IRIS-W106-10B - Wi-Fi 6/BLE/802.15.4 Tri-Radio Module | u-blox
부품 번호: IRIS-W106-10B ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $21.5 | $21.50 |
| 10 | $19.35 | $193.50 |
| 100 | $17.2 | $1,720.00 |
| 500 | $15.5 | $7,750.00 |
| 1,000 | $14.1 | $14,100.00 |
IRIS-W106-10B 개요
A Wi-Fi 6 + Bluetooth LE + 802.15.4 module (often called a tri-radio wireless MCU module) is a self-contained radio module that combines 2.4 GHz and 5 GHz Wi-Fi 6 connectivity, Bluetooth Low Energy 5.3, and IEEE 802.15.4 (Thread/Zigbee) radios in one certified package with an integrated host MCU. Within the broader product taxonomy, IRIS-W106-10B sits under: Wi-Fi 6 module -> wireless MCU module -> RF transceiver module -> RF & wireless product family. By integrating the MCU on-module, designers eliminate an external host processor, reduce PCB area, and accelerate time-to-market for connected products.
Key features of the IRIS-W106-10B include dual-band 2.4 GHz / 5 GHz Wi-Fi 6 with 802.11ax features such as OFDMA and Target Wake Time (TWT), Bluetooth LE 5.3 with long-range and 2 Mbps PHY support, and IEEE 802.15.4 for Thread and Zigbee mesh networking. The RW612 chipset supports five Flexcomm interfaces configurable as SPI, I2C, I2S, or UART, with the module offering an open-CPU programming model for embedded application development. The integrated PCB antenna eliminates the need for external RF matching and reduces layout complexity.
Typical applications include smart-home gateways and Matter bridges, industrial wireless sensor networks, building automation, asset tracking, and connected medical devices that require concurrent Wi-Fi and BLE operation. The 16 MB of on-module flash enables over-the-air (OTA) update staging and supports full IPv4/IPv6 networking stacks when running the NXP MCUXpresso SDK or third-party RTOS such as Zephyr.
When designing with this module, ensure adequate clearance around the PCB antenna per the datasheet keep-out region, and follow u-blox's reference decoupling recommendations for the VIN and VIO rails. The module is pre-certified for FCC, IC, ETSI, and other major regulatory domains, which significantly simplifies end-product certification when the recommended antenna keep-out is observed.
드롭인 대체품: IRIS-W106-10B — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: IRIS-W106-10B (동일 폼 팩터 및 풋프린트) — 차이점: Wi-Fi Standard, Bluetooth, Module Type, Mounting Type, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
IRIS-W101-10B
✅ 드롭인✓ 재고 있음
$10.7 / 개
데이터시트 보기 →IRIS-W106-00B
✅ 드롭인✓ 재고 있음
$9.95 / 개
데이터시트 보기 →IRIS-W101-00B
✅ 드롭인✓ 재고 있음
$16.95 / 개
데이터시트 보기 →NORA-W106-00B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
IRIS-W106-10B 사양 (제조사 공개)
| Manufacturer | u-blox |
| Series | IRIS-W10 |
| Chipset | NXP RW612 |
| Module Type | Tri-radio wireless MCU module |
| Wi-Fi Standard | 802.11a/b/g/n/ax (Wi-Fi 6) |
| Bluetooth | Bluetooth LE 5.3 |
| 802.15.4 Support | Thread, Zigbee |
| Frequency Bands | 2.4 GHz, 5 GHz |
| Antenna | PCB Trace (integrated) |
| Host Processor | Arm Cortex-M33 (open CPU) |
| On-module Flash | 16 MB |
| Flexcomm Interfaces | 5 (configurable SPI / I2C / I2S / UART) |
| 실장 유형 | Surface Mount |
| Regulatory Certifications | FCC, IC, ETSI (pre-certified) |
| RoHS 상태 | Compliant |
IRIS-W106-10B 인터페이스 및 커넥터
IRIS-W106-10B은(는) 제조사에서 공개한 대로 다음 인터페이스와 커넥터를 제공합니다: 무선, 블루투스. 확장 헤더 핀아웃, 커넥터 핀 번호, 전기적 한계는 제조사 문서에 정의되어 있습니다.
| 무선 | 802.11a/b/g/n/ax (Wi-Fi 6) |
| 블루투스 | Bluetooth LE 5.3 |
다음을 참조하십시오: 제조사 문서 전체 확장 헤더 핀아웃 및 커넥터 핀 번호는 다음을 참조하십시오.
일반적인 애플리케이션
IRIS-W106-10B 적합 용도: 6 애플리케이션s: Smart Home Gateway / Matter Bridge, Industrial Wireless Sensor Network, Building Automation HVAC and Lighting Controllers, Asset Tracking and BLE Proximity Devices, Connected Medical and Wearable Devices, Consumer Audio and Voice Assistants.
Smart Home Gateway / Matter Bridge
The IRIS-W106-10B is well suited to smart-home gateways and Matter bridges because it simultaneously provides dual-band Wi-Fi 6 for cloud connectivity, Bluetooth LE 5.3 for commissioning and proximity features, and 802.15.4 for Thread mesh. Its 16 MB of on-module flash and open-CPU Cortex-M33 host can run a full Matter/CHIP stack plus application logic without an external MCU. Designers place the module near a board edge to preserve the antenna keep-out region per the IRIS-W10 datasheet UBX-23002331, and route power and decoupling (3.3 V VIN with bulk + ceramic bypass) on a short stub. Concurrent Wi-Fi/BLE operation simplifies coexistence design compared with two-radio designs.
추천
Industrial Wireless Sensor Network
Industrial sensor nodes benefit from the IRIS-W106-10B's tri-radio capability, 16 MB of on-module flash, and industrial -40C to +85C operating range. Wi-Fi 6 brings OFDMA and TWT, which improve uplink efficiency and reduce battery drain for sparsely reporting sensors compared with legacy 802.11n. The 802.15.4 radio delivers Thread mesh for hard-to-reach sensors, while Bluetooth LE 5.3 with 2 Mbps PHY supports short-range configuration and firmware updates. The open-CPU Cortex-M33 lets a single module replace a discrete MCU plus radio combo, shrinking PCB area and BOM cost for industrial IoT deployments.
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Building Automation HVAC and Lighting Controllers
Building automation controllers that tie HVAC, lighting, and access-control subsystems into a single mesh benefit from the IRIS-W106-10B's combination of Thread/Zigbee (802.15.4), Bluetooth LE for installer provisioning, and dual-band Wi-Fi 6 for cloud backhaul. The 5 GHz band helps avoid interference from crowded 2.4 GHz industrial environments and reduces latency for time-critical control loops. The module's pre-certified regulatory IDs (FCC/IC/ETSI) remove a major hurdle for building product certification timelines. Pre-flight checklist: confirm the host MCU application's stack usage fits within the open-CPU's flash budget alongside the wireless stack.
추천
Asset Tracking and BLE Proximity Devices
Asset-tracking tags and proximity devices often combine BLE beacons with Wi-Fi for indoor positioning and gateway uplink. The IRIS-W106-10B supports Bluetooth LE 5.3 long-range coded PHY (about 4x range vs uncoded) plus 2 Mbps PHY for higher throughput, plus Wi-Fi 6 for direct cloud backhaul without a separate gateway. The integrated PCB antenna reduces tag BOM, though placement must respect the datasheet keep-out region to maintain RF performance. With 16 MB on-module flash, devices can buffer position logs locally for periodic Wi-Fi sync to extend battery life.
추천
Connected Medical and Wearable Devices
Connected medical and wearable devices leverage the IRIS-W106-10B for BLE 5.3 sensor telemetry with 2 Mbps PHY (or long-range coded PHY) and Wi-Fi 6 for clinical-grade wireless backhaul. The open-CPU Cortex-M33 can run encrypted health-data pipelines locally, reducing PHI exposure. With integrated antenna and pre-certified regulatory modules, designers avoid lengthy FDA/IEC 60601 RF coexistence re-tests. Confirm operating temperature compliance with your target use case (industrial range per datasheet) and budget power dissipation from the 3.3 V rail carefully because Wi-Fi 6 5 GHz TX can pull noticeably above BLE-only current.
추천
Consumer Audio and Voice Assistants
Consumer smart speakers and voice assistants need reliable dual-band Wi-Fi for streaming and cloud access, plus BLE for setup (Wi-Fi provisioning over BLE) and 802.15.4 for cross-ecosystem smart-home control (Matter over Thread). The IRIS-W106-10B covers all three radios in one module and runs the voice assistant or media stack on its Cortex-M33 host, simplifying the audio bridge between DSP and network. Compared with a Wi-Fi-only module, the tri-radio capability enables out-of-the-box Matter/Thread support. Place the module away from the audio amplifier to minimize RF injection into the microphone path; the antenna keep-out region is mandatory.
추천
추천 제품 요약
엔지니어링 참조 데이터: IRIS-W106-10B — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | IRIS-W101-10B | IRIS-W106-00B | IRIS-W101-00B | NORA-W106-00B |
|---|---|---|---|---|---|
| Brand | u-blox | u-blox | u-blox | u-blox | u-blox |
| Package | SMD module (IRIS-W10 footprint) | SMD module (IRIS-W10 footprint) - same | SMD module (IRIS-W10 footprint) - same | SMD module (IRIS-W10 footprint) - same | SMD module (NORA footprint) - smaller |
| Chipset | NXP RW612 | NXP RW612 | NXP RW612 | NXP RW612 | NXP RW612 |
| Wi-Fi Standard | Wi-Fi 6 (802.11a/b/g/n/ax) dual-band 2.4 + 5 GHz | Wi-Fi 6 (802.11b/g/n/ax) 2.4 GHz only | Wi-Fi 6 (802.11a/b/g/n/ax) dual-band 2.4 + 5 GHz | Wi-Fi 6 (802.11b/g/n/ax) 2.4 GHz only | Wi-Fi 6 (802.11a/b/g/n/ax) dual-band 2.4 + 5 GHz |
| Bluetooth | BLE 5.3 | BLE 5.3 | BLE 5.3 | BLE 5.3 | BLE 5.3 |
| 802.15.4 (Thread/Zigbee) | Yes | Yes | Yes | Yes | Yes |
| On-module Flash | 16 MB | 16 MB | 16 MB | 16 MB | 16 MB |
| Antenna | PCB trace (integrated) | PCB trace (integrated) | PCB trace (integrated) | PCB trace (integrated) | PCB trace (integrated) |
주요 차별점
- Tri-radio in one module with open-CPU host (vs IRIS-W101-10B)
- Pre-certified regulatory IDs and integrated antenna (vs NXP RW612 reference design (bare IC))
- Hardware revision enables vendor-managed firmware improvements (vs IRIS-W106-00B)
설계 노트
Preserve the antenna keep-out region as specified in the IRIS-W10 series datasheet (UBX-23002331) mechanical drawing: no copper, traces, ground plane, or components may be placed in that area directly under the module. Forgetting the keep-out is the single most common cause of degraded RF performance and certification re-spins. Place the module with its antenna on a board edge, ideally with the antenna extending past the PCB outline if possible.
Decouple VIN and VIO with a 10 uF bulk capacitor close to the module pins, plus a 100 nF ceramic in parallel for high-frequency noise suppression. The IRIS-W10 series runs from 3.3 V on both rails per u-blox's recommended decoupling guidance. Estimated TX current during Wi-Fi 6 5 GHz operation can briefly exceed 500 mA, so the bulk capacitor must have low ESR and adequate voltage margin at 3.3 V. Keep the decoupling loop area small to minimize conducted EMI.
Wi-Fi 6 5 GHz transmissions and concurrent radio operation can raise the module's die temperature above ambient. Provide a thermally conductive copper pour under the module's thermal pad (connected to ground) to spread heat into the PCB. Estimated: in a continuous 5 GHz TX duty cycle at 3.3 V, the module may dissipate 1.5-2 W, requiring thermal relief or forced airflow if used in a sealed enclosure at elevated ambient temperatures.
Don't reuse the IRIS-W106 footprint libraries without verifying against the latest u-blox Altium library revision, as the u-blox forum has documented users needing to import Altium libraries into KiCad for verification. Don't assume the pinout is identical to bare RW612 reference designs - the IRIS-W106 adds module-specific signals on pins that differ from the chip reference. Confirm the correct EVK reference board (EVK-IRIS-W1) for prototype bring-up before laying out production PCBs.
규정 준수 정보
RoHS and REACH compliant per u-blox product page. Module is pre-certified for FCC, ISED, and ETSI but this is not equivalent to AEC-Q100 qualification - the IRIS-W106-10B is not automotive-qualified.
