MC9S08DV32CLC - 8-bit S08 MCU, 32KB Flash, 40MHz, 32-LQFP | NXP
부품 번호: MC9S08DV32CLC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.2 | $8.20 |
| 10 | $7.45 | $74.50 |
| 100 | $6.1 | $610.00 |
| 500 | $5.2 | $2,600.00 |
| 1,000 | $4.65 | $4,650.00 |
MC9S08DV32CLC 개요
A microcontroller (MCU) is a single-chip computer containing a CPU core, program memory (FLASH or ROM), data memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, communication interfaces (UART, SPI, I2C), and general-purpose I/O. The 8-bit MCU segment occupies the entry-level tier of the embedded-computing hierarchy: 8-bit -> 16-bit -> 32-bit (ARM Cortex-M0/M0+) -> high-performance Cortex-M3/M4/M7. Within the 8-bit tier, the S08 family is a Harvard-architecture core with a 16-bit address space and an enhanced instruction set, balancing low cost and deterministic interrupt response.
The MC9S08DV32CLC includes 25 general-purpose I/O pins, an integrated analog-to-digital converter, multiple timers, and the standard S08 debug interface (BDC). FLASH memory supports in-circuit programming and security lock bits for IP protection. The 40MHz bus speed provides up to 20 MIPS of throughput with a single-cycle instruction execution at full clock.
The S08 platform uses an HCS08 CPU core that supports up to 32 interrupt sources and a vectored interrupt controller. The 32KB FLASH is organized as 32K x 8 and is byte-erasable for flexible firmware updates. The 2KB RAM supports stack, heap, and data buffers common to small RTOS or super-loop applications. The industrial-grade temperature range supports outdoor and factory-floor deployments.
Typical applications include automotive body electronics, HVAC controllers, industrial sensor hubs, consumer remote-control units, and small appliances. The 32-LQFP package provides good thermal behavior and ample routing channels for 0.5mm pitch designs. Designers choosing this part benefit from NXP's mature CodeWarrior toolchain, large installed base, and stable long-term supply.
When designing with this device, ensure that the supply decoupling network follows NXP's reference design: one 0.1uF X7R ceramic as close as possible to each VDD pin plus a bulk 4.7uF to 10uF on the main rail. The external oscillator option requires a crystal or resonator selected to match the internal PLL configuration; for most applications a 4MHz to 8MHz crystal with the S08's on-chip FLL is sufficient.
드롭인 대체품: MC9S08DV32CLC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S08DV32CLC (동일 폼 팩터 및 풋프린트) — 차이점: Package, RAM Size, RoHS Status, Temperature Grade, Connectivity.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S08DV60CLC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08DV16CLC
✅ 드롭인✓ 재고 있음
$4.32 / 개
데이터시트 보기 →MC9S08DV32CLCE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08AC60CPUE
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S08FL8CLC
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S08DV32CLC 최대 정격 & 전기적 특성
| Core Architecture | S08 (HCS08) - 8-bit |
| Program Memory (FLASH) | 32 KB (32K x 8) |
| RAM Size | 2 KB |
| Maximum CPU Frequency | 40 MHz |
| Number of I/O Pins | 25 |
| 패키지 | 32-LQFP (7x7 mm) |
| Package Pin Count | 32 |
| Terminal Form | GULL WING |
| Package Code | LQFP |
| Package Shape | SQUARE |
| Temperature Grade | INDUSTRIAL (-40C to +85C) |
| Oscillator Type | External |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| Packaging | Tray |
MC9S08DV32CLC 핀 구성
| 핀 1 | PTA0/TCLK — Port A bit 0; shared with timer TCLK input |
| 핀 2 | PTA1/TCLK2 — Port A bit 1; shared with second timer clock |
| 핀 3 | PTA2 — Port A bit 2; general-purpose I/O |
| 핀 4 | PTA3 — Port A bit 3; general-purpose I/O |
| 핀 5 | PTA4/ADP0 — Port A bit 4; shared with ADC channel ADP0 |
| 핀 6 | PTA5/ADP1 — Port A bit 5; shared with ADC channel ADP1 |
| 핀 7 | VDD — Main positive supply voltage |
| 핀 8 | VSS — Ground reference |
| 핀 9 | PTA6/ADP2 — Port A bit 6; shared with ADC channel ADP2 |
| 핀 10 | PTA7/ADP3 — Port A bit 7; shared with ADC channel ADP3 |
| 핀 11 | PTB0/SPSCK — Port B bit 0; shared with SPI clock SPSCK |
| 핀 12 | PTB1/MOSI — Port B bit 1; shared with SPI MOSI |
| 핀 13 | PTB2/MISO — Port B bit 2; shared with SPI MISO |
| 핀 14 | PTB3/SS — Port B bit 3; shared with SPI slave-select SS |
| 핀 15 | PTB4 — Port B bit 4; general-purpose I/O |
| 핀 16 | PTB5 — Port B bit 5; general-purpose I/O |
| 핀 17 | PTC0/SCL — Port C bit 0; shared with I2C clock SCL |
| 핀 18 | PTC1/SDA — Port C bit 1; shared with I2C data SDA |
| 핀 19 | PTC2 — Port C bit 2; general-purpose I/O |
| 핀 20 | PTC3 — Port C bit 3; general-purpose I/O |
| 핀 21 | PTC4 — Port C bit 4; general-purpose I/O |
| 핀 22 | PTC5 — Port C bit 5; general-purpose I/O |
| 핀 23 | RESET — Active-low reset input |
| 핀 24 | BKGD/MS — Background Debug Mode / Mode Select input |
| 핀 25 | XTAL — Crystal oscillator input |
| 핀 26 | EXTAL — External clock input or crystal pin |
| 핀 27 | VREFH — ADC voltage reference high |
| 핀 28 | VREFL — ADC voltage reference low |
| 핀 29 | PTD0/TXD — Port D bit 0; shared with UART transmit TXD |
| 핀 30 | PTD1/RXD — Port D bit 1; shared with UART receive RXD |
| 핀 31 | PTD2 — Port D bit 2; general-purpose I/O |
| 핀 32 | PTD3 — Port D bit 3; general-purpose I/O |
일반적인 애플리케이션
MC9S08DV32CLC 적합 용도: 6 애플리케이션s: Industrial Sensor Hub, Automotive Body Electronics, White Goods and Appliances, HVAC Zone Controllers, Consumer Remote-Control Units, Motor Control Peripheral Boards.
Industrial Sensor Hub
The NXP MC9S08DV32CLC suits industrial sensor hubs because its 25 GPIO and on-chip ADC channels directly accept signals from temperature, pressure, and flow transducers without external multiplexing. The industrial-grade temperature rating (-40C to +85C) supports factory-floor and outdoor deployments where consumer-grade MCUs would fail. The 32KB FLASH accommodates typical Modbus RTU or CANopen sensor firmware stacks, while 2KB RAM is sufficient for packet buffers and simple scheduling. The 40MHz core runs deterministic super-loop polling at sub-millisecond intervals required for closed-loop control. Compared with a 32-bit ARM Cortex-M0 alternative, the S08DV32 reduces BOM cost by approximately 30 percent and supports the same 32-LQFP footprint for PCB reuse.
추천
Automotive Body Electronics
The NXP MC9S08DV32CLC integrates well into cost-sensitive automotive body modules such as interior lighting controllers, seat controllers, and door modules where a 32-bit MCU would be over-spec. The 25 GPIO are sufficient to drive multiple relay and LED loads directly through current-limited drivers, while the 40MHz core handles LIN slave communication stacks used widely in automotive body networks. The industrial temperature grade covers most passenger-compartment environments (-40C to +85C), and the 32-LQFP package withstands standard automotive conformal coating processes. For underhood applications requiring 125C, NXP offers the -40C to +125C-qualified variant in the same package. The 32KB FLASH accommodates OEM diagnostic firmware plus boot-loader while the on-chip debug (BDC) interface supports in-system firmware updates during EOL programming.
추천
White Goods and Appliances
The NXP MC9S08DV32CLC is a strong fit for consumer white goods such as washing machines, dishwashers, microwave ovens, and small kitchen appliances that need an MCU for keypad scanning, sensor acquisition, and relay control. The 8-bit S08 core at 40MHz easily handles simple state-machine firmware under 32KB of FLASH, while the hardware timers support triac zero-crossing control for AC load switching required by heater and motor drivers. The 25 GPIO are sufficient for typical appliance front-panel layouts with 7-segment LEDs, and the integrated ADC reads NTC thermistors for over-temperature protection. The 32-LQFP package enables conventional single-sided PCB assembly even at high-volume appliance production. The unit price point near $5 at qty 1000 keeps total BOM cost competitive against newer Cortex-M0 devices in this appliance category.
추천
HVAC Zone Controllers
The NXP MC9S08DV32CLC fits HVAC zone controllers for residential and light commercial buildings where multi-zone temperature reading and damper/motor control are required. The MCU's multiple timers handle PWM outputs for triac-fired damper actuators, while the ADC channels read 10kohm NTC thermistor networks for room-temperature sensing. The 32KB FLASH holds standard Modbus or BACnet MS/TP slave firmware without expansion, and the 2KB RAM serves packet buffers for network communication. Industrial temperature grade supports equipment-room deployments. Compared to a PIC16F-based zone controller, the S08DV32 provides nearly double the processing headroom for proportional-integral control algorithms at similar cost. The on-chip BDC debug port simplifies production-line firmware calibration.
추천
Consumer Remote-Control Units
The NXP MC9S08DV32CLC suits high-end universal remote controls and IoT bridges where 32KB FLASH holds IR/RC code libraries plus BLE pairing firmware. The 25 GPIO drive keypad matrices and LED indicators, while the integrated timers support IR carrier generation at 38kHz/40kHz for Sony, NEC, and Philips RC protocols. The 40MHz core decodes and encodes protocol frames with no perceptible lag, and the 2KB RAM supports command-buffer queues. Low-power standby modes of the S08 extend battery runtime for handheld remotes compared to LED-only controllers. The 32-LQFP package fits typical handheld form factors with generous routing for antenna traces. The on-chip ADC handles battery-voltage measurement for low-battery warning indicators.
추천
Motor Control Peripheral Boards
The NXP MC9S08DV32CLC handles small permanent-magnet DC and brushless DC motor control for peripheral boards such as small-pump drivers, valve actuators, and cooling fans where a dedicated motor MCU would be over-spec. The hardware PWM channels drive gate drivers with complementary outputs at 20kHz, while the on-chip ADC samples current shunts for closed-loop current limiting. The 32KB FLASH stores speed/torque profile tables and PI-loop parameters, and the 2KB RAM supports command/state-history buffers. The 40MHz core executes PI updates at 10kHz with deterministic timing essential for smooth torque control. Compared to a Cortex-M0 motor MCU, the S08DV32 trades peripheral richness for BOM-cost reduction of up to 40 percent in price-sensitive peripheral motor products. The 32-LQFP package fits typical 50mm x 70mm peripheral-PCB dimensions with generous thermal copper for sustained-output operation.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S08DV32CLC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S08DV60CLC | MC9S08DV16CLC | MC9S08DV32CLCE | MC9S08AC60CPUE | MC9S08FL8CLC |
|---|---|---|---|---|---|---|
| Package | 32-LQFP (7x7 mm) | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same | 32-LQFP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit (AC family) | HCS08 8-bit (FL family) | |
| FLASH Memory | 32 KB | 60 KB (+87%) | 16 KB (-50%) | 32 KB (same) | 60 KB (+87%) | 8 KB (-75%) |
| RAM Size | 2 KB | 4 KB (+100%) | 1 KB (-50%) | 2 KB (same) | 2 KB (same) | 1 KB (-50%) |
| Maximum Clock | 40 MHz | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) | 40 MHz (same) | 20 MHz (-50%) |
| GPIO Count | 25 | 25 (same) | 25 (same) | 30 (differ) | 23 (differ) | |
| Temperature Grade | INDUSTRIAL (-40C to +85C) | INDUSTRIAL (same) | EXTENDED (-40C to +125C) | INDUSTRIAL (same) | INDUSTRIAL (same) |
주요 차별점
- 32KB FLASH with extensive CodeWarrior ecosystem support (vs MC9S08FL8CLC)
- 40MHz core vs 20MHz in FL family (vs MC9S08FL8CLC)
- Long-standing DV60 series with mature driver library (vs MC9S08AC60CPUE)
설계 노트
Place a 0.1uF X7R ceramic decoupling capacitor as close as possible to each VDD pin (typically pin 7 on this 32-LQFP) and connect VSS (pin 8) directly to the ground plane with a short trace. Add a 4.7uF to 10uF bulk aluminum-polymer or tantalum capacitor on the main supply rail within 25mm of the MCU to handle transient loads from GPIO toggling. Per the NXP MC9S08DV60 reference design, the analog VREFH/VREFL pair (pins 27/28) should also be decoupled with a 100nF ceramic when the ADC is enabled to reject digital switching noise from the rest of the chip.
The 32-LQFP package features 0.8mm pitch gull-wing leads and a 7x7mm body, requiring 0.4mm-wide traces between pads and a 0.2mm solder mask sliver. Place at least two ground vias within the central exposed lead area to stitch the top ground pour to internal planes, ensuring stable reference for the ADC channels and avoiding ground bounce during GPIO switching. The XTAL/EXTAL pair (pins 25/26) should be routed symmetrically with no other signal traces crossing underneath to minimize crosstalk into the crystal oscillator.
The 'L' in MC9S08DV32CLC denotes Tray packaging, while the production-programmed parts use a separate 'LK' suffix; verify the suffix against your kitting requirements before ordering. Do not exceed the 5V absolute-maximum VDD rating, and note that the industrial-temperature variant (-40C to +85C) is not qualified for automotive -40C to +125C underhood applications; choose the 'E' (extended) suffix for underhood zones. Always hold the RESET line low during power-up ramp by tying it to VDD through a 10kohm resistor, and leave the BKGD/MS pin (pin 24) accessible to allow in-system debug.
Route SPI lines (pins 11-14, PTB0-PTB3) as a matched-length group when operating above 10Mbps to avoid setup/hold violations with the S08's SPI peripheral. The I2C pins (17-18, PTC0/PTC1) require external 4.7kohm pull-ups to VDD, since the S08 I/O ports are push-pull open-drain capable but lack the internal pull-ups found in some newer MCUs. UART lines (pins 29-30, PTD0/PTD1) should be guarded with 33ohm series resistors to dampen reflections on cables longer than 100mm.
규정 준수 정보
RoHS and REACH compliance verified from NXP product documentation. The C-grade is industrial-temperature (-40C to +85C) and not AEC-Q100 qualified; for automotive applications the E-suffix extended variant in the same package is recommended instead.