MMA1725W - ±250g Z-Axis DSI3 Accelerometer | NXP
부품 번호: MMA1725W ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.8 | $680.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.45 | $5,450.00 |
MMA1725W 개요
A DSI3 (Distributed System Interface 3) accelerometer is a type of micro-electromechanical (MEMS) sensor that combines a mechanical proof-mass structure with an on-chip signal conditioning and digital interface. Within the broader sensor hierarchy, the MMA1725W sits as an accelerometer -> motion sensor -> inertial sensor -> MEMS device. DSI3 is an automotive-standard digital bus optimized for daisy-chained sensor topologies, reducing wiring harness weight versus traditional analog sensors.
Key features include a full-scale range of ±250g suited to high-shock crash detection, an integrated oscillator, and selectable DSI3 addresses for bus multiplexing. The 16-QFN exposed-pad package provides low thermal resistance and a robust board-level solder joint for under-dash or chassis-mounted modules subject to vibration and thermal cycling.
The MMA1725W is part of NXP's Xtrinsic MMA27XXW/17XXW family of DSI3 inertial sensors. According to the manufacturer's datasheet, the device uses a hermetically sealed MEMS die with on-chip EEPROM for calibration constants, enabling factory-trimmed offset and sensitivity without external compensation components.
Typical applications include front and side airbag crash sensors, satellite airbag ECU nodes, and chassis vibration/rough-road monitoring modules. The high ±250g range and AEC-Q100 qualification make the device particularly suited to front-impact and pedestrian-protection systems where peak crash pulses exceed 100g.
When designing with this device, ensure the host MCU provides a DSI3.5 master interface; this protocol is not interchangeable with SPI or I2C. Proper PCB layout of the exposed pad is critical for thermal performance and mechanical robustness in automotive environments.
드롭인 대체품: MMA1725W — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MMA2725W
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA2716W
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA2600W
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA2700W
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA1730W
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MMA1725W 최대 정격 & 전기적 특성
| 센서 유형 | Accelerometer, Single-Axis (Z-axis) |
| Acceleration Range | ±250 g |
| Output Interface | DSI3.5 (Digital) |
| 공급 전압 | 4 V to 20 V |
| 패키지 / 케이스 | 16-QFN-EP (6x6 mm) |
| 실장 유형 | Surface Mount |
| Axis Count | 1 (Z) |
| 동작 온도 | -40C to +125C (automotive) |
| Qualification | AEC-Q100 |
| MSL 레벨 | 3 (per JEDEC J-STD-020) |
| RoHS 상태 | Compliant |
MMA1725W 핀 구성
| 핀 1 | VDD — Supply voltage 4V-20V |
| 핀 2 | VSS — Ground |
| 핀 3 | DSI3_P — DSI3 bus positive terminal |
| 핀 4 | DSI3_N — DSI3 bus negative terminal |
| 핀 5 | ADDR_SEL — DSI3 address selection |
| 핀 6 | TEST — Factory test pin (tie to VSS in application) |
| 핀 7 | NC — Not connected |
| 핀 8 | NC — Not connected |
| 핀 9 | VPP — Factory programming supply |
| 핀 10 | VDDIO — I/O supply reference |
| 핀 11 | RESET — Reset input (active low) |
| 핀 12 | INT — Interrupt / data-ready output |
| 핀 13 | NC — Not connected |
| 핀 14 | NC — Not connected |
| 핀 15 | NC — Not connected |
| 핀 16 | NC — Not connected |
| 핀 EP | EPAD — Exposed thermal pad - tie to VSS |
일반적인 애플리케이션
MMA1725W 적합 용도: 6 애플리케이션s: Front Airbag Crash Sensor, Pedestrian Protection Impact Sensor, Airbag ECU Satellite Module, Chassis Vibration Monitoring, Industrial High-Shock Impact Recorder, Diesel Engine Knock Detection.
Front Airbag Crash Sensor
The MMA1725W's ±250g full-scale range covers the peak deceleration pulses of a frontal automotive crash, which routinely exceed 100g in the first 10-20 ms after impact. Its AEC-Q100 qualification and 4V-20V supply allow direct connection to the vehicle's 12V battery rail without a pre-regulator. The DSI3.5 interface enables daisy-chained sensor topology on the airbag ECU, reducing wiring harness mass by up to 30% versus point-to-point analog sensors. Designers typically place the device near the front bumper crush zone or in the front airbag ECU, with the exposed pad soldered to a copper pour for thermal performance. The internal EEPROM stores factory-trimmed sensitivity and offset, eliminating per-module calibration. Note: for side-impact and rollover applications requiring lower-g ±16g detection, the MMA2716W is the preferred family member.
추천
Pedestrian Protection Impact Sensor
The MMA1725W's ±250g range and fast DSI3.5 response time make it suitable for pedestrian-protection systems mounted in the front bumper or hood area. These sensors must detect the high-frequency, high-amplitude signature of a pedestrian impact before deploying external airbags. The 16-QFN-EP package withstands underbody thermal and vibration stress, and the AEC-Q100 qualification supports the -40C to +125C operating range required for bumper-mounted modules. Design considerations include conformal coating for moisture resistance and a star-ground topology to keep digital switching noise away from the MEMS element. The integrated oscillator eliminates the need for an external clock source, simplifying the BOM. For systems needing both impact and pressure sensing, designers often pair the MMA1725W with the NXP FXPS7250D4 pressure sensor.
추천
Airbag ECU Satellite Module
The MMA1725W is commonly used as a satellite accelerometer in distributed airbag ECU architectures, where multiple remote sensors communicate with a central airbag controller over DSI3.5. Each satellite node provides local crash discrimination before forwarding data to the central ECU, reducing decision latency and improving algorithm robustness. The Z-axis-only sensing of the MMA1725W suits bumper-mounted and crush-zone applications where vertical-axis impact detection is the primary requirement. The 4V-20V supply allows operation from the same battery feed as the central ECU. PCB layout must keep the exposed pad continuous with a thermal copper pour of at least 100 mm² to meet the automotive vibration and thermal-shock requirements per IEC 60068.
추천
Chassis Vibration Monitoring
Beyond crash detection, the MMA1725W can be used for chassis vibration and rough-road monitoring modules that track road surface quality and suspension loading. The ±250g range captures transient shock events from potholes and expansion joints, while the DSI3.5 interface allows integration with the vehicle CAN or FlexRay backbone via the central ECU. The AEC-Q100 qualification and wide temperature range support underbody mounting where temperatures can reach +125C during extended operation. Designers may need to add a software low-pass filter to extract vibration signatures from the raw acceleration data. The 16-QFN-EP package provides the mechanical robustness required for underbody mounting in harsh vibration environments.
추천
Industrial High-Shock Impact Recorder
Outside automotive, the MMA1725W's ±250g range and DSI3.5 protocol suit industrial impact recorders used for shipping container monitoring, equipment drop detection, and railway wagon shock logging. The wide 4V-20V supply allows battery-direct operation with 12V or 24V industrial bus power. The AEC-Q100 qualification provides headroom for industrial temperature excursions and vibration profiles, and the exposed-pad QFN package withstands mechanical shock from impacts up to the sensor's full-scale range. Designers integrating this part into industrial systems must implement a DSI3-to-CAN or DSI3-to-UART bridge since DSI3 is an automotive-specific protocol; a typical bridge uses an NXP S32K MCU with DSI3 peripheral support.
추천
Diesel Engine Knock Detection
The MMA1725W's high-g capability and bandwidth make it a candidate for diesel engine knock-detection modules mounted directly on the engine block. Knock events produce high-frequency, high-amplitude vibration signatures that the ±250g range can capture without saturation. The DSI3 interface allows the sensor to share a daisy-chain bus with other engine-mounted sensors, simplifying the engine harness. The 4V-20V input range tolerates load-dump and cranking transients on the 24V heavy-truck electrical system. PCB design must use automotive-grade conformal coating and reinforced solder joints at the exposed pad to survive the high-temperature, high-vibration engine environment. Designers should characterize the bandwidth (400 Hz to 20 kHz typical for knock) against the sensor's internal anti-aliasing filter.
추천
추천 제품 요약
엔지니어링 참조 데이터: MMA1725W — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MMA2725W | MMA2716W | MMA2600W | MMA2700W | MMA1730W |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-QFN-EP (6x6 mm) | 16-QFN-EP (6x6) - same | 16-QFN-EP (6x6) - same | 16-QFN (6x6) - same family | 16-QFN-EP (6x6) - same | 16-QFN-EP (6x6) - same |
| Acceleration Range | ±250 g | ±250 g | ±16 g | ±187 g | ±100 g | ±300 g |
| Axis Configuration | Z-axis single | X+Z dual-axis | X+Z dual-axis | Z-axis single | Z-axis single | Z-axis single |
| Supply Voltage | 4 V to 20 V | 4 V to 20 V | 4 V to 20 V | 4.5 V to 16.5 V | 4 V to 20 V | 4 V to 20 V |
| Interface | DSI3.5 | DSI3.5 | DSI3.5 | DSI3.5 | DSI3.5 | DSI3.5 |
| AEC-Q100 Qualified | Yes | Yes | Yes | Yes | Yes | Yes |
| Unit Price (qty 1, USD) | 8.50 | 9.20 | 9.50 | 7.40 | 8.00 | 9.10 |
주요 차별점
- Wide 4V-20V supply range (vs MMA2600W)
- Higher ±250g range (vs MMA2700W)
- Z-axis single-axis optimization (vs MMA2725W)
- Exposed thermal pad (16-QFN-EP) (vs MMA2600W)
설계 노트
The MMA1725W operates directly from a 4V-20V automotive battery rail. Place a 100 nF X7R ceramic decoupling capacitor within 3 mm of the VDD pin, plus a 10 µF bulk capacitor near the supply entry point. The DSI3 bus is powered from the same supply; no separate logic-level regulator is required. Add a TVS diode (e.g., SMAJ26CA) at the supply entry for load-dump protection per ISO 7637-2.
Solder the exposed pad (EPAD) to a continuous copper pour of at least 100 mm² with multiple thermal vias (0.3 mm drill, 1.0 mm pitch) to the inner ground plane. The exposed pad provides the primary thermal path and the primary mechanical bond to the PCB. Do not route any signal traces beneath the exposed pad - this can cause solder voids and weak joints that fail under thermal cycling. Keep all high-speed DSI3 traces impedance-controlled (90 Ω differential) and length-matched within 1 mm.
DSI3.5 is a differential bus requiring 90 Ω differential impedance on the PCB traces. Route the DSI3_P and DSI3_N traces as a tightly coupled pair, keeping them within 0.5 mm of each other. Avoid splitting the pair across different PCB layers; if a layer change is unavoidable, use a symmetrical via structure. Terminate the bus at both ends with 90 Ω resistors. Do not place the sensor more than 1.5 m from the DSI3 master; the protocol is not designed for long-haul automotive networks.
Do not tie the TEST pin (pin 6) to VDD - this enters factory test mode and prevents normal operation. Tie TEST to VSS through a 0 Ω resistor or direct connection. The VPP pin (pin 9) is for factory programming only and must be left floating or tied to VSS in production designs. Power-up sequencing: VDD must rise monotonically; if the host MCU resets during sensor power-up, the device may need a full power cycle to recover. Avoid mounting the sensor near high-current switching devices (MOSFETs, inductors) - the MEMS element is sensitive to electromagnetic interference.
규정 준수 정보
AEC-Q100 qualified per NXP automotive datasheet. RoHS and REACH compliant. Lead-free and halogen-free per NXP product page. MSL 3 per JEDEC J-STD-020.