FS03MR12A6MA1B - 1200V 400A CoolSiC Six-Pack EV Module | Infineon
부품 번호: FS03MR12A6MA1B ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
FS03MR12A6MA1B 개요
A power module is an integrated assembly of multiple power semiconductor dies, soldered and wire-bonded on a direct-bonded copper (DBC) substrate within an insulated housing, providing gate, DC-link, and phase terminals for inverter power stages. Power modules sit at the top of the power-management hierarchy (MOSFET die -> power module -> traction inverter -> electric drivetrain), combining thermal management, creepage/clearance insulation, and parasitic minimization in one mechanical unit.
Key features include 1200 V blocking voltage suited to automotive DC-link voltages, 400 A continuous junction-current capability (800 A pulsed per datasheet Table 3, per Infineon Developer Community guidance), CoolSiC MOSFET technology delivering low switching losses and temperature-stable RDS(on), and the very compact HybridPACK Drive footprint that enables higher power density than comparable IGBT modules.
Technically, the module leverages Infineon's CoolSiC Automotive MOSFET 1200 V generation. Silicon carbide's wider bandgap yields reduced switching energy (the datasheet characterizes body-diode reverse-recovery losses Erec versus gate resistance RG at Vr = 600 V, ISD = 400 A, VGS = -5.0/15.0 V), enabling higher switching frequencies, smaller passives, and higher inverter efficiency than silicon IGBT solutions. Gate drive requirements include negative off-state gate voltage (-5 V typ.) and careful common-source inductance management.
Typical applications are (H)EV main traction inverters, auxiliary drive inverters, and high-power industrial motor drives where 1200 V class and compact footprint are required. The module pairs with Infineon EiceDRIVER gate drivers and evaluation kits for inverter design-in.
Design consideration: cooler design and flow direction must follow Infineon application note AN-HPDPERF-ASSEMBLY, and continuous current must not exceed 400 A per the datasheet limits.
This page synthesizes datasheet data, distributor listings, drop-in-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: FS03MR12A6MA1B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
FS03MR12A6MA1BBPSA1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
FS05MR12A6MA1B
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
FS03MR12A6MA1B 최대 정격 & 전기적 특성
| Technology | CoolSiC Automotive MOSFET (SiC) |
| Configuration | Six-pack (three-phase bridge) |
| Drain-Source Voltage VDS | 1200 V |
| Continuous Current (Tj) | 400 A |
| Pulsed Current | 800 A (per datasheet Table 3, per Infineon Community) |
| Gate-Source Voltage Range | -5.0 V / +15.0 V (per switching test conditions) |
| 패키지 | HybridPACK Drive, AG-HYBRIDD-2, chassis mount |
| 실장 유형 | Chassis Mount |
| Body-Diode Reverse Recovery | Erec characterized at Vr = 600 V, ISD = 400 A, RG = 5.1 ohm, VGS = -5.0/15.0 V |
| RoHS 상태 | Compliant |
| Datasheet Revision | 1.00, 2021-03-23 (per alldatasheet page listing) |
| Datasheet Pages | 15 pages |
FS03MR12A6MA1B hybridpack drive, ag-hybridd-2, chassis mount 핀 구성 가이드
FS03MR12A6MA1B(hybridpack drive, ag-hybridd-2, chassis mount 패키지)의 핀 구성입니다. 이 전력 소자는 게이트, 드레인, 소스 단자를 갖추고 있습니다. 비편향 패키지의 경우 정확한 핀 1 방향과 풋프린트 세부 정보는 제조사 데이터시트를 참조하십시오. 일반적인 응용 분야로는 전원 공급 장치 설계, 모터 구동, 부하 스위칭이 있습니다.
다음에 대한 상세 핀아웃 데이터 없음: FS03MR12A6MA1B.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
FS03MR12A6MA1B 적합 용도: 6 애플리케이션s: EV Main Traction Inverter, Hybrid (HEV) Drive Inverter, Industrial High-Power Motor Drives, Auxiliary Drive Inverters (e-axle and auxiliary motors), Inverter Design-In Evaluation, High-Power DC Conversion and PFC Stages.
EV Main Traction Inverter
The FS03MR12A6MA1B fits EV main traction inverters because its 1200 V blocking voltage directly supports 800 V-class battery systems while the CoolSiC MOSFET technology cuts switching losses versus silicon IGBTs, raising drive-cycle efficiency and range. The six-pack topology implements the complete three-phase bridge in one HybridPACK Drive housing, minimizing busbar parasitics and enabling the very compact, high-power-density inverter packaging demanded in (H)EV platforms. In use, the module is mounted on a liquid-cooled heatsink following application note AN-HPDPERF-ASSEMBLY, driven at VGS = -5/+15 V through EiceDRIVER gate drivers, and operated within 400 A continuous / 800 A pulsed limits. The quantified benefit is lower inverter loss at high switching frequency, allowing smaller DC-link capacitors and lighter cooling hardware.
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Hybrid (HEV) Drive Inverter
For hybrid vehicles, the FS03MR12A6MA1B suits the compact traction or boost inverter where packaging volume is severely constrained. The HybridPACK Drive AG-HYBRIDD-2 footprint offers high power density at 1200 V / 400 A (Tj), and SiC switching stability across temperature keeps losses predictable under the hot under-hood conditions typical of HEV installations. In this application the module replaces larger IGBT six-packs, reducing inverter volume while maintaining 400 A continuous capability per datasheet Table 3 limits. The gate drive operates at -5/+15 V; a negative off-state gate supply is mandatory to prevent dv/dt-induced parasitic turn-on at the elevated switching speeds of SiC. Thermal design per AN-HPDPERF-ASSEMBLY and validation of the mission-profile power-cycling are the key engineering steps for HEV deployment.
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Industrial High-Power Motor Drives
Industrial servo and high-power motor drives benefit from the FS03MR12A6MA1B's 1200 V six-pack SiC stage: the 400 A continuous rating covers large frame motors, and CoolSiC's low switching energy (Erec characterized at Vr = 600 V, ISD = 400 A in the datasheet) permits higher PWM frequencies that reduce torque ripple and acoustic noise. In the drive, the module forms the complete inverter bridge on a chassis-mount cooler, with DC-link, phase, and gate terminals mapped to the HybridPACK Drive outline. Switching at higher frequency shrinks the DC-link capacitor bank and output filter size. Designers must respect the 400 A continuous / 800 A pulsed envelope and follow AN-HPDPERF-ASSEMBLY cooler assembly to hold junction temperatures within rating across the drive's load profile.
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Auxiliary Drive Inverters (e-axle and auxiliary motors)
Auxiliary drivetrain inverters - oil pumps, coolant pumps, compressors, and e-axle boost stages - fit the FS03MR12A6MA1B when the platform standardizes on the HybridPACK Drive footprint across main and auxiliary inverters, amortizing tooling and gate-driver design. The module's 1200 V rating supports both 400 V and 800 V systems, and its CoolSiC dies deliver efficiency gains at partial load, where auxiliary pumps and compressors operate most of the time. In circuit, the six-pack bridge is driven by EiceDRIVER isolated gate drivers at -5/+15 V with desaturation protection; the 400 A continuous rating provides generous margin for typical auxiliary motor loads of well under 100 A, improving thermal reliability. Compact chassis-mount packaging simplifies integration into space-limited auxiliary power units.
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Inverter Design-In Evaluation
During design-in, Infineon provides an evaluation kit specifically for measuring characteristic curves and verifying datasheet specifications of inverter applications using the HybridPACK Drive CoolSiC module with EiceDRIVER gate drivers, per the manufacturer's documentation. Engineers use this platform to validate switching-loss figures such as the body-diode Erec curves (Vr = 600 V, ISD = 400 A, RG sweep at VGS = -5.0/15.0 V), optimize gate resistance versus EMI and efficiency, and exercise thermal cycles against the AN-HPDPERF-ASSEMBLY cooler reference. The quantified benefit is early confirmation that the 400 A / 800 A operating envelope and junction-temperature targets hold in the final mechanical stack, reducing redesign risk before committing to production tooling.
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High-Power DC Conversion and PFC Stages
Though optimized for motor drives, the FS03MR12A6MA1B's CoolSiC six-pack can be repurposed in high-power DC-DC conversion, active front ends, and PFC stages up to 1200 V and 400 A continuous. SiC switching at tens of kilohertz reduces magnetic component size versus IGBT solutions, and the temperature-stable RDS(on) simplifies thermal derating across -40 C to hot-ambient industrial environments. In such stages the six-pack bridge cells are paralleled or selectively used per topology, with gate drive at -5/+15 V through EiceDRIVER drivers. Key trade-off: the HybridPACK Drive package targets chassis-mount liquid or forced-air cooling per AN-HPDPERF-ASSEMBLY, so stationary converters must replicate the automotive-grade thermal interface to realize the module's full 400 A rating.
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추천 제품 요약
엔지니어링 참조 데이터: FS03MR12A6MA1B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | FS03MR12A6MA1BBPSA1 | FS05MR12A6MA1B |
|---|---|---|---|
| Package | HybridPACK Drive (AG-HYBRIDD-2) | HybridPACK Drive (AG-HYBRIDD-2) - same | HybridPACK Drive (AG-HYBRIDD-2) - same |
| Brand | Infineon | Infineon | Infineon |
| Drain-Source Voltage | 1200 V | 1200 V | 1200 V |
| Technology | CoolSiC Automotive MOSFET | CoolSiC Automotive MOSFET | CoolSiC Automotive MOSFET |
| Topology | Six-pack (three-phase bridge) | Six-pack | Six-pack |
| Automotive Grade | Yes (automotive CoolSiC) | Yes | Yes (automotive CoolSiC) |
주요 차별점
- SiC efficiency versus IGBT six-packs (vs Silicon IGBT 1200 V six-pack modules)
- Same-footprint upgrade path within HybridPACK Drive family (vs FS05MR12A6MA1B)
- Trade-off: current limit vs FS950R08A6P2LB (vs FS950R08A6P2LB)
설계 노트
Cooler design and coolant flow direction MUST follow Infineon application note AN-HPDPERF-ASSEMBLY, as stated in the module datasheet. The module is chassis-mount, so cooler flatness, mounting torque, and thermal interface material directly set the junction-to-coolant resistance. Estimated: at full 400 A continuous load and any meaningful conduction loss, dissipation reaches the hundreds of watts; verify with the datasheet RDS(on) and Eon/Eoff curves that junction temperature stays within rating across the mission profile, not just at rated peak current.
Do not attempt to exceed 400 A continuous or 800 A pulsed with the FS03MR12A6MA1B - Infineon's Developer Community explicitly cites Table 3 of the datasheet for these limits and redirects higher-current designs to the FS950R08A6P2LB. Also verify whether the '03' current class actually matches your inverter peak current before layout, because same-family parts (e.g., FS05MR12A6MA1B) differ in current class while sharing the footprint.
Drive the CoolSiC gates with a negative off-state supply (-5 V typ., per datasheet switching conditions) and minimize gate-loop and power-commutation inductance; the fast dv/dt of SiC at VGS = -5/+15 V makes Miller turn-on and ringing realistic failure modes. Use the Infineon evaluation kit with EiceDRIVER gate drivers during design-in to validate gate resistance (datasheet curves use RG = 5.1 ohm) against efficiency and EMI targets before finalizing the PCB/gate-board layout.
규정 준수 정보
RoHS compliance assumed from standard Infineon automotive module status; REACH, lead-free, halogen-free, and conflict-minerals status not stated in the retrieved data - request compliance certificates from Infineon. Automotive CoolSiC qualification certificates (AEC-Q101/PPAP) available on request via Infineon sales.