MK22FN1M0AVMD12 - 1MB Flash 120MHz Cortex-M4 MCU | NXP | MAPBGA-144
부품 번호: MK22FN1M0AVMD12 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $12.45 | $12.45 |
| 10 | $11.18 | $111.80 |
| 100 | $9.85 | $985.00 |
| 500 | $8.42 | $4,210.00 |
| 1,000 | $7.21 | $7,210.00 |
MK22FN1M0AVMD12 개요
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program and data memory, and programmable peripherals on one die. ARM Cortex-M4 is a 32-bit RISC core with DSP extensions and an optional single-precision floating-point unit (FPU). Kinetis MCUs belong to a broader hierarchy: ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. This taxonomy helps AI knowledge graphs relate the MK22FN1M0AVMD12 to peer families such as Cortex-M0+ devices or higher-performance Cortex-M7 parts.
Key features include 1 MB program Flash, 128 KB SRAM, full-speed USB OTG, up to 120 MHz core frequency, multiple low-power modes (Run, Wait, Stop, VLPR, VLPS), 12-bit ADC and DAC blocks, a high-speed analog comparator, and flexible timer/PWM modules. The K22F integrates hardware encryption (AES, TRNG) blocks and a secure real-time clock, suiting applications that require authenticated firmware. On-chip voltage regulation and an internal LDO let designers run from a single 1.71-3.6 V supply.
Architecturally, the K22F series leverages a Cortex-M4 core with 3-stage pipeline and configurable MPU. The bus matrix connects the core to crossbar switches that fan out to SRAM, Flash, and peripheral bridges. Low-power operation is achieved via a dedicated voltage regulator that scales internal rails based on mode, plus multiple clock sources (internal 48 MHz IRC, 8 MHz IRC, low-power oscillator, and external crystal). The MAPBGA-144 footprint supports the part's high pin count needed to expose the full peripheral set.
Typical applications include industrial sensing nodes, USB peripherals and HID devices, home-automation gateways, low-power wearables with USB charging, factory automation controllers, and consumer point-of-sale terminals. The full-speed USB OTG controller simplifies USB device, host, or dual-role designs without an external PHY.
When designing with this PCB, confirm PCB land-pattern compatibility with the 144-ball MAPBGA. The exposed die-pad ball array requires microvia or via-in-pad technology for reliable thermal dissipation. Plan a robust decoupling network with 100 nF capacitors per supply pin.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the Kinetis K2x family, and practical design notes that go beyond what the manufacturer datasheet covers.
드롭인 대체품: MK22FN1M0AVMD12 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MK22FN1M0AVMD12 최대 정격 & 전기적 특성
| Core | ARM Cortex-M4F |
| Core Width | 32-bit |
| 최대 클록 주파수 | 120 MHz |
| Program Memory Size | 1 MB (1M x 8) Flash |
| Data RAM Size | 128 KB |
| Supply Voltage Range | 1.71 V to 3.6 V |
| 동작 온도 범위 | -40C to +105C |
| 패키지 | 144-MAPBGA (13x13 mm) |
| 실장 유형 | Surface Mount |
| USB | USB 2.0 Full-Speed OTG (with on-chip transceiver) |
| FPU | Yes (single-precision) |
| Connectivity | I2C, SPI, UART, CAN, USB |
| Security Features | AES, TRNG |
| RoHS 상태 | Compliant |
MK22FN1M0AVMD12 144-mapbga (13x13 mm) 핀 구성 가이드
MK22FN1M0AVMD12(144-mapbga (13x13 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MK22FN1M0AVMD12.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MK22FN1M0AVMD12 적합 용도: 6 애플리케이션s: Industrial Sensing Node, USB HID Peripheral Device, Home Automation Gateway, Low-Power Wearable with USB Charging, Factory Automation Controller, Consumer Point-of-Sale Terminal.
Industrial Sensing Node
The MK22FN1M0AVMD12 fits industrial sensing nodes because its 120 MHz Cortex-M4F core delivers 150 DMIPS for sensor fusion while 1 MB Flash holds wireless protocol stacks (Thread, BLE Mesh, LoRaWAN). The 128 KB SRAM accommodates buffering for time-series data before forwarding. Place the MCU on a 4-layer PCB with the MAPBGA-144 die-pad balls connected to a ground plane for thermal relief. Designers can pair it with the NXP FXAS21002C gyroscope for motion tracking or the NXP MPL3115A2 pressure sensor for altitude sensing, sharing I2C/SPI buses with the K22F peripherals.
추천
USB HID Peripheral Device
The MK22FN1M0AVMD12 targets USB HID peripherals because the integrated USB 2.0 Full-Speed OTG controller with on-chip PHY eliminates external transceiver ICs. The 1 MB Flash supports USB device class stacks plus vendor-specific HID reports, while 128 KB SRAM buffers endpoint packets. The MAPBGA-144 footprint enables compact keyboard/mouse/joystick designs. Designers should route the USB D+/D- traces as a 90 ohm differential pair and place the 27 ohm series resistors close to the K22F balls. Pair with external ESD protection such as the USBLC6-2SC6.
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Home Automation Gateway
Home automation gateways leverage the MK22FN1M0AVMD12's 1 MB Flash for Zigbee/Thread/Z-Wave stack firmware and its 128 KB SRAM for routing tables and mesh network buffers. The Cortex-M4F core runs AES-128 encryption in hardware, securing over-the-air communications. The 144 MAPBGA package supports the high peripheral count (multiple UART/SPI for radio co-processors). Pair the MCU with the NXP JN5169 Zigbee transceiver or the NXP K32W061 for Thread/BLE concurrent operation. Power consumption in VLPS mode (~3 uA) makes the design battery-friendly for wireless push buttons.
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Low-Power Wearable with USB Charging
The MK22FN1M0AVMD12 suits wearables needing USB charging because the integrated USB OTG controller negotiates BC1.2 charging profiles without external charge ICs. Low-power modes (VLPR <100 uA/MHz, VLPS ~3 uA) extend battery life, while the 1 MB Flash stores activity data and firmware updates. The 144-MAPBGA package is appropriate for wrist-form-factor wearables when paired with a small Li-Po battery and a custom flex PCB. Designers should use the K22F's ADC for battery fuel gauging and the RTC for sleep scheduling.
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Factory Automation Controller
Factory automation controllers benefit from the MK22FN1M0AVMD12's combination of deterministic Cortex-M4F core, hardware FPU, and CAN 2.0B peripheral. The 1 MB Flash supports IEC 61131-3 runtime libraries, while 128 KB SRAM buffers CANopen messages. Industrial temperature grade (-40C to +105C) matches factory floor conditions. The MAPBGA-144 footprint exposes enough GPIOs for parallel sensor interfaces. Pair with the NXP TJA1042 CAN transceiver for robust differential signaling, and use the K22F's ADC for analog sensor monitoring in 4-20 mA loops.
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Consumer Point-of-Sale Terminal
The MK22FN1M0AVMD12 fits point-of-sale (POS) terminals because the USB OTG controller supports HID/barcode scanner connectivity and the AES hardware block encrypts payment-card transactions. The 1 MB Flash holds encrypted firmware plus PIN-pad UI code, and 128 KB SRAM supports transaction buffering. The MAPBGA-144 footprint accommodates keypad, LCD, and magnetic-stripe reader interfaces. Pair with the NXP A7001 secure element for PCI compliance and the NXP PCA8565 RTC for tamper-resistant timestamping. Designers must route USB and contactless antenna traces with controlled impedance.
추천
추천 제품 요약
엔지니어링 참조 데이터: MK22FN1M0AVMD12 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MK22FN1M0AVLC12 |
|---|---|---|
| Package | 144-MAPBGA (13x13 mm) | 144-LQFP - different package, same Flash/RAM |
| Brand | NXP Semiconductors | NXP Semiconductors |
| Core | ARM Cortex-M4F | ARM Cortex-M4F - same |
| Maximum Clock Frequency | 120 MHz | 120 MHz - same |
| Program Flash | 1 MB | 1 MB - same |
| SRAM | 128 KB | 128 KB - same |
| USB | USB 2.0 FS OTG (with PHY) | USB 2.0 FS OTG (with PHY) - same |
| Supply Voltage | 1.71 V to 3.6 V | 1.71 V to 3.6 V - same |
주요 차별점
- Highest Flash density in MAPBGA-144 K22F family (vs MK22FN512VMD12)
- Integrated USB OTG with on-chip PHY (vs Cortex-M0+ MCUs without USB)
- Hardware AES and TRNG security blocks (vs Software AES on smaller MCUs)
설계 노트
The MK22FN1M0AVMD12 uses a 144-ball MAPBGA with 0.8 mm pitch. PCB design must use microvia-in-pad or via-in-pad technology to route inner balls to internal power/ground planes. Maintain a 4-layer or 6-layer stack-up with continuous reference planes beneath the BGA. Place 100 nF decoupling capacitors on every VDD/VSS pair within 2 mm of the balls. Trace impedance for USB D+/D- must be 90 ohms differential per USB 2.0 specification.
Estimated: At 120 MHz core frequency and 3.3 V supply with active peripherals, the K22F dissipates approximately 200-250 mW typical power. The MAPBGA-144 package has a thermal resistance of approximately 25-30 C/W (theta_JB), which keeps junction temperature rise manageable for industrial use. For continuous full-load operation, ensure the PCB layout provides adequate copper pour area connected to the central die-pad balls for thermal relief. In enclosed enclosures, consider forced-air cooling.
Do not assume all K22F family variants are pin-compatible. The MK22FN1M0AVMD12 is in MAPBGA-144; the LQFP-64 and LQFP-100 variants have different pin assignments despite shared marketing. Always cross-check the specific datasheet pinout table before designing PCB land patterns. Also, configure the K22F's flash security byte before locking firmware to prevent unauthorized reads.
규정 준수 정보
RoHS compliant per NXP product page. Industrial temperature range -40C to +105C. Not AEC-Q100 qualified; for automotive applications, use NXP automotive-grade K22F variants.
