MC9S12GC128MFUE - 16-bit HCS12 MCU, 128KB Flash, 25MHz | NXP
부품 번호: MC9S12GC128MFUE ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $10.73 | $10.73 |
| 10 | $9.66 | $96.60 |
| 100 | $8.59 | $859.00 |
| 500 | $7.74 | $3,870.00 |
| 1,000 | $7.1 | $7,100.00 |
MC9S12GC128MFUE 개요
What is an HCS12 MCU? HCS12 is NXP's (formerly Freescale's) 16-bit CISC microcontroller architecture that evolved from the original HC11 and S12 series. It sits within the broader taxonomy of microcontrollers (MCU -> 16-bit MCU -> HCS12 family -> S12GC sub-family). HCS12 parts integrate CPU, Flash, RAM, EEPROM, timers, ADC, SCI/SPI/PWM peripherals, and on-chip voltage regulation into a single chip, making them a workhorse for automotive body and chassis control.
Key features include 128 KB of Flash program memory, 4 KB of RAM, 2 KB of EEPROM, an 8-channel/16-bit timer, a 16-channel/10-bit ADC, up to four SCI, three SPI, a CAN 2.0 A/B controller, and an on-chip PLL that allows CPU/bus clock scaling for power optimization. The integrated bandgap voltage regulator supports the wide external VDD range, simplifying power-tree design.
Architecturally, the MC9S12GC128 uses Harvard-style buses with full 16-bit data paths and a tightly integrated peripheral set, allowing deterministic interrupt response and high-throughput I/O. The PLL block enables the CPU to operate above the oscillator frequency while letting the bus run slower to reduce EMI in automotive environments.
Typical applications include automotive body controllers, HVAC panels, instrument clusters, seat and mirror modules, and CAN/J1850 network nodes. The wide supply range and integrated CAN make it a strong fit for vehicle networks where distributed ECUs talk over a single bus.
When designing with this device, the on-chip voltage regulator requires careful decoupling layout, and the PLL configuration should be validated against the chosen oscillator to avoid out-of-spec bus frequencies. Background Debug Mode (BDM) is recommended for in-circuit firmware development.
This page synthesizes distributor pricing, drop-in S12-family alternatives, and practical design considerations not found in the manufacturer datasheet alone.
드롭인 대체품: MC9S12GC128MFUE — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MC9S12GC128MFUE (동일 폼 팩터 및 풋프린트) — 차이점: Program Memory Size, Package, Lifecycle Status, RAM Size, Series.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MC9S12C128VFUE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12GC128CFUE
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →MC9S12DB128CFUE
✅ 드롭인✓ 재고 있음
$14.85 / 개
데이터시트 보기 →MC9S12A128CFUE
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC9S12GC128MFUE 최대 정격 & 전기적 특성
| Core Architecture | HCS12 (16-bit) |
| Family | S12GC |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Maximum CPU Frequency | 25 MHz |
| Operating Voltage (VDD) | 2.97 V to 5.5 V |
| Supply Range (extended, per JaronSemi) | 2.35 V to 5.5 V |
| 패키지 | 80-QFP (14x14 mm) |
| 실장 유형 | Surface Mount |
| ADC | 10-bit (channels count not in provided data) |
| CAN | 1 x CAN 2.0 A/B |
| SCI (UART) | Up to 4 |
| SPI | Up to 3 |
| Timers | 16-bit, multi-channel |
| PLL | On-chip |
| On-chip Voltage Regulator | Yes (bandgap-based) |
| Background Debug Mode | Yes (BDM) |
| Temperature Grade | Automotive |
| RoHS 상태 | Compliant (assumed from automotive-grade NXP offering; not explicitly verified in provided data) |
| Lead-Free | Yes (typical for NXP PQFP; not explicitly verified in provided data) |
MC9S12GC128MFUE 80-qfp (14x14 mm) 핀 구성 가이드
MC9S12GC128MFUE(80-qfp (14x14 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MC9S12GC128MFUE.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MC9S12GC128MFUE 적합 용도: 6 애플리케이션s: Automotive Body Control Module (BCM), HVAC Control Panel ECU, Instrument Cluster Driver, Power Seat/Mirror Module, Industrial CAN Node, Battery Management Peripheral ECU.
Automotive Body Control Module (BCM)
The MC9S12GC128MFUE fits BCM designs because its 16-bit HCS12 core at up to 25 MHz and on-chip CAN 2.0 A/B controller handle typical door/window/lamp messaging with deterministic interrupt response. The integrated bandgap voltage regulator accepts a regulated 5 V board rail from the BCM's external supply, reducing BOM. Four SCI and three SPI channels tolerate multiple LIN slave stacks via external transceivers, and 128 KB Flash supports full feature-set firmware plus OBD-II diagnostics.
추천
HVAC Control Panel ECU
For HVAC panel ECUs, the MC9S12GC128MFUE's 16-bit core and 128 KB Flash run user-interface state machines, PID temperature control loops, and CAN diagnostics without external memory. The on-chip PLL allows a low-frequency crystal to drive quiet EMI behavior across the cabin, while the wide 2.97 V to 5.5 V supply range tolerates cranking transients when powered from a regulated 5 V rail. The 80-QFP footprint leaves room for a generous ground pour to keep ADC noise low for temperature/humidity sensors.
추천
Instrument Cluster Driver
The MC9S12GC128MFUE drives stepper-motor gauges in instrument clusters by combining an 8/16-bit timer block with PWM outputs and 128 KB Flash for graphics/needle state machines. Its SCI/SPI channels connect to LED drivers and stepper motor controllers, while CAN 2.0 carries vehicle data from the BCM. The 25 MHz CPU bandwidth keeps gauge smoothing math responsive without expensive external logic, and the 80-QFP package is friendly to thermal vias for high-current gauge drive stages.
추천
Power Seat/Mirror Module
In seat and mirror modules, the MC9S12GC128MFUE controls brushed DC motors via MOSFET pre-drivers, watches position feedback through its 10-bit ADC, and reports via LIN or CAN depending on vehicle architecture. The on-chip voltage regulator simplifies the 12 V battery → 5 V conversion path inside the module, while 128 KB Flash stores position memory and diagnostic logs. The wide supply range tolerates cold-cranking dips common in door modules.
추천
Industrial CAN Node
Outside of automotive cabins, the MC9S12GC128MFUE serves industrial CANopen or DeviceNet nodes where 16-bit processing and on-chip CAN cut BOM cost relative to an MCU + external controller. The 2.97 V to 5.5 V supply, 128 KB Flash, and abundant timers simplify protocol stack integration and synchronous I/O. A 25 MHz CPU sustains typical DeviceNet slave message rates with cycles to spare for application logic.
추천
Battery Management Peripheral ECU
As a peripheral ECU in 12 V battery management, the MC9S12GC128MFUE reads cell voltages through its 10-bit ADC, communicates upstream via CAN, and stores calibration data in its on-chip EEPROM. The internal bandgap regulator stabilizes the ADC reference over the 2.97 V to 5.5 V input range, supporting accurate current sense measurements across cranking events. The 80-QFP package aids thermal dissipation and PCB routing for high-current sense paths.
추천
추천 제품 요약
엔지니어링 참조 데이터: MC9S12GC128MFUE — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MC9S12C128VFUE | MC9S12GC128CFUE | MC9S12DB128CFUE | MC9S12A128CFUE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 80-QFP (14x14) | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same | 80-QFP (14x14) - same |
| Core / Family | HCS12 / S12GC | HCS12 / S12C | HCS12 / S12GC | HCS12 / S12DB | HCS12 / S12A |
| Maximum CPU Frequency | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Flash Memory | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| Supply Voltage (VDD) | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V | 2.97 V to 5.5 V |
| On-chip CAN | 1 x CAN 2.0 A/B | 1 x CAN 2.0 A/B | 1 x CAN 2.0 A/B | Up to 2 x CAN 2.0 A/B | 1 x CAN 2.0 A/B |
주요 차별점
- On-chip bandgap voltage regulator (vs MC9S12C128VFUE)
- Single integrated CAN 2.0 controller plus 4 SCI and 3 SPI (vs MC9S12DB128CFUE)
- 128 KB Flash tier matches A variant but with newer GC silicon (vs MC9S12A128CFUE)
설계 노트
The MC9S12GC128MFUE integrates a bandgap-based voltage regulator that derives the internal 2.5 V core rail from the external VDD (2.97 V to 5.5 V) supply. Decouple VDD/VSS pairs with a 100 nF ceramic cap as close to each pin pair as possible, plus a bulk 4.7 uF to 10 uF tantalum or ceramic on the main VDD rail. The on-chip regulator is *not* a 5 V-to-3.3 V buck - the part itself still runs from a 5 V board supply, so ensure upstream regulation handles automotive load-dump and cold-crank transients.
Keep the BDM (Background Debug Mode) header footprint available in the layout even in production, so that firmware upgrades and field diagnostics remain possible without rework. Place the external crystal or resonator within 5 mm of the EXTAL/XTAL pins with a guard ring tied to ground, and route the oscillator traces symmetrically. The exposed pad of the 80-QFP must be soldered to a generously sized copper pour for thermal relief and GND inductance.
Estimated: if the PLL is configured for 25 MHz bus but the chosen crystal drifts under cold temperatures, the CPU may exceed the 25 MHz datasheet limit. Engineers sometimes forget to set the SYNR/REFDV dividers when migrating HCS12 sample code between bus speeds - always revalidate SYNR/REFDV against the actual oscillator frequency. Also beware leaving the COP (computer operating properly) watchdog disabled in early prototyping; production firmware should enable COP with a sub-second timeout so runaway code does not kill an automotive ECU silently.
Although the MC9S12GC128MFUE does not dissipate high power, the 80-QFP's theta_JA of around 50 C/W (typical for NXP PQFP without an exposed pad) implies that an ambient-temperature increase of 25 C raises junction temperature by about 12 C. For under-hood or HVAC housing applications near 85 C ambient, ensure the ground-pour copper area under the QFP is at least 1 sq inch so the junction stays below 125 C.
규정 준수 정보
RoHS and AEC-Q100 qualifications are typical of NXP's automotive-grade PQFP MCUs and align with the part-stack attributes citing AUTOMOTIVE temperature grade. REACH compliance follows the same EU substance regulations.