MC7447AVU733NB - PowerPC G4 MPU 733MHz 360-FCCBGA | NXP
부품 번호: MC7447AVU733NB ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88 | $880.00 |
| 100 | $82 | $8,200.00 |
| 500 | $76.5 | $38,250.00 |
| 1,000 | $72 | $72,000.00 |
MC7447AVU733NB 개요
A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, register file, and cache memory of a computer central processing unit on a single die. MCUs further integrate peripherals, but MPUs like the MPC7447A rely on external memory controllers and I/O, placing them in the hierarchy: MPU -> processor -> SoC building block -> embedded computing platform. The PowerPC G4 architecture in particular traces its lineage to AIM (Apple-IBM-Motorola) and was deployed widely in networking, telecom, aerospace, and embedded Linux systems.
Key features of the MC7447AVU733NB include: 733 MHz core clock, 1.8 V core / 2.5 V I/O supply, 0.13-micron silicon-on-insulator (SOI) process, 512 KB unified L2 cache, AltiVec 128-bit vector processing unit, a 64-bit MPX bus to external memory, and a 360-ball FCCBGA flip-chip land grid array that supports high-frequency signaling. The SOI process technology is engineered to deliver significant power savings without sacrificing speed relative to the prior MPC7447 generation. Multipliers in the AltiVec engine accelerate DSP-style kernels such as FFT, FIR filtering, and color-space conversion.
Architecturally the part integrates a 7-stage integer pipeline plus separate vector and load/store units, allowing out-of-order completion of memory operations while preserving in-order program semantics. Hardware multimedia support is provided through the AltiVec unit executing SIMD instructions on 16-byte vector registers. The 64-bit MPX bus interface accommodates high-bandwidth external SDRAM, allowing sustained throughput into the on-chip L2 cache for cache-miss service. Test and debug features include JTAG 1149.1 boundary scan.
Typical applications include embedded Linux routers, high-performance industrial control, aerospace and military single-board computers, and telecom line cards. Because the part is no longer recommended for new designs, it most commonly sustains long-life platforms in defense, aviation, and industrial HMI retrofits where tooling and firmware already in the field must be preserved.
When designing with this MPU, pair it with a matched Northbridge/Southbridge (such as the MPC107 or Tsi107) for system logic. Mind the flip-chip BGA reflow profile precisely - the FCCBGA land pattern requires temperature-controlled board assembly and likely X-ray inspection of solder joints. Stocking lifecycle: confirm Last-Time-Buy windows directly with the supplier for production continuity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: MC7447AVU733NB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC7447AVU733NB (동일 폼 팩터 및 풋프린트) — 차이점: I/O Supply Voltage, Mounting Type, Package, Process Technology.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC7447AVU1000NB
✅ 드롭인✓ 재고 있음
$99.5 / 개
데이터시트 보기 →MC7447AHX1000LB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC7447AHX733NB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC7447AVU867NB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC7447AVU733NB
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC7447AVU733NB 최대 정격 & 전기적 특성
| Core Processor | PowerPC G4 (MPC74xx) |
| Architecture | RISC, 32-bit |
| Number of Cores | 1 |
| Speed (Clock Frequency) | 733 MHz |
| On-Chip L2 Cache | 512 KB |
| External Bus Width | 64-bit MPX bus |
| Vector Engine | AltiVec 128-bit SIMD |
| Process Technology | 0.13 um silicon-on-insulator (SOI) |
| Core Supply Voltage | 1.8 V |
| I/O Supply Voltage | 2.5 V |
| 패키지 | 360-FCCBGA (25x25 mm) |
| 실장 유형 | Surface Mount (Flip-Chip BGA) |
| Co-Processor / DSP | Multimedia; SIMD (AltiVec) |
| Graphics Acceleration | No |
| Tray Packaging | Yes (Tray) |
| Lead-Free (Pb-Free) | Yes (per datasheet A7PM PB-FREE marking) |
MC7447AVU733NB 핀 구성
| 핀 A1 | [DATA_NEEDED: ball A1] — Ball identifier per datasheet BGA map |
| 핀 A2 | [DATA_NEEDED: ball A2] — Ball identifier per datasheet BGA map |
| 핀 B1 | VDD — Core supply voltage (1.8 V nominal) |
| 핀 B2 | GND — Ground reference |
일반적인 애플리케이션
MC7447AVU733NB 적합 용도: 6 애플리케이션s: Embedded Industrial Control Platform, Aerospace and Defense Single-Board Computer, Telecom Line Card and Routing Platform, Image and Video Processing Subsystem, Medical Embedded Imaging Equipment, High-Performance Embedded Linux Platform.
Embedded Industrial Control Platform
The MC7447AVU733NB's 733 MHz PowerPC G4 core with AltiVec SIMD provides deterministic 32-bit compute for industrial motion controllers, PLCs, and SCADA nodes in long-life factory automation. Its 512 KB on-chip L2 cache keeps latency low for fast-loop control tasks, while the 64-bit MPX bus sustains throughput for real-time Ethernet fieldbus and device-net gateways. Legacy firmware built for PowerPC G4 instructions ports directly, allowing factories to extend installed lines well past the MPU's Last-Time-Buy date. The 360-FCCBGA package with the matched Northbridge (MPC107 / Tsi107) is the proven system topology for harsh-industrial temperature operation.
추천
Aerospace and Defense Single-Board Computer
Avionics, MIL-STD-1553, and avionics-control SBCs adopted the PowerPC G4 platform because of its deterministic execution and ruggedized temp-grade screening. The MC7447AVU733NB's 360-FCCBGA flip-chip package resists high-vibration environments when mounted with underfill and reinforced BGA pads. The AltiVec engine accelerates crypto primitives (AES, SHA) for secure communications payloads. Because defense programs run 15-25 year support windows, the part is typically bought under Last-Time-Buy with Rochester Electronics as aftermarket support. Same-footprint MPC7447A variants (866 MHz, 1.0 GHz) can be subbed for higher-throughput upgrades.
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Telecom Line Card and Routing Platform
Edge routers, DSLAM line cards, and protocol converter blades used PowerPC G4 MPUs for packet processing at multi-Gbps line rates. The MC7447AVU733NB's AltiVec SIMD accelerates IPsec, queue management, and Huffman/LZ payload compression, while its 64-bit MPX bus feeds the network processor or DMA engine from external SDRAM. The 1.8 V core / 2.5 V I/O split keeps power within the typical line-card budget at 733 MHz. Existing carrier-grade firmware compiles and runs without change, simplifying long-life telecom fleet maintenance.
추천
Image and Video Processing Subsystem
Industrial machine-vision cameras and medical-imaging preprocessing boards rely on the AltiVec 128-bit vector unit to perform per-pixel operations at line rate. On the MC7447AVU733NB at 733 MHz, AltiVec performs a 4x4 color-space conversion or 8x8 DCT in fewer cycles than scalar code, fitting real-time pipelines at modest clock rates. The 512 KB L2 cache absorbs working-set churn during frame processing, while the 360-FCCBGA package keeps the layout compact in compact camera PCBs. The integrated multimedia support eliminates an external DSP, reducing BOM and validation cost.
추천
Medical Embedded Imaging Equipment
Diagnostic imaging carts, ultrasound beamformers, and patient-monitoring consoles built a generation around the MPC7447A for image-pipeline throughput and long-term firmware stability. The MC7447AVU733NB's deterministic PowerPC instruction set, validated clock gating, and 1.8 V low-power SOI process fit a portable-cart power budget. AltiVec performs adaptive beamforming and Hilbert transforms in ultrasound front-ends, eliminating a second DSP. The flip-chip BGA allows compact, EMI-controlled layouts for noise-sensitive analog front ends.
추천
High-Performance Embedded Linux Platform
Linux-based routers, NAS appliances, and industrial gateways historically ran on the PowerPC G4 because of robust SMP-friendly MMU and abundant AltiVec acceleration for network payload processing. The MC7447AVU733NB supports a full Linux/PPC kernel with on-chip L2 cache for filesystem caching, plus JTAG 1149.1 boundary scan for production test. Same-footprint MPC7447A bins let integrators tune cost vs clock without re-spinning the carrier board. Field deployments rely on long-term kernel support and BIT (built-in test) routines built into the firmware.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC7447AVU733NB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC7447AVU1000NB | MC7447AHX1000LB | MC7447AHX733NB | MC7447AVU867NB | MPC7447AVU733NB |
|---|---|---|---|---|---|---|
| Package | 360-FCCBGA (25x25 mm) | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same | 360-FCCBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 733 MHz | 1000 MHz | 1000 MHz (HX bin) | 733 MHz (HX bin) | 867 MHz | 733 MHz |
| L2 Cache | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| I/O Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| AltiVec SIMD | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) | Yes (128-bit) |
| External Bus | 64-bit MPX | 64-bit MPX | 64-bit MPX | 64-bit MPX | 64-bit MPX | 64-bit MPX |
| Process Technology | 0.13 um SOI | 0.13 um SOI | 0.13 um SOI | 0.13 um SOI | 0.13 um SOI | 0.13 um SOI |
| Lifecycle | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
주요 차별점
- AltiVec 128-bit SIMD engine integrated on chip (vs Generic ARM Cortex-A8 based MPU at the same clock)
- 360-FCCBGA flip-chip package for ruggedized systems (vs Wire-bond BGA packages on most competing MPUs)
- 0.13 um SOI process yields higher clocks at lower power (vs MPC7447 (non-SOI predecessor))
설계 노트
The 360-FCCBGA (25x25 mm) flip-chip land pattern requires precise thermal profiling and strict coplanarity control during reflow. Use a 6-zone reflow profile with peak temperature per the BGA solder paste specification, and ensure the PCB is designed with a 4-layer stack-up featuring continuous power and ground planes beneath the BGA. Non-collapsing solder spheres should be paired with an appropriate paste and via-in-pad geometry to mitigate voids. Underfill is strongly recommended for aerospace and defense deployments to improve thermal-cycling and mechanical-vibration endurance.
Decouple VDD (1.8 V core) and OVDD (2.5 V I/O) directly at each ball. Place 0402-size 0.1uF X7R ceramic capacitors within 1 ball-pitch of the supply balls; for the bulk core supply, use 10 uF X5R tantalum or ceramic caps per supply region. The 64-bit MPX bus runs at 133 MHz; route it with matched length +/- 50 mil, controlled impedance (50 ohm single-ended), and significant ground shielding to suppress crosstalk. JTAG signals (TCK, TMS, TDI, TDO, TRST) should be guarded with ground traces and pulled to a known state at the TAP connector to avoid spurious board-test access.
At 733 MHz the part dissipates roughly 5-8 W typical into the flip-chip substrate; derate linearly with clock and voltage. Estimate junction temperature rise with theta_JA from the manufacturer datasheet (typical 0.6-0.9 C/W for a 25x25 FCCBGA on a JEDEC test board). In a sealed enclosure, plan for forced-air cooling at 1-2 m/s over the package. For outdoor or industrial enclosures, extend the heatsink onto adjacent northbridge ICs because the 360-ball package distributes heat largely through the PCB core.
Do not assume the part works without a properly initialized external clock source - the MC7447AVU733NB expects a system clock input before reset de-assertion, with the PLL configured per the Hardware Specifications document. Incorrect PLL settings can hang the boot loader and brick an otherwise functional unit. Also note that the part shares the MPC7447A die family; code written for MPC7447 (without 'A') may not use AltiVec extensions and will underperform its hardware. Plan firmware verification before reusing legacy 7447 builds.
The 1.8 V core must ramp up before the 2.5 V I/O supply to prevent internal latch-up; this is documented as power-sequence ordering in the manufacturer Hardware Specifications. Hold HRESET asserted until both rails are stable and the system clock is locked. After de-asserting HRESET, poll the BIST/PLL status registers and proceed to firmware load only after confirming the PLL is locked and the L2 cache is initialized per device-tree or board-support-package convention.
규정 준수 정보
Pb-Free marking on the package (A7PM PB-FREE) per the Hardware Specification Addendum. RoHS compliance inferred from manufacturer marking. REACH and conflict-mineral declarations are not provided in the verified data and are marked 'unknown' to comply with the data-authenticity policy.