis. System designers value the deterministic -4 speed grade for predictable latency on the trigger path.
추천
Legacy PCI Bridge Prototype
Pre-PCIe prototyping platforms and embedded PC/104 designs frequently embed the EPF10K20RC208-4N as a 5 V-PCI bus bridge or a custom peripheral controller. With 1,152 logic cells, designers can implement 32-bit PCI target/initiator state machines, FIFOs, and configuration-space registers without external logic. The 147 I/Os split comfortably between a 32-bit PCI bus, a local 32-bit processor bus, and auxiliary GPIO. Existing Quartus II reference designs provide validated PCI cores, dramatically cutting development time for retro-computing and industrial PC builders.
추천
Custom Peripheral Controllers for Embedded Systems
Embedded computing platforms - including medical imaging carts, point-of-sale terminals, and test benches - use the EPF10K20RC208-4N as a custom I/O controller that aggregates sensors, keypads, displays, and communication interfaces into a unified bus for an ARM or MIPS host processor. The 12 kbits of EAB memory can hold LCD framebuffers or look-up tables, while 147 I/Os drive SPI, I2C, GPIO, and parallel LCD interfaces simultaneously. The mature Quartus II toolchain and the FLEX 10K reference designs shorten firmware development for low-volume, high-reliability products where re-validation cost dominates BOM savings.
추천
Maintenance of Installed FLEX 10K Systems
A significant number of deployed base stations, factory controllers, and test instruments still run FLEX 10K designs that cannot be re-platformed without a costly re-certification. The EPF10K20RC208-4N supports this installed base as a like-for-like service replacement, ensuring the same bitstream, pinout, and timing margins as the original. Service stockists typically keep this part on the shelf for 5+ years of after-market support. Choosing the Pb-free -4N variant helps repair operations transition to lead-free assembly lines while keeping the bitstream identical to the original design.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K20RC208-4N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K20RC208-4 | EPF10K20RC208-3N | EPF10K20RC208-3 | EPF10K30RC208-4N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 208-RQFP (BFQFP) 28x28 mm | 208-RQFP (BFQFP) 28x28 mm - same | 208-RQFP (BFQFP) 28x28 mm - same | 208-RQFP (BFQFP) 28x28 mm - same | 208-RQFP (BFQFP) 28x28 mm - same package, different pinout |
| Typical Gates | 20,000 | 20,000 | 20,000 | 20,000 | 30,000 |
| Speed Grade | -4 (~0.6 ns) | -4 (~0.6 ns) | -3 (~0.9 ns, ~30% slower) | -3 (~0.9 ns) | -4 (~0.6 ns) |
| Lead-Free / RoHS | Yes (Pb-free, 'N' suffix) | No (lead-bearing) | Yes (Pb-free) | No (lead-bearing) | Yes (Pb-free) |
| Logic Cells | 1,152 | 1,152 | 1,152 | 1,152 | 1,728 |
| User I/Os | 147 | 147 | 147 | 147 | 147 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Operating Temperature | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C | 0 °C to +70 °C |
주요 차별점
- Lead-free / Pb-free construction with identical electrical performance (vs EPF10K20RC208-4)
- Fastest -4 speed grade available in this package density (vs EPF10K20RC208-3N)
- Mature Quartus II toolchain with abundant reference designs (vs EPF10K30RC208-4N)
설계 노트
The 208-RQFP (BFQFP) package has a thermal pad that MUST be soldered to a copper pour of at least 1 square inch on the top layer of the PCB for reliable operation. Without this pad connection, the device can overheat during sustained logic activity above 50 MHz. Use thermal vias (0.3 mm drill, 1 mm pitch) under the pad to conduct heat to inner copper planes. Estimate junction temperature rise as Tj = Ta + (Pdiss × θJA); for a typical 1 W dissipation the rise is ~30 °C above ambient in still air.
Place at least one 0.1 µF X7R decoupling capacitor within 5 mm of every VCC and VCCIO pin, with a single 47 µF bulk tantalum or polymer capacitor at the board entry. The exposed pad provides the primary GND path - stitch multiple GND vias directly under the pad at 1 mm pitch to minimize ground bounce on high-speed edges. FLEX 10K devices are sensitive to VCCIO ringing; a 10 µF bulk capacitor adjacent to the device is recommended for switching I/O-heavy designs.
Configure the device with Quartus II 13.0sp1 or MAX+PLUS II; bitstreams generated by Quartus Prime (newer) are not compatible with FLEX 10K silicon. During layout, leave 4 mm of trace space around the package edges for rework. Maintain 0.2 mm clearance between any trace and the exposed pad copper to avoid solder shorts during reflow. JTAG chain length must be kept below 10 ns TAP to ensure reliable programming at the ByteBlasterMV speed.
Do NOT migrate Quartus Prime projects directly into FLEX 10K - the architecture is fundamentally different from Cyclone and the toolchain will not produce a valid bitstream. Always re-enter the design in MAX+PLUS II or Quartus II 13.0sp1. Do NOT assume the EPF10K30RC208-4N is drop-in - its pinout differs at the I/O bank boundaries. Do NOT exceed the 5.25 V VCC max even briefly; the SRAM configuration cells are vulnerable to over-voltage and may corrupt the bitstream.
규정 준수 정보
RoHS compliance inferred from 'N' suffix per Altera/Intel ordering nomenclature; REACH and halogen status not confirmed by verified web data. Not AEC-Q100 qualified - not intended for automotive applications.
