EPF10K30AQC240-1N - 30K-Gate FLEX-10KA FPGA, 240-PQFP | Intel
부품 번호: EPF10K30AQC240-1N ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $78.5 | $78.50 |
| 10 | $72.1 | $721.00 |
| 100 | $64.75 | $6,475.00 |
| 500 | $58.3 | $29,150.00 |
| 1,000 | $52.9 | $52,900.00 |
EPF10K30AQC240-1N 개요
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines configurable logic blocks, programmable interconnects, and I/O cells on a single die. The FLEX-10KA family is the industry's first embedded PLD family, providing System-on-a-Programmable-Chip (SOPC) integration with embedded array blocks (EABs) for memory-intensive functions such as FIFOs, RAM, and ROM. FPGAs sit within the broader hierarchy of programmable logic -> PLD -> digital IC -> semiconductor.
Key specifications include 189 user I/Os, a maximum internal frequency of approximately 166.67 MHz, a propagation delay of 0.6 ns, and operation from a 3.3 V supply. The device is fabricated on a 0.3 µm CMOS process and supports the commercial temperature grade (0 °C to 70 °C). It features built-in low-skew clock distribution trees, FastTrack Interconnect for predictable interconnect delays, and tri-state emulation that supports in-system debugging.
The EPF10K30AQC240-1N is built on Altera's Look-Up Table (LUT)-based architecture with continuous FastTrack routing, making timing closure more predictable than segmented interconnect schemes. The embedded array blocks (EABs) can each implement 2,048 bits of RAM, enabling efficient on-chip memory for DSP-style data paths and glue-logic functions.
Typical applications include telecommunications glue logic, industrial control interfaces, legacy system prototyping, and embedded controller replacement where low-to-moderate gate counts are needed. Designers often select this part for upgrading older discrete-TTL designs into a single programmable device.
When designing with this FPGA, ensure your JTAG chain handles the device's boundary-scan and configuration requirements, and verify timing closure at the -1 speed grade in your synthesis tool. Quiescent power is minimized by tying unused I/Os to a defined logic level through the Quartus pin assignment file.
This page synthesizes distributor pricing, drop-in speed-grade and pin-compatible alternatives, and practical design notes not found in the original Altera datasheet - data compiled as of 2026-09-11.
드롭인 대체품: EPF10K30AQC240-1N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K30AQC240-1N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Configuration Method, Internal Frequency (max), Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K30AQC240-1
✅ 드롭인✓ 재고 있음
$65 / 개
데이터시트 보기 →EPF10K30AQC240-2N
✅ 드롭인✓ 재고 있음
$43 / 개
데이터시트 보기 →EPF10K30AQC240-3N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF10K30AQC208-3N
✅ 드롭인✓ 재고 있음
$19.1 / 개
데이터시트 보기 →EPF10K30AQC208-1N
✅ 드롭인✓ 재고 있음
$21.4 / 개
데이터시트 보기 →EPF10K30AQC208-3
✅ 드롭인✓ 재고 있음
$15.4 / 개
데이터시트 보기 →EPF10K30AQC240-1N 최대 정격 & 전기적 특성
| Family | FLEX-10KA |
| Typical Gates | 30,000 |
| Logic Elements (LEs) | 1,728 |
| Logic Array Blocks (LABs) | 216 |
| Embedded SRAM Bits | 12,288 bits |
| User I/Os | 189 |
| 패키지 | 240-pin PQFP (BFQFP), gull-wing leads |
| 공급 전압 | 3.3 V |
| Internal Frequency (max) | 166.67 MHz |
| Propagation Delay | 0.6 ns |
| Process Technology | 0.3 µm CMOS |
| Speed Grade | -1 |
| 동작 온도 | 0 °C to +70 °C (commercial) |
| 실장 유형 | Surface Mount (gull wing) |
| Configuration Method | SRAM-based, JTAG / PS / AS supported |
EPF10K30AQC240-1N 240-pin pqfp (bfqfp), gull-wing leads 핀 구성 가이드
EPF10K30AQC240-1N(240-pin pqfp (bfqfp), gull-wing leads 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K30AQC240-1N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K30AQC240-1N 적합 용도: 6 애플리케이션s: Legacy Telecom Glue Logic, Industrial Control Interface Bridge, Embedded Controller Replacement, Test & Measurement Front-End, Display Controller / Video Timing Generator, Avionics / Defense Legacy Subsystem (per DLA SMD).
Legacy Telecom Glue Logic
The EPF10K30AQC240-1N's 30K-gate capacity and 189 user I/Os make it a strong fit for telecom backplane glue logic: address decoding, bus arbitration, and protocol bridging between TDM/E1 framers and microprocessors. Its 166.67 MHz internal frequency and 0.6 ns propagation delay support the timing budgets of 50–100 MHz legacy telecom buses, and the embedded 12,288 SRAM bits allow on-chip FIFO buffering of TDM data streams. Place the FPGA between the framer and the host CPU; its 3.3 V I/O bank drives standard HSTL/SSTL memory interfaces directly. Designers benefit from the FLEX-10KA EABs to implement dual-port RAM for elastic stores.
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Industrial Control Interface Bridge
In factory automation, the EPF10K30AQC240-1N bridges legacy parallel fieldbuses (e.g., ISA, VME, parallel I/O racks) to modern serial interfaces. Its 189 I/Os handle the wide parallel buses of older PLCs and motion controllers, while the on-chip EABs implement protocol-conversion FIFOs and cycle-stretch buffers. The commercial 0 °C to +70 °C temperature range suits enclosed control cabinets; the 3.3 V core with multi-voltage I/O support (5 V tolerant with resistor dividers) drives 5 V industrial logic directly. Its -1 speed grade is sufficient for sub-100 MHz control loops and reduces per-unit cost vs faster grades.
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Embedded Controller Replacement
Engineers use the EPF10K30AQC240-1N as a one-chip replacement for multiple discrete TTL/CMOS glue-logic ICs on legacy boards: address latches, bus transceivers, wait-state generators, and custom state machines are absorbed into a single reprogrammable device. The 30K-gate capacity covers most 8/16-bit embedded designs, while 12,288 SRAM bits replace small SRAM/ROM chips used for lookup tables. The 240-pin PQFP's gull-wing leads survive hand-rework and rework-repair processes better than fine-pitch BGAs - critical when maintaining long-lifecycle industrial equipment. JTAG-based configuration allows in-field firmware updates via the existing boundary-scan infrastructure.
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Test & Measurement Front-End
Bench-top instruments (logic analyzers, protocol testers, custom ATE fixtures) historically used the EPF10K30AQC240-1N for pattern generation, capture sequencing, and stimulus routing. The 189 I/Os interface to parallel ADC/DAC front-ends, while the embedded EABs store trigger sequences and pre-computed stimulus patterns. The 166.67 MHz Fmax supports 100+ MHz pattern rates for digital stimulus, and the deterministic FastTrack interconnect gives repeatable capture-window timing essential for production testers. Designers benefit from SRAM-based configuration: a test fixture can be reprogrammed per device-under-test (DUT) without re-spinning the PCB.
추천
Display Controller / Video Timing Generator
The EPF10K30AQC240-1N drives legacy flat-panel and CRT timing generation, frame-buffer arbitration, and overlay blending in industrial HMIs. Its 189 user I/Os handle 18/24-bit parallel RGB buses and sync signals directly; 12,288 SRAM bits implement small line buffers for character/overlay generation. The 0.6 ns propagation delay and 166.67 MHz internal Fmax comfortably meet pixel clock budgets up to ~100 MHz for XGA-resolution panels. The 3.3 V core plus 5-V-tolerant I/Os interface to LVDS transmitter chips for higher-resolution designs, and Quartus fit reports indicate the FLEX-10KA die supports multi-layer video overlays within its 30K-gate budget.
추천
Avionics / Defense Legacy Subsystem (per DLA SMD)
Although the EPF10K30AQC240-1N is the commercial-grade variant, the identical silicon is widely used in defense subsystems certified under SMD (Standard Microcircuit Drawing) references. The 189 I/Os and 30K-gate capacity suit mid-complexity avionics buses (MIL-STD-1553 bridging, ARINC 429 monitoring, discrete I/O aggregation). Embedded EABs hold lookup tables for sensor calibration and BIT (built-in test) patterns. Designers should note that new avionics designs should target current radiation-tolerant FPGAs (e.g., Microsemi/RT PolarFire, Xilinx Kintex UltraScale XQ), but legacy maintenance programs continue to specify the FLEX-10KA family for form-fit-function continuity.
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추천 제품 요약
엔지니어링 참조 데이터: EPF10K30AQC240-1N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K30AQC240-1 | EPF10K30AQC240-2N | EPF10K30AQC240-3N | EPF10K30AQC208-3N | EPF10K30AQC208-1N | EPF10K30AQC208-3 |
|---|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP | 240-pin PQFP |
| Family | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KA | FLEX-10KA |
| Speed Grade | -1 | -1 | -2 (faster) | -3 (fastest) | -3 | -1 | -3 |
| Logic Elements | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 | 1,728 |
| User I/Os | 189 | 189 | 189 | 189 | 189 | 189 | 189 |
| Embedded SRAM | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits | 12,288 bits |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Industry's first embedded PLD family (SOPC) integration (vs EPF10K30AQC240-1)
- Faster speed grade option with identical die (vs EPF10K30AQC240-1)
- Same 240-PQFP family compatibility across the FLEX-10KA line (vs EPF10K30AQC208-3N (Site MPN list))
설계 노트
The EPF10K30AQC240-1N core draws approximately 100–300 mA at 3.3 V depending on utilization and toggle rate; I/O current scales with bank count and drive strength. Place a 100 µF tantalum bulk capacitor plus 0.1 µF ceramic decoupling within 5 mm of each VCCINT and VCCIO pin pair. Unused I/O banks should be configured as inputs with weak pull-ups in the Quartus pin assignment file to minimize switching current on floating inputs.
PQFP-240 has a theta_JA of approximately 35–40 °C/W (estimated from JEDEC EIA/JESD51 test board with 0 lfpm airflow). At full 30K-gate utilization with 100% toggle rate and 189 active I/Os at 8 mA drive, total power may reach 1.5–2 W, giving a junction temperature rise of 50–80 °C above ambient. The commercial 0–70 °C grade has only ~50 °C of margin at 25 °C room temperature - forced airflow or heatsink attachment is recommended for industrial-cabinet ambient temperatures above 50 °C.
PQFP-240 gull-wing leads with 0.5 mm pitch require SO-style PCB footprints with at least 0.2 mm pad-to-pad clearance. Route all 189 user I/Os on inner signal layers with via-in-pad avoided - use short dog-bone fan-outs to inner layers. Keep configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL[3:0], TCK, TMS, TDI, TDO) on a dedicated layer or guarded routing to prevent crosstalk into JTAG signals during in-system programming.
Three pitfalls to avoid on FLEX-10KA designs: (1) configuring MSEL[3:0] incorrectly for your configuration mode (AS vs PS vs JTAG) - consult the FLEX-10KA device handbook chapter on configuration; (2) leaving JTAG TCK floating, which can latch spurious configuration data into the device; (3) using the -1 speed grade for designs that fail timing at -2 or -3 - check Quartus timing reports before committing to a speed grade, as Quartus fit can be pessimistic by 10–15%.
PQFP-240 leads introduce ~6–8 nH of package inductance (estimated for ~10 mm lead length), which creates overshoot/undershoot on high-edge-rate outputs. Series-dampening resistors of 22–33 Ω placed within 25 mm of the FPGA pin are recommended for outputs driving backplane connectors or long traces (>50 mm). For clock outputs, place the series resistor as close to the FPGA pin as possible to dampen package-parasitic ringing.
규정 준수 정보
RoHS compliance inferred from the 'N' suffix in MPN (Altera/Intel Pb-free designation convention). AEC-Q100 not applicable for commercial-grade FPGA. Halogen-free status not specified in available data.
