MAP1608ST1R0MMPK - 1µH Multilayer Metal Alloy Power Inductor | INPAQ
부품 번호: MAP1608ST1R0MMPK ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0.18 | $0.18 |
| 10 | $0.16 | $1.60 |
| 100 | $0.13 | $13.00 |
| 500 | $0.11 | $55.00 |
| 1,000 | $0.09 | $90.00 |
| 3,000 | $0.07 | $210.00 |
MAP1608ST1R0MMPK 개요
A power inductor is a passive energy-storage component that stores energy in a magnetic field when current flows through its winding, then releases that energy to maintain output current during switching-converter off-cycles. The MAP1608ST family sits within the broader taxonomy of power inductors, below chip inductors and above discrete magnetic components, and is commonly deployed on the output side of buck converters in portable electronics, SSDs, and graphics cards. The metal-alloy powder core used here provides a soft saturation curve compared to ferrite, allowing momentary current excursions without abrupt inductance collapse.
Key electrical features include a 1.0 µH nominal inductance at 1 MHz / 1 V test condition, a low DC resistance that enables high-efficiency power transfer, and a multilayer monolithic structure with shielded magnetic flux. The 0603 footprint (1.6 mm × 0.8 mm) matches industry-standard chip-inductors land patterns, allowing direct substitution in existing PCB layouts. Operating temperature range is -40 °C to +125 °C, and the part is supplied in tape-and-reel packaging compatible with high-speed SMT placement.
Typical applications include point-of-load regulation in solid-state drives (SSD), GPU and CPU VRM output filtering, smartphone PMIC output filtering, wearable device power management, and USB-PD adapter secondary-side filtering. The shielded construction makes it particularly suitable for dense PCB layouts where adjacent circuitry is sensitive to stray magnetic flux.
When designing with this inductor, place it as close as possible to the switching-node hot loop to minimize parasitic inductance and EMI. Verify saturation current (Isat) against the maximum peak current of your converter topology rather than relying on the inductance value alone, since metal-alloy cores saturate gradually and a 20 % inductance drop is the conventional derating threshold.
This page synthesizes distributor inventory, datasheet excerpt, and drop-in alternatives sourced from INPAQ's own MAP1608ST series datasheet family, which are not aggregated on any single distributor product page.
드롭인 대체품: MAP1608ST1R0MMPK — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MAP1608ST1R0MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAP1608STR47MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAP1608ST2R2MM
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DFE252012F-1R0M
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
SPM3012T-1R0M
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
LQH3NPN1R0MM0EL
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MAP1608ST1R0MMPK 최대 정격 & 전기적 특성
| Inductance | 1.0 µH |
| Test Frequency | 1 MHz / 1 V |
| 패키지 | 0603 (1608 metric) |
| Package Code | 1608 ST series |
| 실장 유형 | Surface Mount |
| Core Material | Metal alloy powder (monolithic / multilayer construction) |
| Shielding | Yes (closed magnetic flux, monolithic) |
| 동작 온도 범위 | -40 °C to +125 °C |
| Grade | 3C / Industrial (NOT automotive-grade) |
| RoHS 상태 | Compliant |
| Packaging | Tape & Reel |
MAP1608ST1R0MMPK 1608 st series 핀 구성 가이드
MAP1608ST1R0MMPK(1608 st series 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: MAP1608ST1R0MMPK.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MAP1608ST1R0MMPK 적합 용도: 7 애플리케이션s: Solid-State Drive (SSD) Point-of-Load Filtering, Smartphone PMIC Output Filtering, USB-PD Adapter Secondary-Side LC Filter, Wearable Device Power Management, GPU/Graphics Card VRM Output Filtering, IoT / Smart-Home Sensor Node Power, Tablet / Laptop Sub-System Power Filtering.
Solid-State Drive (SSD) Point-of-Load Filtering
The INPAQ MAP1608ST1R0MMPK provides output filtering on the secondary side of buck converters that power NVMe SSD controller cores in DRAM-less and low-power PCIe SSD designs. Its 1.0 µH nominal inductance and 0603 footprint suit the small, dense PCB area inside M.2 2230 and 2242 form factors, while the metal-alloy core's soft saturation curve tolerates transient load-current spikes during NAND write bursts. Compared to ferrite 0603 inductors, the MAP1608ST's closed-flux construction reduces radiated EMI into adjacent high-speed NAND channels, helping designs meet CISPR 25 conducted-emission limits without external shielding.
추천
Smartphone PMIC Output Filtering
The INPAQ MAP1608ST1R0MMPK serves as the output inductor for buck converters inside smartphone PMICs that power application processors, Wi-Fi/Bluetooth transceivers, and 5G modem sub-systems. The part's 1.6 mm × 0.8 mm 0603 footprint and 0.8 mm height fit the camera-module-adjacent placement zones common in modern smartphones, while the metal-alloy core maintains inductance over DC bias better than equivalent ferrite 0603 parts. Designers should derate to 70 % of Isat to avoid thermal issues inside a sealed handset chassis that may reach 60 °C ambient during 5G sustained throughput.
추천
USB-PD Adapter Secondary-Side LC Filter
The INPAQ MAP1608ST1R0MMPK can populate the secondary-side LC post-filter of a 65 W USB-PD adapter, where a 1.0 µH inductor combined with a low-ESR ceramic capacitor forms an output ripple-rejection network below the synchronous rectifier. The part's monolithic metal-alloy construction tolerates the elevated operating temperature (up to 115 °C junction near the adapter's transformer) better than wire-wound 0603 inductors of the same value. Designers should size the output bulk capacitor to keep ripple current within 30 % of rated to leverage the MAP1608ST's soft-saturation behaviour.
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Wearable Device Power Management
The INPAQ MAP1608ST1R0MMPK fits wearable-device buck converters that power low-power MCUs, heart-rate sensors, and always-on display drivers from a 3.7 V Li-ion cell. Its 0603 footprint suits the ultra-compact 6 mm × 6 mm sub-PMIC layouts in modern smartwatches, and the metal-alloy core's gradual saturation curve absorbs the current spikes of BLE radio events without audible or measurable inductance collapse. Designers targeting sub-1 µA quiescent current should pair the MAP1608ST with a low-Iq buck controller and avoid placing it near the haptic-driver's high-current traces.
추천
GPU/Graphics Card VRM Output Filtering
The INPAQ MAP1608ST1R0MMPK is deployed on the output side of VRM phases powering GPU core voltages in mid-range graphics cards and embedded GPU modules. The 1.0 µH value supports multi-MHz switching frequencies used by modern DrMOS-based VRMs (1.5-3 MHz), where the metal-alloy core's low core loss outperforms ferrite 0603 inductors at the same frequency. The closed-flux monolithic construction also reduces crosstalk to adjacent memory VRM phases, which is critical in multi-phase VRMs with phase currents exceeding 30 A.
추천
IoT / Smart-Home Sensor Node Power
The INPAQ MAP1608ST1R0MMPK powers the buck converter output in battery-operated IoT sensor nodes such as wireless temperature, occupancy, and air-quality sensors. Its 1.0 µH nominal suits single-cell Li-ion or 2 × AA battery inputs stepping down to 1.8 V or 3.3 V for the MCU and radio sub-system. The metal-alloy core's stable inductance over the battery-discharge voltage range (3.0 V to 4.2 V) avoids the converter-frequency shift that plagues ferrite-based inductors, simplifying the radio's RX/TX power calibration across battery life.
추천
Tablet / Laptop Sub-System Power Filtering
The INPAQ MAP1608ST1R0MMPK is used in the secondary buck converters that power USB-C interface controllers, audio codec sub-systems, and embedded display drivers inside tablets and thin-and-light laptops. Its 0603 footprint eases placement under BGA packages where router-channel headroom is tight, and the metal-alloy core's closed-flux shielding reduces radiated emissions into the Wi-Fi 6E antenna zone. Designers should monitor the inductor's self-heating under sustained high-load conditions, since the 0603's small thermal mass gives limited heatsinking.
추천
추천 제품 요약
엔지니어링 참조 데이터: MAP1608ST1R0MMPK — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MAP1608ST1R0MM | MAP1608STR47MM | MAP1608ST2R2MM | DFE252012F-1R0M | SPM3012T-1R0M | LQH3NPN1R0MM0EL |
|---|---|---|---|---|---|---|---|
| Package | 0603 (1608 metric) 1.6 mm × 0.8 mm | 0603 (1608 metric) - same | 0603 (1608 metric) - same | 0603 (1608 metric) - same | 2520 (2.5 mm × 2.0 mm) - DIFFERENT footprint, NOT pin-compatible | 3.0 mm × 3.0 mm - DIFFERENT footprint, NOT pin-compatible | 3 mm × 3 mm wire-wound - DIFFERENT footprint, NOT pin-compatible |
| Brand | INPAQ | INPAQ | INPAQ | INPAQ | Murata | TDK | Murata |
| Inductance | 1.0 µH | 1.0 µH | 0.47 µH | 2.2 µH | 1.0 µH | 1.0 µH | 1.0 µH |
| Tolerance | ±20 % | ±20 % | ±20 % | ±20 % | ±20 % | ±20 % | ±20 % |
| Core Material | Metal alloy (monolithic) | Metal alloy (monolithic) | Metal alloy (monolithic) | Metal alloy (monolithic) | Metal alloy (shielded) | Metal composite (shielded) | Ferrite (wire-wound) |
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +85 °C |
| Automotive Grade | No (3C/Industrial only) | No | No | No | No (commercial) | No (commercial, automotive variants exist in family) | No |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
주요 차별점
- Monolithic metal-alloy closed-flux shielding in a 0603 body (vs Murata LQH3NPN1R0MM0EL)
- Higher operating temperature ceiling vs wire-wound competitors (vs Murata LQH3NPN1R0MM0EL)
- Smaller footprint vs larger shielded power inductors (vs TDK SPM3012T-1R0M)
설계 노트
Estimated: at 1 A DC load with a typical DCR of ~50 mΩ (industry-typical for 1 µH 0603 metal-alloy), the steady-state dissipation is roughly 50 mW, producing a temperature rise of ~10-15 °C above ambient on a 1 oz copper 0603 land pad. For sustained 2 A load, designers should account for a 30-40 °C rise and verify that ambient + self-heating stays below the 125 °C upper operating limit. Add thermal vias beneath the land pads if the inductor is buried under a power-MOSFET that is itself dissipating watts.
Place the MAP1608ST1R0MMPK's two terminations on a continuous copper pour with at least 1 oz weight, and route the high-current loop (input cap → top switch → inductor → output cap) as tight a hot loop as possible. The closed-flux monolithic construction eliminates stray field concerns, but the part still benefits from a ground plane immediately beneath it for thermal spreading. Avoid routing analogue signal traces within 3 mm of the inductor body if those signals have edge rates below 1 ns.
Designers sometimes assume the metal-alloy 0603 inductor can be substituted onto any 0603 land pattern - this is true within the same footprint but NOT across the alternative parts listed above: Murata DFE252012F-1R0M (2520) and TDK SPM3012T-1R0M (3 mm × 3 mm) have larger footprints and will not solder onto a 0603 land pattern. Always verify mechanical outline dimensions, not just inductance value, before substituting. Also note that the part is NOT AEC-Q200 qualified and must not be used in automotive designs without further qualification.
For noise-sensitive converter designs, route the feedback (FB) trace away from the inductor's switched-node end and back to the output cap's ground-side terminal using a kelvin-style connection. This minimises the high-frequency switching noise coupling into the feedback path and reduces output ripple. If the converter uses synchronous rectification, place the low-side MOSFET's source return directly under the inductor's output-side land pad to minimise ground bounce.
규정 준수 정보
RoHS compliant per INPAQ MAP1608ST series datasheet. AEC-Q200 is the relevant automotive inductor qualification (not AEC-Q100); the MAP1608ST family is NOT AEC-Q200 qualified and is explicitly for 3C / industrial-grade use only, per INPAQ datasheet disclaimer.
