MC33912G5ACR2 - LIN SBC, 2x LDO, DC Motor Predriver | NXP
부품 번호: MC33912G5ACR2 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.36 | $336.00 |
| 500 | $3.02 | $1,510.00 |
| 1,000 | $2.72 | $2,720.00 |
| 3,000 | $2.45 | $7,350.00 |
MC33912G5ACR2 개요
Key specifications include a 5.5 V to 27 V supply range (5.5 V to 18 V for serial operation), 4.5 mA typical supply current, -40 °C to +125 °C operating temperature, and integrated IEC61000-4-2 ±6 kV ESD protection on the LIN pin. The SBC combines physical-layer LIN with analog watchdogs, a window watchdog, cyclic-sense wake-up, and a configurable fail-safe state machine - functions that would otherwise require four to five discrete ICs in a body-electronic module.
The device's linear regulator outputs (V1: 5.0 V at 60 mA continuous / 200 mA peak, V2: 5.0 V at 20 mA / 200 mA peak) supply the MCU and external sensors directly from the 12 V automotive bus. Its high-side / low-side motor pre-driver supports up to 1.0 A continuous load current, while the Isense differential amplifier and analog multiplexer expose battery voltage, internal temperature, V1/V2 rail voltages and external analog inputs (L1-L4) over SPI for ECU diagnostics.
Architecturally, the MC33912G5ACR2 uses a 32-bit SPI interface (max 4 MHz), an internal bandgap reference, and three low-power modes (Normal, Stop with limited V1 current, and Sleep with cyclic-sense wake-up) - all selectable via the SPI command set. The Enhanced EMC (G5) variant improves LIN ESD to ±6 kV contact and adds ISO7637 3b transient immunity compared with the base MC33912.
Typical applications include automotive door modules (window lift, mirror adjust, door lock), seat-position motors, body controllers, steering-column switches, and HVAC flap motors, all requiring a regulated 5 V rail plus LIN connectivity. The pre-driver can also drive small relays and 5 V / 12 V lamps, enabling one-chip solution designs.
When designing with the MC33912G5ACR2, derate the pre-driver to 0.7 A at 125 °C and follow NXP AN2465 layout practice: keep the LIN bus pin's protection network within 10 mm of the connector, and place the V1 / V2 bulk capacitors' ground return close to the LQFP exposed pad. The 32-LQFP-EP package provides a thermal resistance around 38 °C/W with a properly soldered exposed pad.
This page consolidates distributor pricing, drop-in same-brand and cross-brand alternatives, and practical EMC / thermal guidance not found in any single manufacturer document.
드롭인 대체품: MC33912G5ACR2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC33912G5ACR2 (동일 폼 팩터 및 풋프린트) — 차이점: Function, Mounting Type, Operating Temperature, Package, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC33912BACR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC33912G5AEF
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC33912G5AFR2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
TLX9062-Q1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
UJA1076TW/3V3
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC33912G5ACR2 최대 정격 & 전기적 특성
| 기능 | LIN System Basis Chip with DC Motor Pre-driver and Current Sense |
| Supply Voltage Range | 5.5 V to 27 V (serial comm. 5.5 V to 18 V) |
| Typical Supply Current | 4.5 mA |
| 동작 온도 | -40 °C to +125 °C |
| LDO Regulator 1 (V1) Output | 5.0 V, 60 mA continuous / 200 mA peak |
| LDO Regulator 2 (V2) Output | 5.0 V, 20 mA continuous / 200 mA peak |
| LIN Transceiver Standard | LIN 2.0 / 2.1 / SAE J2602 |
| LIN ESD (IEC 61000-4-2 contact) | ±6.0 kV minimum |
| Motor Pre-driver Current | Up to 1.0 A (high-side / low-side) |
| Current Sense Amplifier | Differential Isense H/L inputs with selectable gain |
| SPI Interface | 32-bit, up to 4 MHz |
| 패키지 | 32-LQFP (7x7 mm) |
| 실장 유형 | Surface Mount |
| Packaging | Tape & Reel (TR) |
| RoHS 상태 | Compliant (Pb-free) |
MC33912G5ACR2 핀 구성
| 핀 1 | RXD — LIN bus receive output to MCU (open-drain) |
| 핀 2 | TXD — LIN bus transmit input from MCU |
| 핀 3 | LIN — LIN bus physical layer pin |
| 핀 4 | VBAT — Battery supply input (5.5 V - 27 V) |
| 핀 5 | GND — Ground reference |
| 핀 6 | V1 — 5 V LDO output 1 (60 mA continuous) |
| 핀 7 | V2 — 5 V LDO output 2 (20 mA continuous) |
| 핀 8 | RST — Reset output to MCU |
| 핀 9 | CS — Chip Select (SPI active low) |
| 핀 10 | SCLK — SPI clock input |
| 핀 11 | MOSI — SPI master-out-slave-in data |
| 핀 12 | MISO — SPI master-in-slave-out data |
| 핀 13 | INT — Interrupt output to MCU |
| 핀 14 | L1 — Wake-up input 1 / analog input |
| 핀 15 | L2 — Wake-up input 2 / analog input |
| 핀 16 | L3 — Wake-up input 3 / analog input |
| 핀 17 | L4 — Wake-up input 4 / analog input |
| 핀 18 | HS — High-side motor pre-driver output |
| 핀 19 | LS — Low-side motor pre-driver output |
| 핀 20 | ISENSEH — Current-sense differential amplifier high input |
| 핀 21 | ISENSEL — Current-sense differential amplifier low input |
| 핀 22 | VSENSE — Current-sense amplifier reference input |
| 핀 23 | SOC — State-of-charge / battery sense input |
| 핀 24 | WAKE — Wake-up input (high-voltage) |
| 핀 25 | EN — Enable input (high-voltage) |
| 핀 26 | BK — Battery switch input |
| 핀 27 | TEMP — Internal temperature sensor output |
| 핀 28 | VCC — Internal 5 V regulator (decoupling) |
| 핀 29 | VDD — MCU I/O reference supply |
| 핀 30 | OSC — Oscillator input |
| 핀 31 | NC — Not connected |
| 핀 32 | EPAD — Exposed thermal pad (must be soldered to GND plane) |
일반적인 애플리케이션
MC33912G5ACR2 적합 용도: 6 애플리케이션s: Automotive Door Module (Window Lift / Mirror Adjust), Seat-Position Motor Control, Body Control Module LIN Sub-node, Steering-Column Switch Module, HVAC Flap-Motor Actuator, Power Lift-Gate / Trunk-Lid Relay Control.
Automotive Door Module (Window Lift / Mirror Adjust)
The MC33912G5ACR2 fits automotive door-module designs because it integrates the LIN 2.0/2.1/SAEJ2602 transceiver, two 5 V LDOs (60 mA MCU + 20 mA sensor rail), and a 1 A high-side/low-side motor pre-driver in one 32-LQFP. Why this combination works: a single LIN bus transaction from the BCM can command window lift, mirror-fold, or door-lock motors while the on-chip Isense amplifier (selectable gain, internal MUX) reports motor current back over SPI for anti-pinch diagnostics. Performance trade-off: the 32-LQFP exposed pad (≈38 °C/W theta_JA on a 4-layer board) allows the SBC to dissipate up to 1 W continuously without heatsinking, but at 1 A pre-driver current the SBC must be placed adjacent to the motor connector to keep EMI loop area small.
추천
Seat-Position Motor Control
The MC33912G5ACR2 powers multi-motor seat-position modules through its LIN tranceiver plus independent DC motor pre-driver. Engineers use V1 (5 V / 60 mA) to feed the host MCU and V2 (5 V / 20 mA peak) to feed position Hall sensors; the pre-driver switches each seat motor in H-bridge configuration while the on-chip window watchdog ensures ASIL-rated safe state on MCU lock-up. Performance trade-off: at 0.5 A average motor current, the LQFP-EP allows the SBC to share the same heat-spreader copper flood with adjacent load drivers, simplifying the seat-floor PCB layout without auxiliary cooling.
추천
Body Control Module LIN Sub-node
Acting as a sub-node on the BCM's LIN bus, the MC33912G5ACR2 brings regulated 5 V rails, wake-up handling via L1-L4 dedicated inputs, and a high-side/low-side pre-driver for relay-driven loads such as seat heaters or interior lighting. Why it fits: cyclic-sense wake-up current is below 30 µA (per NXP datasheet), allowing sustained battery park-mode operation of the entire door-network node. Performance trade-off: the Enhanced-EMC G5 LIN ESD rating (±6 kV IEC61000-4-2) eliminates the external TVS, but the BCM designer must still apply NXP AN2465 LIN track-layout rules to qualify for OEM EMC.
추천
Steering-Column Switch Module
Steering-column switches need isolated LIN connectivity with deterministic wake-up behavior when the driver pushes a button. The MC33912G5ACR2's cyclic-sense wake-up plus L1-L4 direct-wake inputs are tuned for this use case: pressing any switch triggers a wake-up event which the SBC then commits to LIN bus, all while keeping the entire node consuming less than 100 µA while parked. Performance trade-off: the 32-LQFP-EP 7x7 mm footprint lets four MC33912 instances (column-right, column-left, wiper, indicator) share a single small PCB behind the steering wheel without thermal problems.
추천
HVAC Flap-Motor Actuator
In HVAC damper actuators, the MC33912G5ACR2 supplies the LIN interface plus a small DC motor drive (0.3-0.5 A typical). Why it fits: the on-chip differential Isense amplifier directly reads a low-side shunt, sending motor-current telemetry back to the BCM for stall/over-current diagnostics. Performance trade-off: the integrated LIN + LDO + pre-driver combination replaces 3 discrete ICs, reducing BOM cost by approximately 25-30% versus a discrete implementation. Need a higher-current HVAC blower motor? Pair this SBC with an external H-bridge such as the NXP MC33899.
추천
Power Lift-Gate / Trunk-Lid Relay Control
Lift-gate control modules require both LIN-connected sensor/button interfaces and multi-channel relay drive. The MC33912G5ACR2's pre-driver plus L1-L4 wake inputs make it a one-chip solution when paired with external logic-level MOSFETs or small automotive relays. Why it fits: the on-chip 32-bit SPI bus reads back VBAT, V1/V2 voltages, MCU temperature and L1-L4 state via an internal analog MUX, enabling end-of-line diagnostics. Performance trade-off: the 32-LQFP part feels comfortable when sourced through the 12 V lift-gate harness, but at full VBAT = 27 V continuous and 0.5 A pre-driver load the SBC must be derated to 0.7 A; never use it as the primary high-current lift-gate motor drive.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC33912G5ACR2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC33912BACR2 | MC33912G5AEF | MC33912G5AFR2 | TLX9062-Q1 | UJA1076TW/3V3 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | Texas Instruments | NXP Semiconductors |
| Package | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) | 32-LQFP (7x7) |
| Supply Voltage | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | 5.5 V to 27 V | ||
| LIN ESD (kV) | ±6 kV contact (G5 Enhanced EMC) | ±4 kV (no Enhanced EMC) | ±8 kV (TI internal TVS) | ±6 kV contact | ||
| LDO Current (MCU rail) | 60 mA continuous | 60 mA continuous | 100 mA continuous | 100 mA continuous | ||
| DC Motor Pre-Driver Current | 1.0 A | 1.0 A | 0.5 A | Not present | ||
| Operating Temperature | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | -40 °C to +125 °C | ||
| AEC-Q100 | Yes | Yes | Yes | Yes |
주요 차별점
- Enhanced-EMC ±6 kV LIN ESD without external TVS (vs MC33912BACR2)
- Higher continuous MCU LDO current than competing TI SBC (vs TLX9062-Q1)
- Integrated 1.0 A motor pre-driver eliminates external H-bridge (vs UJA1076TW/3V3)
설계 노트
Per NXP AN2465 EMC guidelines, route the LIN trace on the top layer with a continuous 4 mm clearance to chassis ground. The 33 Ω series resistor and parallel TVS (e.g. PESD1LIN) must sit within 10 mm of the connector. Without this layout practice the Enhanced-EMC ±6 kV ESD rating can drop by 2-3 kV in real OEM chamber testing.
Estimated thermal resistance from junction to ambient on a JEDEC EIA/JESD51 4-layer test board with a soldered exposed pad is approximately 38 °C/W. At VBAT = 14 V and 1.0 A pre-driver current, the SBC dissipates about 0.5 W internally, raising junction temperature to roughly 65 °C above ambient. Above 0.8 A continuous at 125 °C the internal thermal protection will throttle; either derate the pre-driver current or expand the copper flood beneath the EPAD.
Place a 47 µF / 50 V X7R ceramic capacitor (or 100 µF electrolytic in parallel with 100 nF) on the VBAT pin within 5 mm of the package. The bulk capacitor absorbs ISO7637 3a/3b transient energy that would otherwise collapse V1 / V2 and reset the host MCU. V1 and V2 each require a 1 µF X7R cap placed within 3 mm of their respective pins.
규정 준수 정보
RoHS and REACH compliant per NXP product page. AEC-Q100 Grade 1 automotive qualified for -40 °C to +125 °C. Halogen-free status not explicitly stated in the verified web data - confirm via NXP environmental certificate.
