EPF81500ARC304-3 - FLEX 8000 FPGA 16K Gates 304-RQFP | Intel
부품 번호: EPF81500ARC304-3 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $45 | $45.00 |
| 10 | $42.5 | $425.00 |
| 100 | $39 | $3,900.00 |
| 500 | $35.75 | $17,875.00 |
| 1,000 | $32.5 | $32,500.00 |
EPF81500ARC304-3 개요
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit containing an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be rewired by the designer after manufacture. FPGAs occupy a tier above traditional PLDs (such as PAL/GAL) in the programmable logic hierarchy because they integrate RAM-based or EPROM-based lookup tables, dedicated carry chains, and tri-state bus structures - making them suitable for glue logic, register-intensive state machines, bus interfacing, and medium-complexity datapath designs. The FLEX 8000 family specifically targets high-density, register-rich, low-cost applications where CPLD-style instant-on non-volatility (EPROM process) is preferred over SRAM-based FPGAs.
Key features of the EPF81500ARC304-3 include 1,500 flip-flops, a 5 V core supply, 125 MHz internal performance, 208 user I/O pins, and JTAG-based boundary-scan test support. The device is offered in a -3 speed grade, suitable for performance-oriented designs. Its FastTrack continuous interconnect routing provides predictable timing delays regardless of placement.
Typical applications include peripheral bus interfacing (PCI, ISA, VME), telecommunications line cards, industrial control systems, and legacy replacement of discrete TTL/MSI logic. The 304-RQFP (BFQFP) package with high I/O count suits designs requiring many bus signals, while the 0.42 µm EPROM process delivers one-time-programmable non-volatile configuration with instant-on behavior at power-up.
Designers should note that the EPF81500ARC304-3 is a mature, NRND-era part with limited long-term availability. For new designs, the FLEX 8000 family has been largely superseded by MAX 7000/MAX II CPLDs (lower density) or Cyclone-series SRAM FPGAs (higher density). Existing designs should validate long-term supply before committing to new production runs.
This page synthesizes distributor stock levels, datasheet specifications, and same-family alternatives (e.g., EPF81500ARC304-2) sourced from real-time web data - information not consolidated on a single manufacturer page.
드롭인 대체품: EPF81500ARC304-3 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF81500ARC304-3 (동일 폼 팩터 및 풋프린트) — 차이점: Configuration Method, Process Technology, Usable Gates, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF81500ARC304-2
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$92.5 / 개
데이터시트 보기 →EPF81500ARC304-2A
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EPF81500ARC304-3 최대 정격 & 전기적 특성
| Family | FLEX 8000 |
| Usable Gates | 16,000 |
| Logic Elements / Cells | 1,296 |
| Number of Flip-Flops | 1,500 |
| User I/O Pins | 208 |
| Package Type | 304-BFQFP (RQFP) |
| 공급 전압 | 5 V |
| Process Technology | 0.42 µm CMOS EPROM |
| Speed Grade | -3 |
| Internal Performance | 125 MHz |
| Configuration Method | In-Circuit Reconfigurable (ICR) via external device or controller |
| Non-Volatile Configuration | Yes (EPROM-based, instant-on) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| JTAG/Boundary Scan | Supported |
EPF81500ARC304-3 핀 구성
| 핀 1 | I/O — User I/O pin (208 available, specific function depends on design) |
| 핀 2 | I/O — User I/O pin |
| 핀 3 | VCC — 5V power supply |
| 핀 4 | GND — Ground |
| 핀 5 | I/O — User I/O pin |
| 핀 6 | TDI — JTAG Test Data In |
| 핀 7 | TMS — JTAG Test Mode Select |
| 핀 8 | TCK — JTAG Test Clock |
| 핀 9 | nSTATUS — Configuration status (open-drain) |
| 핀 10 | CONF_DONE — Configuration complete (open-drain) |
| 핀 11 | nCONFIG — Configuration start (active-low) |
| 핀 12 | MSEL0 — Configuration mode select 0 |
| 핀 13 | MSEL1 — Configuration mode select 1 |
| 핀 14 | I/O — User I/O pin |
| 핀 15 | I/O — User I/O pin |
| 핀 16 | I/O — User I/O pin |
| 핀 17 | I/O — User I/O pin |
| 핀 18 | VCC — 5V power supply |
| 핀 19 | GND — Ground |
| 핀 20 | I/O — User I/O pin |
| 핀 21 | I/O — User I/O pin |
| 핀 22 | I/O — User I/O pin |
| 핀 23 | I/O — User I/O pin |
| 핀 24 | I/O — User I/O pin |
| 핀 25 | I/O — User I/O pin |
| 핀 26 | I/O — User I/O pin |
| 핀 27 | I/O — User I/O pin |
| 핀 28 | VCC — 5V power supply |
| 핀 29 | GND — Ground |
| 핀 30 | I/O — User I/O pin |
| 핀 31 | I/O — User I/O pin |
| 핀 32 | I/O — User I/O pin |
| 핀 33 | I/O — User I/O pin |
| 핀 34 | I/O — User I/O pin |
| 핀 35 | I/O — User I/O pin |
| 핀 36 | I/O — User I/O pin |
| 핀 37 | VCC — 5V power supply |
| 핀 38 | GND — Ground |
| 핀 39 | I/O — User I/O pin |
| 핀 40 | I/O — User I/O pin |
| 핀 41 | I/O — User I/O pin |
| 핀 42 | I/O — User I/O pin |
| 핀 43 | I/O — User I/O pin |
| 핀 44 | I/O — User I/O pin |
| 핀 45 | I/O — User I/O pin |
| 핀 46 | I/O — User I/O pin |
| 핀 47 | I/O — User I/O pin |
| 핀 48 | VCC — 5V power supply |
| 핀 49 | GND — Ground |
| 핀 50 | I/O — User I/O pin |
| 핀 51 | I/O — User I/O pin |
| 핀 52 | I/O — User I/O pin |
| 핀 53 | I/O — User I/O pin |
| 핀 54 | I/O — User I/O pin |
| 핀 55 | I/O — User I/O pin |
| 핀 56 | TDO — JTAG Test Data Out |
| 핀 57 | I/O — User I/O pin |
| 핀 58 | I/O — User I/O pin |
| 핀 59 | I/O — User I/O pin |
| 핀 60 | I/O — User I/O pin |
| 핀 61-100 | I/O — User I/O pins (per datasheet Table 16) |
| 핀 101-200 | I/O/VCC/GND — Mixed user I/O, VCC, and GND pins per datasheet Table 16 |
| 핀 201-296 | I/O/VCC/GND — Mixed user I/O, VCC, and GND pins per datasheet Table 16 |
| 핀 297 | I/O — User I/O pin |
| 핀 298 | I/O — User I/O pin |
| 핀 299 | I/O — User I/O pin |
| 핀 300 | I/O — User I/O pin |
| 핀 301 | I/O — User I/O pin |
| 핀 302 | I/O — User I/O pin |
| 핀 303 | I/O — User I/O pin |
| 핀 304 | I/O — User I/O pin |
일반적인 애플리케이션
EPF81500ARC304-3 적합 용도: 6 애플리케이션s: Peripheral Bus Interfacing (PCI/ISA/VME), Telecommunications Line Cards, Industrial Control Systems, Legacy TTL/MSI Logic Replacement, Military and Aerospace Avionics (Legacy), Test and Measurement Instrumentation.
Peripheral Bus Interfacing (PCI/ISA/VME)
The EPF81500ARC304-3's 208 user I/O pins and 5 V tolerance make it well-suited for legacy peripheral bus interfacing applications including PCI, ISA, and VME bus bridges. With 16K usable gates and 1,500 flip-flops, the device can implement bus arbitration state machines, address decoding, interrupt controllers, and FIFO buffers in a single chip. The EPROM-based non-volatile configuration provides instant-on behavior, which is critical for systems where the bus master must respond to enumeration cycles immediately after power-up. The 304-RQFP package exposes enough I/O to drive 32-bit data buses plus full address and control signals without external bus transceivers.
추천
Telecommunications Line Cards
The EPF81500ARC304-3 is deployed in telecommunications line-card designs where its 208 user I/O, 5 V I/O tolerance, and register-rich architecture enable glue-logic consolidation. Typical line-card functions include TDM bus time-slot assignment, HDLC framing, elastic store buffering, and clock-data recovery support logic. The FLEX 8000 family's FastTrack continuous interconnect provides predictable timing for synchronous serial interfaces at T1/E1 rates. The device's EPROM-based configuration is favored in telecom applications requiring deterministic power-on behavior and resistance to configuration memory corruption from single-event upsets in field deployments.
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Industrial Control Systems
Industrial control systems leverage the EPF81500ARC304-3's 5 V tolerant I/O to directly interface with 5 V sensors, actuators, and legacy PLC buses without level shifters. The 1,500 flip-flops support complex state machines for sequential process control, while 16K gates implement custom protocol handlers (Modbus, Profibus, DeviceNet glue logic). The 304-RQFP package's high I/O count accommodates multi-axis motion control designs requiring parallel encoder inputs, PWM outputs, and limit-switch monitoring. The part's mature status and stable NRND availability through distributors make it a known-quantity choice for long-lifecycle industrial equipment where redesign risk must be minimized.
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Legacy TTL/MSI Logic Replacement
Designers use the EPF81500ARC304-3 to consolidate dozens of 74-series TTL and MSI logic chips into a single programmable device, reducing PCB area, power consumption, and BOM cost on legacy system refresh programs. With 1,296 logic elements and 208 user I/O, the EPF81500A can replace 20-50 discrete TTL packages depending on design density. The instant-on EPROM configuration eliminates the cold-boot behavior of SRAM-based FPGAs - critical in safety and industrial applications where undefined logic states during boot are unacceptable. The 5 V core supply matches the original TTL rail, simplifying power architecture in legacy retrofits.
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Military and Aerospace Avionics (Legacy)
Long-lifecycle military and aerospace platforms have deployed the EPF81500ARC304-3 in avionics subsystems, radar signal processing front-ends, and mission computer I/O expansion roles. The 304-RQFP package's high I/O count supports MIL-STD-1553 and ARINC 429 bus interfaces, while the EPROM configuration provides radiation-tolerant non-volatile storage compared to SRAM FPGAs. Although the part is NRND and not recommended for new designs, existing fielded systems continue to require spares and replacement units. The mature process technology and stable supply through distribution channels support sustainment programs where design changes would require expensive re-qualification.
추천
Test and Measurement Instrumentation
The EPF81500ARC304-3 serves in bench-top and ATE test equipment where its 208 user I/O enable parallel pattern generation, custom timing generators, and protocol-aware stimulus/response modules. The 16K-gate density supports multi-channel arbitrary waveform generator sequencing, while the 5 V I/O tolerance directly drives legacy instrument interfaces without external buffers. The FastTrack interconnect's deterministic timing is valuable for generating precision timing edges required in production test. The device's instant-on EPROM behavior ensures that test equipment is immediately operational after power cycling - critical in high-throughput manufacturing test environments.
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추천 제품 요약
엔지니어링 참조 데이터: EPF81500ARC304-3 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF81500ARC304-2 | EPF81500ARC304-2A | EPF81188ARC240-4 |
|---|---|---|---|---|
| Package | 304-BFQFP (RQFP) | 304-BFQFP (RQFP) - same | 304-BFQFP (RQFP) - same | 240-PQFP - different |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel |
| Usable Gates | 16,000 | 16,000 | 16,000 | 12,000 |
| Logic Elements | 1,296 | 1,296 | 1,296 | 1,008 |
| User I/O Pins | 208 | 208 | 208 | 168 |
| Speed Grade | -3 (~125 MHz) | -2 (~100 MHz) | -2A | -4 |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V |
| Configuration Method | EPROM (instant-on) | EPROM (instant-on) | EPROM (instant-on) | EPROM (instant-on) |
| Lifecycle Status | NRND | NRND | NRND | NRND |
| Internal Performance | 125 MHz | ~100 MHz | ~100 MHz | ~80 MHz |
주요 차별점
- Fastest speed grade in EPF81500A family (vs EPF81500ARC304-2)
- Largest I/O count in FLEX 8000 family (vs EPF81188ARC240-4)
- Highest density in FLEX 8000 family (vs EPF81188ARC240-4)
설계 노트
The EPF81500ARC304-3 requires a stable 5 V ±5% supply (per FLEX 8000 datasheet DC characteristics). Decoupling: place one 0.1 µF ceramic capacitor per VCC pin group and at least one 47 µF bulk tantalum near each VCC/GND pair. The 304-pin RQFP package has multiple VCC/GND pins distributed around the package - all must be connected. Power sequencing is not required (EPROM-based instant-on), but VCC ramp time should be monotonic to avoid spurious configuration activity. Estimated ICC at 125 MHz with typical 50% toggle rate: 100-150 mA per VCC group; use a 500 mA-rated regulator with margin.
The 304-RQFP (BFQFP) package has a 31.2 × 31.2 mm body with 0.5 mm pitch gull-wing leads. PCB design requires: (1) 4-layer board recommended for ground-plane integrity under the device; (2) all signal traces on outer layers, power/ground on inner layers; (3) thermal vias under the package center (if a thermal pad is present on this specific variant); (4) keep JTAG signals (TDI/TDO/TMS/TCK) short and routed away from high-frequency switching signals; (5) configuration pins (nCONFIG, nSTATUS, CONF_DONE) require external 10 kΩ pull-ups to VCC. The 304-RQFP requires fine-pitch PCB fabrication (0.5 mm pitch is at the edge of standard SMT capability).
Common pitfalls with EPF81500ARC304-3 designs: (1) Do not assume JTAG chain continuity without verifying BSDL file compatibility with your JTAG tester; (2) MSEL0/MSEL1 pin settings must match the configuration mode (passive serial, active serial, etc.) - incorrect settings cause configuration failure; (3) The device is one-time-programmable (EPROM) - design errors require a new part, not a re-programming cycle; (4) For high-speed designs (>100 MHz), enable the FastTrack interconnect with tpd derating from datasheet; (5) The -3 speed grade provides higher performance than -2 but has tighter timing margins - validate critical paths with static timing analysis (Quartus II supports FLEX 8000 timing analysis).
For EPF81500ARC304-3 designs with 125 MHz internal performance, signal integrity considerations include: (1) Series-terminate clock outputs with 33 Ω resistors if driving traces longer than 50 mm; (2) Keep configuration clock (DCLK) traces short and isolated from user I/O; (3) Use ground guards between adjacent high-speed I/O banks; (4) The FLEX 8000 I/O cells support 5 V PCI compliance when configured for PCI mode; (5) For SSTL or GTL interfaces, use external reference voltage circuits as specified in AN-75 (Altera application note). Estimated: at 125 MHz with 208 I/O switching, simultaneous switching noise can induce 200-400 mV ground bounce - use sufficient decoupling and ground-plane stitching.
규정 준수 정보
RoHS compliance per distributor listings (DigiKey, Heisener). REACH, halogen-free, and conflict minerals status not explicitly stated in available data - set to 'unknown'. AEC-Q100 not applicable for legacy FPGA logic devices.
