MK21DN512VMC5 - 50MHz Cortex-M4 MCU 512KB Flash | NXP
부품 번호: MK21DN512VMC5 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
MK21DN512VMC5 개요
A microcontroller (MCU) is a single-chip embedded processor combining a CPU core, program memory, data memory, and peripherals such as timers, communication interfaces, and analog converters. The Kinetis K21 family sits within NXP's broader Kinetis MCU portfolio, which spans entry-level to high-performance ARM-based embedded controllers used across industrial, consumer, and security-oriented designs.
Key features of the MK21DN512VMC5 include the 50 MHz Cortex-M4 core with DSP instructions and single-cycle MAC, 512 KB (512K x 8) flash program memory, 64 KB SRAM, and a Full-Speed USB device controller. According to NXP product documentation, the K21 sub-family adds hardware encryption and tamper-detection capability, making it one of the few mainstream MCUs suited to security-sensitive designs. The 121-MAPBGA (8x8) package minimizes board space and enhances signal routing density.
Architecturally, the K21 combines the Cortex-M4 pipeline with a rich suite of analog, communication, timing, and control peripherals, allowing a single device to handle signal acquisition, connectivity, and control duties without external glue logic. The embedded flash and SRAM are on the same die, keeping memory access deterministic.
Typical applications include secure embedded systems requiring tamper detection, USB-connected industrial instruments, and compact control nodes where the 8x8 mm BGA footprint maximizes board density.
Design consideration: the 0.8 mm ball pitch MAPBGA package requires controlled-impedance PCB layout with careful via fan-out; verify power and ground ball assignments in the manufacturer datasheet before routing.
This page synthesizes distributor availability, drop-in family alternatives, and practical design notes not found in a single manufacturer datasheet.
드롭인 대체품: MK21DN512VMC5 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MK21DN512VMC5 (동일 폼 팩터 및 풋프린트) — 차이점: USB, Package, Flash Memory, Core Architecture, Operating Temperature Range.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MK21DX256AVMC5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MK21DX512VMC5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MK22DN512VMC5
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MK12DN512VMC5
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MK21DN512VMC5 최대 정격 & 전기적 특성
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-Bit |
| 최대 클록 주파수 | 50 MHz |
| Flash Memory Size | 512 KB (512K x 8) |
| SRAM Size | 64 KB |
| USB | Full-Speed USB |
| Security Features | Hardware encryption, anti-tamper (DryIce) |
| 패키지 | 121-MAPBGA (8x8 mm) |
| Number of Terminals | 121 |
| Terminal Form | Ball (BGA) |
| Package Shape | Square |
| Temperature Grade | Industrial |
| Peripherals | Analog, communication, timing and control peripherals |
| 실장 유형 | Surface Mount |
| Family Series | Kinetis K21 (formerly Freescale Kinetis K) |
MK21DN512VMC5 square 핀 구성 가이드
MK21DN512VMC5(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MK21DN512VMC5.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MK21DN512VMC5 적합 용도: 6 애플리케이션s: Secure Embedded Systems with Anti-Tamper, USB-Connected Industrial Instruments, Compact Control Nodes in 8x8mm BGA Designs, Embedded Signal Processing and Motor Control, Building Automation and Sensor Hubs, Portable and USB-Powered Devices.
Secure Embedded Systems with Anti-Tamper
The MK21DN512VMC5 fits security-critical embedded systems because it combines hardware encryption with NXP DryIce tamper detection on a single 50 MHz Cortex-M4 die. DryIce monitors physical tamper events and can trigger protective responses such as key erasure, protecting secrets stored in the 512 KB flash and 64 KB SRAM. Typical roles include secure key storage nodes, authentication dongles, and anti-counterfeiting modules. In such designs the MCU typically runs the cryptographic stack locally over USB or serial links while the tamper engine operates independently of software, providing hardware-level protection. The Full-Speed USB controller allows direct connection to host systems for credential provisioning without an external USB bridge chip, reducing the attack surface and BOM count.
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USB-Connected Industrial Instruments
Industrial instruments benefit from the MK21DN512VMC5's integrated Full-Speed USB device controller and rich peripheral suite. The 12 Mbps USB link handles HID, CDC virtual COM, and mass-storage device classes without an external bridge IC, while the Cortex-M4 core's DSP instructions execute digital filtering and control loops at 50 MHz. The industrial temperature grade supports factory-floor environments. Data acquisition front ends can stream readings over USB using the communication peripherals, and the 121-MAPBGA 8x8 mm footprint keeps the controller section compact on dense instrument boards. Because flash and SRAM are on-die, timing stays deterministic during USB transfers. Designers should budget PCB layers for BGA fan-out and confirm supply rails against the K21 datasheet.
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Compact Control Nodes in 8x8mm BGA Designs
For densely packed control boards, the MK21DN512VMC5's 121-MAPBGA 8x8 mm package minimizes board space while providing a full 32-bit controller. The 0.8 mm ball pitch permits routing on moderate layer counts, and NXP highlights the package's role in maximizing board space and enhancing routing flexibility. Control nodes in automation, test fixtures, and embedded gateways use the timing and control peripherals for PWM, event capture, and sequencing, while the 512 KB flash accommodates protocol stacks and bootloader plus application images. The trade-off versus QFP-packaged K21 variants is assembly complexity: BGA reflow and X-ray inspection are required, so choose the VMC5 footprint only when production supports BGA assembly and density justifies it.
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Embedded Signal Processing and Motor Control
The ARM Cortex-M4 core in the MK21DN512VMC5 includes DSP extensions such as single-cycle multiply-accumulate and hardware division, making the 50 MHz MCU suitable for digital filtering, FFT-based analysis, and FOC motor-control mathematics. The K21 family's timing peripherals generate complementary PWM and capture feedback signals, while analog peripherals handle current and voltage sensing. The 64 KB SRAM provides working space for filter histories and control state across multiple concurrent loops. Because the DSP workload runs on-die with deterministic flash execution, control-loop jitter stays low without an external processor. For designs needing higher clock rates, the same-footprint K22 variant (72 MHz) offers an upgrade path within the VMC5 package.
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Building Automation and Sensor Hubs
Building automation controllers aggregate sensor inputs and report over networked links, a workload matched by the MK21DN512VMC5's communication and analog peripheral suite. Multiple serial interfaces connect RS-485 transceivers, meters, and environmental sensors, while the 512 KB flash holds protocol stacks and logging firmware. The industrial temperature grade suits unconditioned spaces such as mechanical rooms. The Full-Speed USB port provides local service and commissioning connectivity from a laptop without opening the enclosure's network path. Its DryIce security features additionally help protect access-control credentials. The 8x8 mm BGA allows the hub controller to fit on small wall-mounted or DIN-rail PCBAs where a QFP would not fit.
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Portable and USB-Powered Devices
Battery- and USB-powered portable devices use the MK21DN512VMC5 as a single-chip controller, since its Full-Speed USB peripheral handles both data and charging-port communication enumeration and the K21 family is positioned for USB-centric designs. The 512 KB flash stores firmware with room for field upgrades via USB bootloader, and the 64 KB SRAM supports buffering for user interfaces and sensor logs. Integration of encryption supports licensed-content or credential-carrying portables. Because all memory and USB functions are on-die, the controller section needs few external parts, conserving battery budget and board area. Engineers should verify the device's low-power mode currents in the NXP K21 datasheet, as these figures were not present in the retrieved summary data.
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추천 제품 요약
엔지니어링 참조 데이터: MK21DN512VMC5 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MK21DX256AVMC5 | MK21DX512VMC5 | MK22DN512VMC5 | MK12DN512VMC5 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 121-MAPBGA (8x8 mm) | 121-MAPBGA (8x8 mm) - same footprint | 121-MAPBGA (8x8 mm) - same footprint | 121-MAPBGA (8x8 mm) - same footprint | 121-MAPBGA (8x8 mm) - same footprint |
| Flash Memory | 512 KB | 256 KB + FlexMemory | 512 KB + FlexMemory | 512 KB | 512 KB |
| USB | Full-Speed USB | Full-Speed USB | Full-Speed USB | Full-Speed USB | No USB |
| Security / Anti-Tamper | DryIce anti-tamper + hardware encryption | DryIce anti-tamper + hardware encryption | DryIce anti-tamper + hardware encryption | Hardware encryption (no DryIce emphasis) | None |
주요 차별점
- DryIce anti-tamper security silicon (vs MK12DN512VMC5)
- 512 KB flash without FlexMemory complexity (vs MK21DX512VMC5)
- Lower power / cost versus faster K22 (vs MK22DN512VMC5)
설계 노트
The 121-MAPBGA (8x8 mm) package uses a 0.8 mm ball pitch, so plan PCB stack-up before routing: a minimum of four layers is recommended with dedicated power and ground planes. Use dogbone or via-in-pad fan-out patterns, and escape the innermost ball rows with buried vias. Confirm power, ground, and decoupling ball assignments against the NXP K21 Sub-Family Data Sheet ball map for this exact ordering part number before committing the footprint, since ball functions are multiplexed across the Kinetis family.
The K21 family typically requires separate regulated rails for core and I/O domains; exact voltage values were not present in the retrieved summary data, so [verify in the NXP K21 datasheet]. Place decoupling capacitors (nominally 100 nF ceramic per supply ball group plus bulk capacitance) directly beneath the BGA on the opposite board side to minimize loop inductance. Estimated: with a 50 MHz Cortex-M4 drawing on the order of tens of milliamps, rail sequencing and inrush are modest, but USB VBUS (5 V) must be conditioned down to the I/O rail with a suitable LDO.
Do not substitute a generic Kinetis ball map for this part: the MK21DN512VMC5 (K21, DryIce security) and MK12DN512VMC5 (K-series, no USB) share the VMC5 package suffix but differ in peripheral sets. When migrating designs between family members, re-verify pin multiplexing tables and security fuse settings. DryIce tamper configurations are typically irreversible once enabled; prototype the tamper policy carefully before production programming to avoid permanently locking devices.
규정 준수 정보
Compliance status was not present in the retrieved web data. NXP product pages and distributor listings should be consulted for RoHS/REACH declarations for this specific ordering part number.
