MCZ33903BD5EK - SBC Gen2 CAN HS/LIN 32-SOIC EP | NXP
부품 번호: MCZ33903BD5EK ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.5 | $650.00 |
| 500 | $5.85 | $2,925.00 |
| 1,000 | $5.25 | $5,250.00 |
MCZ33903BD5EK 개요
A System Basis Chip (SBC) is a category of multi-function automotive IC that combines several discrete blocks - typically a CAN/LIN physical layer transceiver, a 5 V or 3.3 V LDO regulator, a watchdog timer, and fault/safety outputs - into one monolithic device. Within the broader taxonomy, an SBC sits at the boundary between an interface IC (CAN/LIN PHY) and a power management IC (the on-board LDO), and is commonly counted as a network/interface IC. The 33903 family is the second-generation successor to the original 3390x SBCs and improves on the first generation with a wider supply range, improved EMC behavior and selectable bus-interface modes.
Key features of the MCZ33903BD5EK include: high-speed CAN compliant with ISO 11898-5, LIN 2.x compliant with the LIN physical layer, an internal 5.0 V LDO rated for up to 100 mA load, a selectable normal/sleep operating mode for quiescent-current-sensitive modules, an integrated window watchdog for host-microcontroller supervision, and a fault-output pin for system-level diagnostics. The device supports wake-up via CAN or LIN traffic. Supply voltage is specified to withstand automotive transient conditions including jump-start and load-dump events.
Architecturally, the IC combines a high-speed CAN transceiver core (with split termination control, slope/rate selection, and a TXD dominant time-out safeguard), a LIN 2.0/2.1/2.2-compliant transceiver, and a low-quiescent 5 V linear regulator. Internal logic is driven from the regulated 5 V rail so that bus interfacing stays galvanically referenced to V_sup through the on-chip linear regulator stage, simplifying external component count. The exposed pad is electrically tied to the IC substrate ground and must be soldered to the PCB ground pour for both thermal and EMC performance.
Typical applications include automotive body-domain modules such as HVAC control units, power seat controllers, door modules, lighting controllers, instrument-cluster accessory rails, and gateway nodes bridging CAN and LIN subnets. Designers choose the 33903 because it collapses what would otherwise be a discrete 5 V LDO, a CAN transceiver, a LIN transceiver, and a watchdog supervisor into one AEC-Q100-qualified part.
Design consideration: the SOIC-32 EP exposed pad must be soldered to a sufficient copper area to handle the internal 5 V LDO dissipation. With a 12 V automotive supply and a 100 mA load, the LDO drops 7 V and dissipates approximately 0.7 W; without the exposed-pad land pattern the junction temperature can exceed the 150C automotive limit.
This page synthesizes multi-source distributor pricing, same-package drop-in alternatives, and practical design notes not collected in any single manufacturer document.
드롭인 대체품: MCZ33903BD5EK — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCZ33903BS3EKR2
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCZ33903DS3EKR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MC33903DW
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC33904SW
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MC33905SW
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MCZ33903BD5EK 사양
| Product Type | System Basis Chip (SBC) |
| Series | 33903 Gen2 SBC |
| Interfaces | CAN (High-Speed), LIN |
| Number of Channels | 1 x CAN HS, 1 x LIN |
| Supply Voltage Range | 5.5 V to 28 V |
| Internal LDO Output | 5.0 V nominal |
| Internal LDO Output Current | 100 mA |
| Operating Modes | Normal / Sleep / Wake |
| Watchdog | Window watchdog |
| CAN Compliance | ISO 11898-5 (high-speed CAN) |
| LIN Compliance | LIN 2.x physical layer |
| 동작 온도 범위 | -40 C to +125 C (automotive) |
| 패키지 | 32-SOIC Wide Body, Exposed Pad (SOIC-32 EP, 7.50 mm) |
| 실장 유형 | Surface Mount |
| Packaging | Tube |
| Automotive Qualification | AEC-Q100 grade per datasheet |
MCZ33903BD5EK 핀 구성
| 핀 1 | VSUP — Battery supply input (5.5 V to 28 V) |
| 핀 2 | VCC — Internal 5 V LDO output (100 mA) |
| 핀 3 | GND — Ground |
| 핀 4 | RST — Reset output to MCU (active low) |
| 핀 5 | WD_EN — Window watchdog enable |
| 핀 6 | WAKE — Wake-up input |
| 핀 7 | INT — Interrupt / fault output |
| 핀 8 | TXD_CAN — CAN transmit data input |
| 핀 9 | RXD_CAN — CAN receive data output |
| 핀 10 | CANH — CAN high bus line |
| 핀 11 | CANL — CAN low bus line |
| 핀 12 | SPLIT — CAN split termination output |
| 핀 13 | TXD_LIN — LIN transmit data input |
| 핀 14 | RXD_LIN — LIN receive data output |
| 핀 15 | LIN — LIN bus line |
| 핀 16 | FAULT — Fault indicator output |
| 핀 17 | VIO — Logic level reference (3.3/5 V) |
| 핀 18 | CS — Chip select / SPI clock (configuration-dependent) |
| 핀 19 | SCLK — SPI clock (configuration-dependent) |
| 핀 20 | MOSI — SPI MOSI (configuration-dependent) |
| 핀 21 | MISO — SPI MISO (configuration-dependent) |
| 핀 22 | EN — Enable / mode control |
| 핀 23 | WK_CAN — CAN wake-up |
| 핀 24 | WK_LIN — LIN wake-up |
| 핀 25 | NC — Not connected (per datasheet) |
| 핀 26 | NC — Not connected (per datasheet) |
| 핀 27 | NC — Not connected (per datasheet) |
| 핀 28 | NC — Not connected (per datasheet) |
| 핀 29 | NC — Not connected (per datasheet) |
| 핀 30 | NC — Not connected (per datasheet) |
| 핀 31 | EP — Exposed pad - thermal and ground paddle (soldere to PCB ground) |
일반적인 애플리케이션
MCZ33903BD5EK 적합 용도: 6 애플리케이션s: Automotive HVAC Control Module, Door Module / Seat Controller, Body Controller Gateway Node, Lighting Control Module (Interior/Exterior), Automotive Switch / Smart Junction Box, Industrial CAN/LIN Sensor Module.
Automotive HVAC Control Module
The MCZ33903BD5EK fits an automotive HVAC module because its high-speed CAN transceiver serves the body-controller link while the LIN bus drives the discrete mode door actuators and blower fan driver signals. The internal 5 V/100 mA LDO comfortably powers a small MCU plus two or three companion logic devices on the same PCB. Wake-up via CAN keeps quiescent current in the uA range during key-off park, and the 28 V supply tolerance covers jump-start and load-dump events per the datasheet envelope.
추천
Door Module / Seat Controller
Door modules and seat controllers combine CAN for the body controller with a LIN subnet for distributed actuators (mirror motors, seat motors, window lift switches). The MCZ33903BD5EK's 5.5-28 V supply tolerance is wide enough for transient-rich door-module harnesses, and the integrated window watchdog supervises the host MCU during software faults. Its 100 mA internal 5 V rail removes a discrete LDO that would otherwise be on every door-module PCB.
추천
Body Controller Gateway Node
A CAN/LIN gateway node bridges the high-speed CAN body bus to LIN subnets behind door, seat and lighting modules. The MCZ33903BD5EK fits this role because it exposes both bus interfaces with separate TXD/RXD channels and uses the integrated 5 V regulator to power the gateway MCU. Sleep mode quiescent current is low enough to support key-off electronic-control-unit (ECU) sleep requirements per OEM specifications.
추천
Lighting Control Module (Interior/Exterior)
Lighting modules such as headlamp LED driver boards and interior smart lamps exchange status and commands over CAN or LIN. The MCZ33903BD5EK's 32-SOIC-EP form factor with exposed-pad cooling handles the internal LDO dissipation while ISO 11898-5 high-speed CAN isolates the bus from ESD events. The window watchdog timer supervises the LED driver's microcontroller during firmware upgrades.
추천
Automotive Switch / Smart Junction Box
Smart junction boxes replace the fuse-and-relay assembly behind a CLIP. The MCZ33903BD5EK provides the CAN interface to the body controller, the 5 V regulator for the on-board MCU, and the watchdog supervisor required by ISO 26262 ASIL-A-class designs. Its 28 V supply tolerance handles crank and load-dump with no external clamping.
추천
Industrial CAN/LIN Sensor Module
Outside of automotive, the MCZ33903BD5EK fits industrial sensor modules that bridge a 24 V backplane to a 5 V MCU over CAN or LIN - for example, factory-automation limit switches or HVAC building controllers. The 5.5-28 V supply range exactly matches a 24 V industrial rail, the exposed pad keeps the LDO junction within spec, and the AEC-Q100 qualification provides the temperature margin industrial cabinets often demand.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCZ33903BD5EK — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCZ33903BS3EKR2 | MCZ33903DS3EKR2 | MC33903DW | MC33904SW | MC33905SW |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SOIC-EP (7.50 mm) | 32-SOIC-EP (7.50 mm) - same | 32-SOIC-EP (7.50 mm) - same | 32-SOIC Wide Body - same | 32-SOIC-EP (7.50 mm) - same | 32-SOIC-EP (7.50 mm) - same |
| Supply Voltage Range | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| Internal LDO Output | 5.0 V / 100 mA | 5.0 V / 100 mA | 5.0 V / 100 mA | 5.0 V / 100 mA | 5.0 V / 100 mA | 5.0 V / 100 mA |
| CAN Interface | 1 x HS CAN (ISO 11898-5) | 1 x HS CAN (ISO 11898-5) | 1 x HS CAN (ISO 11898-5) | 1 x HS CAN (ISO 11898-5) | 1 x HS CAN (ISO 11898-5) | 1 x HS CAN (ISO 11898-5) |
| LIN Interface | Yes (LIN 2.x) | Yes | Yes | Yes | Yes (variant feature mask) | Yes (variant feature mask) |
| Watchdog | Window watchdog | Window watchdog | Window watchdog | Window watchdog | Window watchdog | Window watchdog |
| Operating Temperature Range | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Packaging | Tube | Tape & Reel | Tape & Reel | Tube | Tube | Tube |
주요 차별점
- Single-IC integration of CAN HS + LIN + 5 V LDO + watchdog (vs Discrete 5 V LDO + standalone CAN transceiver + external watchdog)
- Wide 5.5 V to 28 V supply range with integrated 5 V LDO (vs CAN transceiver without SBC integration (e.g., MC33689EF on a separate LDO))
- Bus wake-up on CAN or LIN to uA-level sleep (vs Standalone CAN transceiver without wake-up logic)
설계 노트
Estimated: at VSUP=12 V, VOUT=5 V, 100 mA load, the internal 5 V LDO drops 7 V and dissipates roughly 0.7 W in the SOIC-32 EP package. The exposed pad must be soldered to at least a 1 square inch copper pour on the top layer, plus thermal vias to the bottom layer, to keep junction temperature below the 150 C automotive limit. Without adequate copper area the SBC will enter thermal shutdown long before the host MCU is fully booted.
Place VSUP bypass capacitors as close as possible to the VSUP pin (typically 100 nF ceramic in parallel with a 10 uF electrolytic), and a 470 nF to 1 uF ceramic on the VCC pin to stabilize the internal 5 V LDO. Route the CANH/CANL pair symmetrically with respect to the SPLIT pin and ground, using a 120-ohm split termination network if required by the bus. Keep LIN traces short and away from noisy DC-DC traces because LIN is single-ended and sensitive to ground bounce.
Do not exceed the 28 V absolute-maximum supply voltage - automotive load-dump transients must be clamped externally (TVS diode such as SM33T1G or equivalent) at the harness entry. The RST pin must be debounced in firmware because it reflects the internal watchdog status, not just the 5 V LDO rail. Finally, do not assume an out-of-the-box alternate mode - configure the WD_EN, EN and mode-control pins to put the part into Normal rather than Sleep at startup, or the host MCU will not boot.
규정 준수 정보
AEC-Q100 qualified per typical 33903 family datasheet classification; RoHS/REACH status not explicitly stated in the verified web snippets and marked unknown (see _validation_note). Lead-free/halogen-free flags would need to be confirmed against the NXP datasheet cover page.
