EPF81500AQC240-2 - FLEX 8000 FPGA 1296 LE 240-BFQFP | Altera
부품 번호: EPF81500AQC240-2 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $90.83 | $90.83 |
| 10 | $82.5 | $825.00 |
| 100 | $74.2 | $7,420.00 |
| 500 | $67.9 | $33,950.00 |
| 1,000 | $61.4 | $61,400.00 |
EPF81500AQC240-2 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit that can be electrically reconfigured after manufacture to implement arbitrary digital logic functions. FPGAs sit hierarchically between programmable logic devices (CPLDs) and application-specific integrated circuits (ASICs), combining high gate density, parallel processing, and rapid time-to-market. The FLEX 8000 family uses a continuous interconnect architecture where horizontal and vertical routing tracks span the entire device, providing predictable timing and uniform routing delays.
Key features include 1,296 logic elements, 162 LABs, 181 user I/Os, embedded SRAM configuration cells, in-system programmability through a ByteBlaster or BitBlaster interface, and operation from a single 5 V supply. The device supports JTAG boundary-scan testing (IEEE 1149.1) and a 4-bit or 8-bit parallel configuration mode, allowing fast on-board programming.
Architecturally, the EPF81500AQC240-2 is built on a CMOS SRAM process with 5.0 V tolerant I/O cells. Each LAB contains eight Logic Elements (LEs) consisting of a 4-input look-up table, a programmable flip-flop, and dedicated carry and cascade chains for fast arithmetic and wide fan-in operations. This structure makes the device suitable for implementing register-rich glue logic, state machines, and small-to-medium bus interfaces.
Typical applications include telecom interface prototyping, industrial control glue logic, bus-bridging glue logic between microprocessors and peripherals, and replacement of multiple discrete MSI/LSI logic packages. The BFQFP-240 footprint with 32 mm × 32 mm body provides through-hole-compatible gull-wing leads for legacy designs and easy rework during prototyping.
When designing with this device, plan for configuration memory retention: the SRAM cells require a configuration download on every power-up via a serial EPROM, JTAG, or parallel controller. The 5 V supply rail requires proper decoupling with 0.1 µF and 10 µF capacitors close to the VCC pins to suppress switching noise.
This page synthesizes distributor pricing from DigiKey, Mouser, Heisener, and Octopart, together with drop-in same-brand FLEX 8000 variants, and practical design notes not collated on any single manufacturer page.
드롭인 대체품: EPF81500AQC240-2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF81500AQC240-2 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Configuration Method, Process Technology, Speed Grade, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF81500AQC240-3
✅ 드롭인✓ 재고 있음
$21.75 / 개
데이터시트 보기 →EPF81188AQC240-2
✅ 드롭인✓ 재고 있음
$27.1 / 개
데이터시트 보기 →EPF81188AQC240-3
✅ 드롭인✓ 재고 있음
$30 / 개
데이터시트 보기 →EPF81188AQC240-4
✅ 드롭인✓ 재고 있음
$18.2 / 개
데이터시트 보기 →EPF81500AGC280-3
✅ 드롭인✓ 재고 있음
$175 / 개
데이터시트 보기 →EPF81500AQC240-2 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Logic Elements | 1296 |
| Number of Logic Array Blocks (LABs) | 162 |
| Number of I/Os | 181 |
| 공급 전압 | 4.75 V to 5.25 V |
| Speed Grade | -2 |
| 패키지 | 240-BFQFP (240-pin Fine-pitch QFP, 32x32 mm) |
| 실장 유형 | Surface Mount (gull-wing leads) |
| Configuration Memory | SRAM (volatile, requires configuration download on power-up) |
| Configuration Mode | Serial (BitBlaster) or parallel JTAG |
| Operating Temperature (Commercial) | 0 C to +70 C |
| Process Technology | CMOS SRAM, 5 V tolerant I/O |
| JTAG Support | IEEE 1149.1 boundary-scan |
EPF81500AQC240-2 240-bfqfp (240-pin fine-pitch qfp, 32x32 mm) 핀 구성 가이드
EPF81500AQC240-2(240-bfqfp (240-pin fine-pitch qfp, 32x32 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF81500AQC240-2.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF81500AQC240-2 적합 용도: 6 애플리케이션s: Legacy Telecom Interface Bridging, Industrial Control Glue Logic Replacement, Bus-Bridging for Legacy Microprocessor Systems, Medical Equipment Long-Life Spare Parts, Aerospace Avionics Legacy Spares, Military Communication Equipment.
Legacy Telecom Interface Bridging
The EPF81500AQC240-2 fits telecom interface bridging because its 181 user I/Os and 1296 logic elements can implement multi-channel UART, SPI, and parallel bus bridges simultaneously. At 5 V tolerance, it interfaces directly with legacy telecom line cards that still use TTL or 5 V CMOS peripherals without level shifters. The 162 LABs support wide parallel data paths for TDM bus termination. Design tip: use the dedicated global clock networks for synchronous serial bit-clock distribution to keep skew within one LAB across the device.
추천
Industrial Control Glue Logic Replacement
The EPF81500AQC240-2 replaces dozens of 74-series MSI logic packages on legacy industrial control boards, reducing PCB area by up to 70%. With 1,296 logic elements, it implements PLC ladder-replacement logic, encoder interface state machines, and PID control loops in a single device. The 240-BFQFP package supports through-hole rework, valuable when servicing long-life industrial systems with 15-20 year field-deployment horizons.
추천
Bus-Bridging for Legacy Microprocessor Systems
The EPF81500AQC240-2's 181 I/Os and 5 V tolerance make it an ideal bus-bridge between legacy 8051, 68k, or PowerPC microprocessors and modern peripherals. The 1,296 logic elements comfortably implement wait-state insertion, byte-swapping, and interrupt-controller functions. The SRAM configuration allows firmware updates via JTAG in the field, supporting long-life medical and avionics systems where PCB rework is impractical.
추천
Medical Equipment Long-Life Spare Parts
The EPF81500AQC240-2 serves medical equipment manufacturers maintaining FDA-locked BOMs for diagnostic imaging and patient monitoring systems. Because re-validation cost dominates replacement cost, legacy FPGAs remain in production spare parts inventories for 15+ years. The 240-BFQFP package is hand-solderable, simplifying field service. Rochester Electronics and authorized aftermarket channels stock this part for medical OEMs as of 2026-09-12.
추천
Aerospace Avionics Legacy Spares
The EPF81500AQC240-2 supports avionics DO-254-certified systems where design re-validation is prohibitively expensive. Its 5 V tolerance interfaces with legacy cockpit displays, flight-control sensors, and navigation receivers. The 162 LABs and JTAG boundary-scan simplify production testing per DO-254 objectives. Pin-compatible FLEX 8000 variants allow sourcing flexibility for long-tail avionics support programs spanning decades.
추천
Military Communication Equipment
The EPF81500AQC240-2 enables MIL-STD-188 and tactical radio interface logic in military communication equipment, where 5 V tolerance and robust 240-BFQFP mechanical packaging are valued. With 1,296 logic elements, the device implements encryption handshake state machines, link-layer protocols, and signal-conditioning glue logic. JTAG boundary-scan satisfies military testability requirements, and authorized aftermarket supply channels ensure long-term availability for defense procurement programs.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF81500AQC240-2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF81500AQC240-3 | EPF81188AQC240-2 | EPF81188AQC240-3 | EPF81188AQC240-4 |
|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 240-BFQFP | 240-BFQFP | 240-BFQFP | 240-BFQFP | 240-BFQFP |
| Logic Elements | 1296 | 1296 | 1188 | 1188 | 1188 |
| Number of LABs | 162 | 162 | 148 | 148 | 148 |
| User I/Os | 181 | 181 | 177 | 177 | 177 |
| Supply Voltage | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V | 4.75 V to 5.25 V |
| Speed Grade | -2 (faster) | -3 | -2 | -3 | -4 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
주요 차별점
- Highest logic density within FLEX 8000 240-BFQFP family (vs EPF81188AQC240-2)
- Faster speed grade -2 reduces timing closure pressure (vs EPF81500AQC240-3)
- Maximum I/O count within the FLEX 8000 BFQFP family (vs EPF81188AQC240-2)
설계 노트
The EPF81500AQC240-2 requires a tightly regulated 5 V supply (4.75 V to 5.25 V) with bulk decoupling of 33 µF tantalum and 0.1 µF ceramic capacitors placed within 6 mm of every VCC and GND pin pair. Because FLEX 8000 devices exhibit high inrush current during configuration (up to 300 mA peak), use a soft-start circuit on the regulator to prevent supply collapse. Estimated: configuration inrush current 300 mA peak based on typical FLEX 8000 family datasheet values.
Configuration memory is volatile SRAM - the EPF81500AQC240-2 must be reconfigured on every power-up via a serial configuration EPROM (EPC1, EPC1441) or JTAG download. Designs that forget this step appear to 'brick' on power-up. Always include a configuration clock source and confirm the nCONFIG and nSTATUS pins have proper pull-ups. Do not assume factory pre-configuration - this part ships unconfigured.
Estimated: at 100% logic utilization with 5.0 V supply and 25 MHz clock, typical FLEX 8000 power dissipation is around 1.2 W to 1.8 W, requiring copper pour on inner PCB layers to maintain junction temperature below 125 C. The 240-BFQFP package (theta_JA approximately 25 C/W on a 4-layer JEDEC test board) provides moderate thermal headroom; designs operating above 70 C ambient should include thermal vias under the exposed die flag area or use forced-air cooling.
규정 준수 정보
RoHS/REACH compliance not explicitly documented in the Verified Web Data for this legacy FLEX 8000 part. AEC-Q100 not applicable for FPGA logic devices.
