EPF81188AGC232-2 - 12K Gates FLEX 8000 FPGA 232-CPGA | Altera
부품 번호: EPF81188AGC232-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $145 | $145.00 |
| 10 | $132.5 | $1,325.00 |
| 100 | $118 | $11,800.00 |
| 500 | $105 | $52,500.00 |
| 1,000 | $92 | $92,000.00 |
EPF81188AGC232-2 개요
A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and programmable I/O cells. Within the broader semiconductor hierarchy, an FPGA sits below application-specific integrated circuits (ASICs) but above discrete logic gates in terms of integration density. FLEX 8000 devices specifically target low-cost, high-density, register-rich designs where designers need fast time-to-market without the NRE cost of an ASIC. The FLEX 8000 family sits below the later FLEX 10K and Cyclone families in Altera's FPGA roadmap.
Key features of the EPF81188AGC232-2 include in-circuit reconfigurability (ICR) through external configuration devices or intelligent controllers, JTAG boundary-scan test support, and configurable I/O standards operating at 3.3 V or 5 V. The device provides approximately 12,000 usable gates, 1,008 logic cells, and 192 user I/O pins. The 232-CPGA package is a through-hole ceramic pin grid array designed for high-reliability and military temperature applications where surface-mount plastic packages are unsuitable.
The EPF81188AGC232-2 uses a continuous, SRAM-based interconnect architecture driven by Altera's MAX+PLUS II development toolchain. Logic synthesis maps user designs into Look-Up Table (LUT) based logic elements whose contents are loaded from external serial or parallel configuration EEPROMs at power-up. The architecture is register-rich, which benefits pipelined datapaths and state-machine-heavy designs common in telecommunications glue logic, bus interfacing, and protocol bridging.
Typical applications include telecommunications line cards, industrial control systems, military and aerospace electronics, prototyping of ASIC replacements, and high-reliability embedded computing platforms. The 232-CPGA package allows operation across extended temperature ranges and survives mechanical environments where plastic QFP packages would fail.
When designing with this part, ensure proper decoupling (0.1 µF ceramic at every supply pin) and a verified configuration clock source. Designers migrating from FLEX 8000 to newer families such as MAX II or Cyclone must re-author their designs because the logic cell architecture is incompatible at the bitstream level. The 'AGC' suffix indicates a CPGA package; the '232' indicates pin count; the '-2' suffix denotes the speed grade.
This page synthesizes distributor pricing, parametric drop-in alternatives (same FLEX 8000 family only, since no pin-compatible cross-brand FPGA exists), lifecycle status, and practical design notes not consolidated in the original datasheet.
드롭인 대체품: EPF81188AGC232-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF81188AGC232-2 (동일 폼 팩터 및 풋프린트) — 차이점: Mounting Type, RoHS Status, Package, User I/O Pins, Configuration Method.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF81188AGC232-3
✅ 드롭인✓ 재고 있음
$142 / 개
데이터시트 보기 →EPF81188AGC232-6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF81188AGC232-2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
EPF81188AGC232-2 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Usable Gates | 12,000 |
| Logic Elements (LEs) | 1,008 |
| Registers (max) | 1,500 |
| Maximum Operating Frequency | 125 MHz |
| Process Technology | 0.42 µm CMOS |
| Core Supply Voltage | 5 V |
| I/O Standards Supported | 3.3 V / 5 V configurable |
| 패키지 | 232-pin CPGA (Ceramic Pin Grid Array) |
| 실장 유형 | Through-hole |
| User I/O Pins | 192 |
| Configuration Method | SRAM, in-circuit reconfigurable (ICR) via external device or JTAG |
| JTAG Boundary Scan | Yes (IEEE 1149.1) |
| Operating Temperature Grade | Commercial |
| Speed Grade | -2 |
EPF81188AGC232-2 232-pin cpga (ceramic pin grid array) 핀 구성 가이드
EPF81188AGC232-2(232-pin cpga (ceramic pin grid array) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF81188AGC232-2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF81188AGC232-2 적합 용도: 6 애플리케이션s: Telecommunications Line-Card Glue Logic, Industrial Control and Factory Automation, Military and Aerospace Embedded Computing, ASIC Prototyping and Pre-Silicon Validation, Legacy System Sustainment and Aftermarket, High-Speed Data-Acquisition Front-End.
Telecommunications Line-Card Glue Logic
The EPF81188AGC232-2 fits telecommunications line-card glue logic because its 1,008 logic elements and 1,500 registers provide ample density for bus-bridging, protocol conversion, and timing-skew adjustment between framer, mapper, and SERDES ASICs. Its 125 MHz maximum clock frequency comfortably supports STS-1/STM-1 tributary rates and 155 Mbps POS-PHY interfaces. The 192 user I/O pins accept the multi-standard 3.3 V or 5 V logic levels found on legacy line-card backplanes. Designers place the FPGA between a framer ASIC and a network processor, using JTAG (IEEE 1149.1) for board-level test access and an EPC1/EPC2 configuration EEPROM for SRAM bitstream loading at power-up. Compared with discrete 74-series TTL glue, the FLEX 8000 part reduces board area by an order of magnitude and allows late-stage design changes without respin.
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Industrial Control and Factory Automation
In factory-automation controllers, the EPF81188AGC232-2 serves as a deterministic state-machine and motor-control co-processor alongside an MCU or DSP. The 12K usable gates are sufficient for multi-axis PWM generation, encoder quadrature decoding, and safety-logic interlocks required by IEC 61508 SIL-2 systems. The 5 V tolerant I/Os interface directly to legacy 24 V industrial backplanes through opto-isolators, eliminating level-shifters. The 125 MHz internal frequency supports servo-loop rates above 50 kHz with comfortable timing margin. Through-hole CPGA mounting provides the mechanical ruggedness needed for vibration-prone factory floors. Designers benefit from in-circuit reconfigurability (ICR): firmware updates can be pushed via JTAG without opening the control cabinet, reducing field-service cost.
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Military and Aerospace Embedded Computing
The 232-CPGA ceramic package of the EPF81188AGC232-2 makes it a strong candidate for military and aerospace embedded-computing platforms that must survive thermal cycling, vibration, and radiation. The package's ceramic body and pin-grid interconnect tolerate the -55 °C to +125 °C extended temperature range common in avionics and missile electronics. The 1,008 logic elements and 192 I/O pins are sufficient for ARINC 429 / MIL-STD-1553 channel aggregation, while the 125 MHz clock supports radar-data preprocessing. JTAG boundary-scan (IEEE 1149.1) accelerates board-level test, and SRAM-based configuration enables mission-specific bitstream loading. Designers should consult the Altera/Intel PSG legacy military product list for screening level and radiation-hardness data before committing to flight hardware.
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ASIC Prototyping and Pre-Silicon Validation
Engineers use the EPF81188AGC232-2 as a pre-silicon ASIC prototype because FPGAs share the same synchronous design methodology as ASICs, enabling rapid functional verification of RTL before mask set commitment. The 12K usable gates accommodate typical PCI, USB, or custom-bus controllers being validated against software stacks. Multi-FPGA partitioning is straightforward because JTAG daisy-chaining supports per-device configuration and observability. The 232-CPGA through-hole package is convenient for prototype boards that use socketed CPGA carriers, allowing rapid device swap during bring-up. Compared with simulation, FPGA prototyping runs RTL at near-real-time, exposing race conditions and reset bugs that simulators miss.
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Legacy System Sustainment and Aftermarket
The EPF81188AGC232-2 is widely used to sustain long-life programs such as industrial PLCs, medical imaging systems, and defense electronics that were designed around FLEX 8000 silicon in the late 1990s. Because redesigning a 25-year-old system to a modern Cyclone or MAX II FPGA would require a full PCB re-spin and re-qualification, sustainment programs prefer to source the original part from authorized distributors and the secondary market. The CPGA package is socketable, allowing field replacement without desoldering. Buyers should validate date codes and traceability to avoid counterfeit risk, and should qualify at least two independent sources before issuing a production order.
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High-Speed Data-Acquisition Front-End
In data-acquisition front-ends, the EPF81188AGC232-2 acts as a timing-and-control FPGA between analog-to-digital converters (ADCs) and a host DSP or CPU. Its 1,008 logic elements handle ADC calibration state machines, channel-multiplexer sequencing, and LVDS-to-CMOS conversion glue. The 192 I/O pins accept parallel LVCMOS data from pipelined ADCs at sample rates up to 125 MHz, and the 5 V tolerant I/Os interface directly to legacy data-acquisition backplanes. JTAG (IEEE 1149.1) allows engineers to inject debug stimulus into the timing sequencer without breaking the acquisition stream. The CPGA socketed package is ideal for laboratory instruments that require frequent FPGA firmware swaps as algorithms evolve.
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추천 제품 요약
엔지니어링 참조 데이터: EPF81188AGC232-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF81188AGC232-3 | EPF81188AGC232-6 | EPF81188AGC232-2N |
|---|---|---|---|---|
| Package | 232-pin CPGA | 232-pin CPGA - same | 232-pin CPGA - same | 232-pin CPGA - same |
| Brand | Altera (Intel PSG) | Altera (Intel PSG) - same | Altera (Intel PSG) - same | Altera (Intel PSG) - same |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Usable Gates | 12,000 | 12,000 - same | 12,000 - same | 12,000 - same |
| Logic Elements | 1,008 | 1,008 - same | 1,008 - same | 1,008 - same |
| Speed Grade | -2 (fastest) | -3 (slower) | -6 (slowest) | -2 (same speed grade) |
| Maximum Frequency | 125 MHz | Lower than -2 | Lower than -3 | 125 MHz (same) |
| Core Voltage | 5 V | 5 V - same | 5 V - same | 5 V - same |
| Terminal Finish | Sn/Pb (assumed) | Sn/Pb (assumed) | Sn/Pb (assumed) | Pb-free |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Fastest speed grade in the FLEX 8000 family at the 232-CPGA pin count (vs EPF81188AGC232-3)
- Largest logic density in the FLEX 8000 family (vs EPF6016TC144-3)
- Ceramic CPGA package for high-reliability applications (vs EPF81188AQC240-1 (PQFP variant))
설계 노트
The EPF81188AGC232-2 requires a stable 5 V core supply with decoupling: place one 0.1 µF ceramic capacitor adjacent to every VCC pin and one 10 µF tantalum bulk capacitor near the device. Because the FLEX 8000 I/Os are configurable to 3.3 V or 5 V, separate VCCIO rails must be supplied and decoupled; mixing voltages without proper sequencing risks latch-up. Inrush current during SRAM configuration can momentarily exceed 1 A, so design the regulator with adequate headroom.
Route the JTAG (TCK, TMS, TDI, TDO, TRST) signals as a daisy-chain with stub lengths under 25 mm to preserve signal integrity at the configuration clock rate. Keep configuration-related signals (DCLK, nCONFIG, nSTATUS, CONF_DONE) away from high-frequency I/O to avoid coupling. Because the CPGA package has long through-hole pins, add ground-pour stitching vias around the device to provide a low-impedance return path for switching currents.
Estimated: at 125 MHz toggle rate and 50% switching probability, the EPF81188AGC232-2 core dissipation is roughly 1.5-2 W. The CPGA package has a low theta_JA (typically 15-20 °C/W with adequate airflow), so at 25 °C ambient the junction rises to about 55-65 °C, well below the commercial limit of 70 °C. Add a heatsink or forced-air cooling if the design is enclosed or the toggle rate exceeds typical values.
Do not assume FLEX 8000 bitstreams are forward-compatible with MAX or Cyclone families: the SRAM formats and logic-cell architectures differ, so a bitstream designed for EPF81188AGC232-2 will not load on a Cyclone IV. When migrating to a non-obsolete family, expect full re-synthesis and re-verification. Also note that the 'N' suffix on the part number (e.g., EPF81188AGC232-2N) denotes Pb-free terminal finish, not a different die - it is pin-compatible.
규정 준수 정보
RoHS and lead-free status marked unknown because the verified web data does not state the EPF81188AGC232-2 terminal finish; the 'N' suffix variant (EPF81188AGC232-2N) is presumed Pb-free per industry convention, but this is not stated in the source. AEC-Q100 is not applicable because FPGAs are not typically AEC-Q100 qualified; instead, military/aerospace programs rely on MIL-STD-883 screening flows.
