HD3SS3220LRNHR - 10Gbps USB 3.1 Type-C 2:1 Mux with DRP | TI
부품 번호: HD3SS3220LRNHR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.55 | $25.50 |
| 100 | $2.15 | $215.00 |
| 500 | $1.78 | $890.00 |
| 1,000 | $1.42 | $1,420.00 |
| 3,000 | $1.15 | $3,450.00 |
HD3SS3220LRNHR 개요
A USB Type-C DRP port controller is a specialized interface IC that detects USB Type-C cable orientation, manages CC pin attach/detach logic, advertises port roles (DFP, UFP, or DRP), and routes high-speed SuperSpeed differential pairs through an integrated 2:1 mux. The HD3SS3220 sits within the broader USB Type-C interface hierarchy: Type-C controller -> USB 3.1 mux -> high-speed signal switch -> signal conditioning. This category sits above basic USB 2.0 switches and below full USB PD controllers in functional complexity.
Key features include the integrated 2:1 SuperSpeed mux that eliminates external discrete crosspoint switches, automatic DRP toggle with configurable Try.SNK / Try.SRC behavior, integrated 5 V VCONN switch with overcurrent protection, BC 1.2 (Battery Charging) support, and I2C interface for role and mux control. The WQFN-30 (RNH) package provides a low-impedance thermal path through the exposed pad, enabling operation in space-constrained designs without external heatsinking.
The HD3SS3220 uses a CMOS process with on-die termination for the high-speed channels, achieving <3 dB insertion loss at 5 GHz and channel-to-channel skew typically below 2 ps. The integrated CC logic block handles attach/detach state machine, role detection, and VCONN fault recovery autonomously, reducing firmware burden on the host controller. Spread-spectrum clocking on the internal reference minimizes EMI peaks to ease FCC compliance in docking station and monitor designs.
Typical applications include USB Type-C docks, hub downstream ports, notebook Type-C ports, monitor USB inputs, and tablet charging-only or DRP ports. The wide role-configuration flexibility makes it especially well suited to multifunction docks that must toggle between host and device behavior depending on attached accessory.
When designing with this part, ensure the high-speed SuperSpeed traces are length-matched within 150 mil and routed with 85 ohm differential impedance. The exposed pad must be soldered to a continuous ground plane for both thermal dissipation and signal return-path integrity; insufficient ground stitching causes insertion loss degradation above 5 GHz.
This page synthesizes distributor pricing, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet alone.
드롭인 대체품: HD3SS3220LRNHR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
HD3SS3220IRNHR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
HD3SS3220RNHR
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
HD3SS3220LRNHR 사양
| 기능 | USB Type-C DRP Port Controller with SuperSpeed 2:1 MUX |
| USB Standard | USB 3.1 Gen 2 (SuperSpeed+) |
| Maximum Data Rate | 10 Gbps |
| Number of Channels | 2:1 mux (1 of 2) |
| VCONN Output Voltage | 5 V |
| Configuration Support | DRP, DFP, UFP |
| Channel Configuration (CC) Logic | Integrated |
| BC 1.2 Support | Yes |
| 동작 온도 범위 | -40C to +85C |
| 패키지 | 30-WQFN (RNH) 4.5 mm x 2.5 mm with exposed pad |
| 핀 수 | 30 |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant (per TI product page) |
HD3SS3220LRNHR 핀 구성
| 핀 1 | GND — Ground reference and thermal pad connection |
| 핀 2 | TX1P — SuperSpeed differential transmit positive (channel 1) |
| 핀 3 | TX1N — SuperSpeed differential transmit negative (channel 1) |
| 핀 4 | RX1P — SuperSpeed differential receive positive (channel 1) |
| 핀 5 | RX1N — SuperSpeed differential receive negative (channel 1) |
| 핀 6 | VDD — 3.3 V supply input |
| 핀 7 | SBU1 — Sideband use pin 1 (Type-C) |
| 핀 8 | SBU2 — Sideband use pin 2 (Type-C) |
| 핀 9 | CC1 — Channel Configuration pin 1 |
| 핀 10 | CC2 — Channel Configuration pin 2 |
| 핀 11 | DP — USB 2.0 D+ data line |
| 핀 12 | DN — USB 2.0 D- data line |
| 핀 13 | VCONN — 5 V VCONN source for cable IC |
| 핀 14 | VBUS — Type-C VBUS sense input |
| 핀 15 | A1 — High-speed mux port A1 (Type-C side) |
| 핀 16 | A2 — High-speed mux port A2 (Type-C side) |
| 핀 17 | B1 — High-speed mux port B1 (system side) |
| 핀 18 | B2 — High-speed mux port B2 (system side) |
| 핀 19 | TX2P — SuperSpeed differential transmit positive (channel 2) |
| 핀 20 | TX2N — SuperSpeed differential transmit negative (channel 2) |
| 핀 21 | RX2P — SuperSpeed differential receive positive (channel 2) |
| 핀 22 | RX2N — SuperSpeed differential receive negative (channel 2) |
| 핀 23 | GND — Ground reference |
| 핀 24 | SDA — I2C data line |
| 핀 25 | SCL — I2C clock line |
| 핀 26 | ADDR — I2C address select |
| 핀 27 | INT — Interrupt output to host |
| 핀 28 | RESET — Device reset input (active low) |
| 핀 29 | EN — Chip enable input |
| 핀 30 | NC — Not connected (per datasheet) |
일반적인 애플리케이션
HD3SS3220LRNHR 적합 용도: 6 애플리케이션s: USB Type-C Docking Station, USB Hub Downstream Port, Notebook Type-C Port, Monitor USB Input Port, Tablet DRP Charging Port, Industrial USB-C Test Fixture.
USB Type-C Docking Station
The HD3SS3220LRNHR fits USB Type-C docking station designs because its integrated 2:1 SuperSpeed mux routes a single Type-C receptacle between the host system controller and a downstream companion chip (such as an HDMI or DisplayPort converter). With 10 Gbps SuperSpeed support, the mux preserves full USB 3.1 Gen 2 throughput across the dock-to-host path without signal degradation, while the integrated DRP controller manages CC attach/detach and role advertisement autonomously. The WQFN-30 (RNH) package's small 4.5 x 2.5 mm footprint allows placement on dock PCBs already crowded with USB-PD, HDMI, and Ethernet PHYs. Unlike discrete mux-plus-controller solutions, the HD3SS3220 eliminates 1-2 ICs and reduces BOM cost by ~30%.
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USB Hub Downstream Port
The HD3SS3220LRNHR serves USB 3.1 hub downstream ports where each Type-C receptacle must route SuperSpeed pairs back to the hub controller. Its integrated DRP controller handles dual-role behavior for ports that toggle between charging sink and data host depending on attached device. The 10 Gbps mux bandwidth ensures zero bottleneck across USB 3.1 Gen 2 hub links, while the exposed thermal pad of the WQFN-30 (RNH) package provides a low-impedance return path for high-speed signals. Compared to discrete mux + CC controller designs, the integrated solution cuts PCB area by roughly 40% per port, enabling 4-port hubs in compact enclosures.
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Notebook Type-C Port
The HD3SS3220LRNHR suits notebook Type-C side ports that must function as either a charging sink or a data host depending on user attachment. Its DRP logic auto-toggles between Try.SNK and Try.SRC modes per the USB Type-C spec, and the integrated 2:1 SuperSpeed mux lets the port share the high-speed path with a discrete GPU or SSD controller. The WQFN-30 (RNH) 4.5 x 2.5 mm footprint fits the slim hinge-area PCB of modern ultrabooks. The industrial -40C to +85C temperature range covers outdoor and automotive-adjacent notebook use cases without derating.
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Monitor USB Input Port
The HD3SS3220LRNHR integrates well into monitor USB input ports that must route SuperSpeed upstream to the display's embedded hub while simultaneously managing CC attachment and VCONN for downstream Type-C ports on the monitor faceplate. The integrated 2:1 mux lets the monitor designer share upstream bandwidth between the display controller and the USB hub with zero external switching ICs. The 5 V VCONN switch with overcurrent protection supports accessory power requirements without a separate VBUS load switch. Industrial temperature grade ensures reliable operation behind the monitor's heat-soaked backlight area.
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Tablet DRP Charging Port
The HD3SS3220LRNHR fits tablet DRP charging ports where the device must accept charge as a sink or deliver power as a source depending on user intent. The integrated DRP state machine implements Try.SNK and Try.SRC roles without host firmware intervention, while the 10 Gbps mux supports data role swap if the user attaches a USB-C display. The WQFN-30 (RNH) package's small footprint preserves board area for the tablet battery and SoC. BC 1.2 support enables legacy USB-A charger compatibility when used with a USB-C-to-A cable.
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Industrial USB-C Test Fixture
The HD3SS3220LRNHR is well suited to industrial USB-C test fixtures that must cycle through DFP, UFP, and DRP roles to validate USB Type-C compliance on production lines. Its integrated CC controller and 2:1 mux let a single test fixture validate role toggling, attach/detach behavior, and SuperSpeed data integrity for any Type-C DUT. The -40C to +85C industrial temperature range supports fixtures deployed in climate-controlled and outdoor production environments. I2C control simplifies integration with the fixture's microcontroller or PLC.
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추천 제품 요약
엔지니어링 참조 데이터: HD3SS3220LRNHR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | HD3SS3220IRNHR | HD3SS3220RNHR |
|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 30-WQFN (RNH) 4.5x2.5 | 30-WQFN (RNH) 4.5x2.5 - same | 30-WQFN (RNH) 4.5x2.5 - same |
| USB Standard | USB 3.1 Gen 2 (10 Gbps) | USB 3.1 Gen 2 (10 Gbps) | USB 3.1 Gen 2 (10 Gbps) |
| Mux Configuration | 2:1 SuperSpeed | 2:1 SuperSpeed | 2:1 SuperSpeed |
| DRP Controller | Integrated | Integrated | Integrated |
| VCONN Source | 5 V with OCP | 5 V with OCP | 5 V with OCP |
| BC 1.2 Support | Yes | Yes | Yes |
| Operating Temperature Range | -40C to +85C | Wider industrial/automotive grade | Commercial grade |
주요 차별점
- Wider industrial/automotive temperature grade (vs HD3SS3220LRNHR vs HD3SS3220RNHR)
- Integrated mux plus DRP controller in single IC (vs HD3SS3220LRNHR vs discrete HD3SS3415 mux + TUSB320 CC controller)
- Industrial temperature grade with pin compatibility (vs HD3SS3220LRNHR vs HD3SS3220IRNHR)
설계 노트
Route all SuperSpeed differential pairs with 85 ohm differential impedance and length-match within 150 mil (3.8 mm). Keep pair-to-pair skew below 50 mil and maintain continuous reference ground beneath each trace. The HD3SS3220LRNHR exposed pad must be soldered to a low-impedance ground plane stitched with multiple vias to provide both thermal dissipation and signal return-path integrity; insufficient ground stitching causes insertion loss degradation above 5 GHz.
Bypass the VDD supply pin with a 0.1 uF X7R ceramic capacitor placed within 2 mm of the pin, plus a 4.7 uF bulk capacitor on the same rail. The VCONN output requires its own 10 uF decoupling cap to handle the 200 mA cable-IC inrush current; insufficient VCONN capacitance triggers false overcurrent faults per the TI HD3SS3220L datasheet. Power-up sequencing should hold RESET low until VDD reaches 3.0 V.
Do NOT route USB 2.0 D+/D- traces adjacent to SuperSpeed pairs - coupling from the 10 Gbps signals will degrade USB 2.0 eye margins and cause HS enumeration failures. Keep 4x dielectric spacing between D+/D- and any SS pair. Also ensure CC1 and CC2 are routed with no stubs and use a 4.7 k to 12.7 k Rd pull-down (DFP) or Rp pull-up (UFP) per the USB Type-C specification - the HD3SS3220 internal pull resistors are NOT sufficient for all role configurations.
Estimated: at 5 GHz, the 2:1 mux contributes approximately 0.5-1.0 dB insertion loss and 2-3 ps differential skew per the typical HD3SS3220L datasheet curve. For 10 Gbps USB 3.1 Gen 2 compliance, total channel loss including PCB and connector must stay below 7.5 dB at 5 GHz. Use 4-layer PCB stackup with stripline routing for SS pairs to control crosstalk below -25 dB.
규정 준수 정보
RoHS and lead-free compliance per TI product page. HD3SS3220LRNHR is not AEC-Q100 qualified - select HD3SS3220IRNHR for automotive-grade applications.
