MCZ33903CD5EK - SBC with HS-CAN & LIN, 5V LDO | NXP
부품 번호: MCZ33903CD5EK ⚠ 최종 구매| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.72 | $4.72 |
| 10 | $4.24 | $42.40 |
| 100 | $3.78 | $378.00 |
| 500 | $3.42 | $1,710.00 |
| 1,000 | $3.05 | $3,050.00 |
MCZ33903CD5EK 개요
A System Basis Chip (SBC) is a category of automotive-qualified mixed-signal IC that consolidates a 5V (or 3.3V) microcontroller power supply with one or more in-vehicle bus transceivers (CAN, LIN, FlexRay) and sometimes watchdog or low-side switches. SBCs sit hierarchically between discrete CAN transceivers (e.g., MC33388) and full automotive microcontroller power-management units, simplifying BCM (Body Control Module), gateway, and HVAC blower designs by replacing 3-5 ICs with one chip. The MC33903 family is the second-generation evolution of the MC33389 SBC family.
Key features include HS-CAN supporting 1 Mb/s with local and bus failure diagnostics, a LIN 2.0 physical interface, a 5V low-dropout regulator delivering up to 200 mA for the host MCU, four configurable low-side drivers rated to 1.5A, integrated SPI-configurable safety watchdog, and reset generation with power-on/power-off warning. Operating voltage range covers 5.5V to 27V (load-dump tolerant to 40V), with low sleep-mode current under 100 uA. The 32-SSOP-EP exposed pad enables PCB heat dissipation at 1.5A driver loading.
The device uses a Freescale-developed automotive process with extensive ESD protection (8 kV HBM on CAN bus pins) and ISO 11898-5 low-power mode support. Internal diagnostics report bus dominant time-out, overtemperature, and under-voltage events via SPI to the MCU.
Common applications are automotive body control modules, HVAC blower controls, instrument clusters, and CAN/LIN gateway nodes. Designers choose the MC33903 to consolidate multiple bus interfaces behind a single SPI port while maintaining AEC-Q100-grade reliability.
Watchdog validation. When routing the PCB, place the exposed pad over a continuous copper pour connected to PGND, and keep the CANH/CANL traces as a 100-ohm differential pair matched within 5 mm.
This page synthesizes distributor inventory, AEC-Q100 alternatives, and PCB layout guidance not found in the manufacturer datasheet alone.
드롭인 대체품: MCZ33903CD5EK — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MCZ33903CD5EK (동일 폼 팩터 및 풋프린트) — 차이점: CAN Interface, LIN Interface.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MCZ33903DS3EKR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCZ33904CD5EK
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCZ33905CD5EK
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCZ33903CD5EKR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MCZ33903CD5EK 최대 정격 & 전기적 특성
| 기능 | System Basis Chip (SBC) with HS-CAN and LIN |
| CAN Interface | ISO 11898-2 / ISO 11898-5 High-Speed CAN |
| LIN Interface | LIN 2.0 / LIN 2.1 / SAE J2602 |
| On-chip LDO Output | 5 V |
| LDO Output Current | 200 mA |
| Operating Voltage (VBAT) | 5.5 V to 27 V (load dump tolerant to 40 V) |
| Low-Side Drivers | 4 x configurable, 1.5 A each |
| Maximum CAN Data Rate | 1 Mbps |
| Sleep Mode Current | <100 uA (typical) |
| Configuration Interface | SPI |
| Watchdog | Configurable window watchdog via SPI |
| ESD Protection (CAN bus pins) | 8 kV HBM (per datasheet) |
| 동작 온도 | -40 C to +125 C |
| 패키지 | 32-SSOP-EP (7.50 mm width, exposed pad) |
| 실장 유형 | Surface Mount |
| AEC-Q100 | Qualified (automotive) |
| RoHS 상태 | Compliant per NXP product page |
MCZ33903CD5EK 핀 구성
| 핀 1 | VBAT — Battery supply input (5.5V to 27V, 40V load dump tolerant) |
| 핀 2 | VCC — 5V LDO output / MCU supply |
| 핀 3 | PGND — Power ground (exposed pad) |
| 핀 4 | LSD1 — Low-side driver 1 (1.5A sink) |
| 핀 5 | LSD2 — Low-side driver 2 (1.5A sink) |
| 핀 6 | LSD3 — Low-side driver 3 (1.5A sink) |
| 핀 7 | LSD4 — Low-side driver 4 (1.5A sink) |
| 핀 8 | WAKE — Wake-up input (edge triggered) |
| 핀 9 | RST — Reset output (active low, to MCU) |
| 핀 10 | INT — Interrupt output (active low, to MCU) |
| 핀 11 | SCLK — SPI clock from MCU |
| 핀 12 | MOSI — SPI data from MCU to SBC |
| 핀 13 | MISO — SPI data from SBC to MCU |
| 핀 14 | CS — SPI chip select (active low) |
| 핀 15 | TXDCAN — CAN transmit data from MCU |
| 핀 16 | RXDCAN — CAN receive data to MCU |
| 핀 17 | CANH — CAN bus high (8 kV HBM ESD) |
| 핀 18 | CANL — CAN bus low (8 kV HBM ESD) |
| 핀 19 | SPLIT — CAN bus common-mode stabilization |
| 핀 20 | TXDLIN — LIN transmit data from MCU |
| 핀 21 | RXDLIN — LIN receive data to MCU |
| 핀 22 | LIN — LIN bus pin |
| 핀 23 | VBUS — LIN bus supply (internal pullup) |
| 핀 24 | NC — Not connected (per datasheet) |
| 핀 25 | NC — Not connected (per datasheet) |
| 핀 26 | VSUP_CAN — CAN transceiver supply (5V derived) |
| 핀 27 | VSUP_LIN — LIN transceiver supply (5V derived) |
| 핀 28 | NC — Not connected (per datasheet) |
| 핀 29 | NC — Not connected (per datasheet) |
| 핀 30 | NC — Not connected (per datasheet) |
| 핀 31 | NC — Not connected (per datasheet) |
| 핀 32 | NC — Not connected (per datasheet) |
일반적인 애플리케이션
MCZ33903CD5EK 적합 용도: 7 애플리케이션s: Automotive Body Control Module, HVAC Blower Controller, CAN/LIN Gateway Node, Instrument Cluster ECU, Power Window / Door Node, Steering Wheel Switch Module, Rear Lighting Module.
Automotive Body Control Module
The MCZ33903CD5EK is a natural fit for 12V body-control ECUs driving lighting, mirrors, and wiper loads behind a CAN/LIN gateway. Its integrated HS-CAN (ISO 11898-2/-5) handles up to 1 Mbps backbone traffic, the LIN 2.0 interface connects to switch packs and door modules, and the four 1.5A low-side drivers sink mirror, latch, and indicator currents directly - eliminating four discrete MOSFETs. The 5V/200mA LDO powers the host MCU without a separate regulator. SPI-configured window watchdog and reset generation provide ASIL-BES-class MCU supervision without an external supervisor. Operating temperature of -40C to +125C and load-dump tolerance to 40V on VBAT meet automotive electrical requirements.
추천
HVAC Blower Controller
HVAC blower modules require a CAN or LIN slave interface to a body controller, plus low-side drive for blower MOSFETs. The MCZ33903CD5EK's HS-CAN or LIN transceiver interfaces directly to the vehicle bus, while the four on-chip 1.5A low-side drivers can switch blower relay coils, feedback resistors, and indicator lamps - replacing 2-3 discrete transistors. The integrated 5V LDO powers the local MCU, and the exposed-pad SSOP-EP package dissipates heat from continuous driver switching. SPI diagnostics report overtemperature, bus-dominant timeout, and under-voltage events for warranty tracking. AEC-Q100 qualification satisfies HVAC ECU qualification requirements.
추천
CAN/LIN Gateway Node
Central gateway ECUs that bridge CAN and LIN networks benefit from the MCZ33903CD5EK's combined HS-CAN and LIN 2.0 transceivers. Routing both protocols through one IC reduces PCB area and BOM count versus a discrete CAN + LIN pair. The host MCU at the gateway runs the higher-layer CAN FD and LIN 2.x transport protocols, while the MC33903 handles physical layer signaling and fault diagnostics. The 200mA 5V LDO powers the gateway MCU, freeing board space for memory and Ethernet PHYs. AEC-Q100 grading and load-dump tolerance to 40V on VBAT make the device suitable for under-hood gateway placement.
추천
Instrument Cluster ECU
Instrument clusters combine a small graphic MCU with multiple low-side drivers for gauge pointers, telltale LEDs, and backlighting, all behind a CAN or LIN bus interface. The MCZ33903CD5EK's four 1.5A low-side drivers can sink telltale, gauge, and backlight circuits directly; its HS-CAN or LIN interface connects to the body network; and the 5V LDO powers the gauge MCU. The exposed-pad SSOP-EP provides adequate thermal dissipation for simultaneous driver operation. SPI-driven diagnostics monitor undervoltage events, enabling warranty traceable cluster fault data.
추천
Power Window / Door Node
Door module ECUs sit at the end of a CAN/LIN bus and drive window lift, mirror adjust, and lock motors. The MCZ33903CD5EK acts as the local LIN or CAN slave interface to the body controller, while its four low-side drivers sink relay coils, mirror-adjust, and lock-actuator control signals - replacing a discrete MOSFET driver array. The 5V LDO powers the local 8-bit or 16-bit SLA MCU. AEC-Q100 qualification, 8 kV HBM on CAN/LIN pins, and load-dump tolerance to 40V on VBAT meet door-module automotive electrical requirements. Low sleep-mode current under 100 uA preserves battery life during parking.
추천
Steering Wheel Switch Module
Steering wheel switch ECUs read driver switch inputs and forward them to the body controller over LIN. The MCZ33903CD5EK's LIN 2.0 interface meets LIN 2.1 / SAE J2602 requirements for steering-wheel connectivity, while its four low-side drivers drive the switch backlight LEDs and indicator lamps. The 5V LDO powers the local MCU. Low sleep current under 100 uA prevents battery drain when the vehicle is parked. AEC-Q100 grading and 8 kV HBM on LIN bus pin meet steering-module ESD robustness requirements.
추천
Rear Lighting Module
Rear lighting modules combine brake, tail, turn, and reverse lamps driven by low-side switches, controlled by a body-network slave. The MCZ33903CD5EK's four 1.5A low-side drivers can sink each lamp circuit - replacing four discrete MOSFETs. HS-CAN or LIN interface ties the module to the body controller, and the 5V LDO powers the local MCU. The exposed-pad SSOP-EP dissipates heat from continuous lamp current. AEC-Q100, load-dump tolerance to 40V on VBAT, and 8 kV HBM on bus pins meet rear lighting automotive requirements. SPI diagnostics monitor lamp failures for warranty tracking.
추천
추천 제품 요약
엔지니어링 참조 데이터: MCZ33903CD5EK — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MCZ33903DS3EKR2 | MCZ33904CD5EK | MCZ33905CD5EK |
|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) | NXP Semiconductors (Freescale) |
| Package | 32-SSOP-EP | 32-SSOP-EP (same) | 32-SSOP-EP (same) | 32-SSOP-EP (same) |
| HS-CAN Interface | ISO 11898-2/-5, 1 Mbps | ISO 11898-2/-5, 1 Mbps | ISO 11898-2/-5, 1 Mbps | ISO 11898-2/-5, 1 Mbps |
| LIN Interface | LIN 2.0 / 2.1 / SAE J2602 | LIN 2.0 / 2.1 / SAE J2602 | None (CAN only) | LIN 2.0 / 2.1 / SAE J2602 |
| On-chip LDO Output | 5 V | 3.3 V | 5 V | 5 V |
| LDO Output Current | 200 mA | 200 mA | 200 mA | 200 mA |
| Low-Side Drivers | 4 x 1.5 A | 4 x 1.5 A | 4 x 1.5 A | 2 x 3.0 A high-side + 4 x 1.5 A low-side |
| Operating Voltage (VBAT) | 5.5 V to 27 V (40 V load dump) | 5.5 V to 27 V (40 V load dump) | 5.5 V to 27 V (40 V load dump) | 5.5 V to 27 V (40 V load dump) |
| Lifecycle Status | Last Time Buy | Last Time Buy (NRND family) | Last Time Buy (NRND family) | Last Time Buy (NRND family) |
주요 차별점
- Single-chip integration of HS-CAN + LIN + 5V LDO + 4 low-side drivers (vs MCZ33290EFR2 (LIN-only SO-8))
- AEC-Q100 qualified for 12V direct-battery operation (vs Generic non-automotive CAN/LIN combo ICs)
- SPI-configurable window watchdog integrated (vs Discrete external supervisor ICs)
설계 노트
The 32-SSOP-EP exposed pad must be soldered to a continuous copper pour on the top or bottom PCB layer, connected to PGND with at least 6 thermal vias for heat extraction. With four low-side drivers each at 1.5A continuous, total dissipation can approach 2W and exceed the package rating without the pour. Estimate: junction-to-ambient thermal resistance of 28 C/W with a 1 square-inch copper pour - derate above 70 C ambient or reduce driver duty cycle.
Route CANH and CANL as a 100-ohm differential microstrip pair matched within 5 mm total length, keep the traces symmetric, and place the 120-ohm termination resistor at the bus connector end - not at the IC end. Add a 100 nF X7R bypass capacitor close to each VDD/VCC pin, and a bulk 4.7 uF to 10 uF ceramic on VCC within 5 mm. Keep the LIN bus trace short and place a 30 kohm pullup on the LIN pin if external bus power is not used.
Do not apply VBAT above 40 V (load-dump rating) - sustained overvoltage will damage the IC. Do not power the IC with VCC > 5.5V or polarity reversed. When entering Sleep mode, ensure the SPI CS line is deasserted high to avoid false wake-ups. Do not use the LSD outputs to drive inductive loads (relay coils) without external freewheeling diodes - the 1.5A sinks are open-drain and will be damaged by inductive kickback above 50V.
The CAN bus differential signal integrity depends on the 100-ohm characteristic impedance of the differential pair. Stubs from the IC to the bus must be < 30 mm to avoid reflections at 1 Mbps. Common-mode choke (e.g., 51 uH at 100 MHz) on CANH/CANL improves radiated emissions compliance with IEC 61967-4. Place the choke within 10 mm of the bus connector.
규정 준수 정보
AEC-Q100 qualified automotive grade per NXP product page. RoHS and REACH compliant. Last Time Buy announced on NXP part page (nxp.com/part/MCZ33903CD5EK).
