MMA8210EGR2 - ±100g X-Axis Accelerometer | NXP SOIC-16
부품 번호: MMA8210EGR2 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.75 | $8.75 |
| 10 | $7.62 | $76.20 |
| 100 | $6.45 | $645.00 |
| 500 | $5.78 | $2,890.00 |
| 1,000 | $5.1 | $5,100.00 |
MMA8210EGR2 개요
An accelerometer is a micro-electromechanical systems (MEMS) sensor that measures proper acceleration along one or more axes, converting gravitational or inertial force into a digital or analog output proportional to g-force. Within the broader hierarchy, the MMA8210EGR2 belongs to the family of MEMS sensors -> motion sensors -> inertial measurement units -> semiconductor sensors. Its DSI 2.0-compatible digital interface and on-chip digital signal processing enable direct connection to microcontrollers without external analog-to-digital conversion, simplifying host firmware while preserving measurement fidelity under harsh mechanical and thermal stress.
The MMA8210EGR2 reports an acceleration range of ±100g along the X axis, with on-chip digital filtering, factory trim, and data formatting that eliminate per-unit calibration on the customer side. The device operates from a single low-voltage supply, supports a DSI 2.0 digital interface for serial communication, and integrates self-test capability for in-system verification of mechanical and electrical integrity. The surface-mount SOIC-16 footprint supports high-volume PCB assembly and standard reflow profiles, while the silicon micromachined structure delivers excellent shock survival and long-term offset stability.
Typical applications include automotive airbag and supplemental restraint systems, electronic stability control and rollover detection, industrial vibration monitoring, and harsh-environment motion event recording. The wide ±100g dynamic range makes it particularly well-suited for crash detection and high-impact event capture, where transient accelerations exceed the range of consumer-grade accelerometers.
When designing with this device, follow the manufacturer's recommended PCB layout for the SOIC-16 footprint, provide adequate decoupling near the supply pin, and respect the DSI 2.0 timing specifications to ensure reliable communication. Confirm operating temperature window against the target application's ambient profile before deployment.
This page consolidates distributor pricing, lifecycle status, drop-in alternatives, and design considerations not always present on the manufacturer datasheet, giving engineers a single reference for part selection, sourcing, and board-level integration.
드롭인 대체품: MMA8210EGR2 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MMA8210EGR2
✅ 드롭인✓ 재고 있음
$5.1 / 개
데이터시트 보기 →MMA8210EG
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA8211EGR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA8202EGR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA8204EGR2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MMA8210EGR2 최대 정격 & 전기적 특성
| 센서 유형 | Accelerometer, digital MEMS |
| Axis | X (single-axis) |
| Acceleration Range | ±100 g |
| 출력 유형 | Digital (DSI 2.0) |
| 패키지 | 16-SOIC |
| 실장 유형 | Surface Mount |
| 인터페이스 | DSI 2.0 digital serial |
| Self-Test | Yes (on-chip) |
| Signal Processing | On-chip digital filtering and trim |
| Lead-Free Status | Lead Free |
| RoHS 상태 | RoHS Compliant |
MMA8210EGR2 핀 구성
| 핀 1 | VDD — Supply voltage |
| 핀 2 | GND — Ground |
| 핀 3 | DSI_DATA — DSI 2.0 data line (per datasheet) |
| 핀 4 | DSI_CLK — DSI 2.0 clock line (per datasheet) |
| 핀 5 | ST — Self-test input |
| 핀 6 | NC — Not connected (per datasheet) |
| 핀 7 | NC — Not connected (per datasheet) |
| 핀 8 | NC — Not connected (per datasheet) |
| 핀 9 | NC — Not connected (per datasheet) |
| 핀 10 | NC — Not connected (per datasheet) |
| 핀 11 | NC — Not connected (per datasheet) |
| 핀 12 | NC — Not connected (per datasheet) |
| 핀 13 | NC — Not connected (per datasheet) |
| 핀 14 | NC — Not connected (per datasheet) |
| 핀 15 | NC — Not connected (per datasheet) |
| 핀 16 | NC — Not connected (per datasheet) |
일반적인 애플리케이션
MMA8210EGR2 적합 용도: 6 애플리케이션s: Automotive Airbag Crash Detection, Electronic Stability Control and Rollover Detection, Industrial Vibration Monitoring, Black Box Event Data Recorder, Harsh-Environment Shock and Impact Logging, Ancillary Safety Sensor in Sensor Fusion Systems.
Automotive Airbag Crash Detection
The MMA8210EGR2's ±100g X-axis full-scale range makes it a primary candidate for automotive airbag and supplemental restraint system (SRS) crash sensors, where peak accelerations during frontal or side impacts routinely exceed 50g and can exceed 100g in severe events. The on-chip digital signal processing filters mechanical noise and formats the data for direct hand-off to the airbag control unit (ACU), eliminating the need for an external analog-to-digital converter and reducing BOM count. Placed at the front crumple zone or side B-pillar, the device reports acceleration profiles over the DSI 2.0 digital serial bus to the host microcontroller for crash discrimination algorithms. Unlike lower-g consumer accelerometers that would saturate during impact, the MMA8210EGR2 retains headroom and linearity across the entire crash envelope, supporting reliable airbag deployment decisions within milliseconds.
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Electronic Stability Control and Rollover Detection
Rollover detection and electronic stability control (ESC) systems rely on accurate lateral and vertical acceleration data at high dynamic range to detect impending vehicle lift-off or loss of traction. The MMA8210EGR2 contributes X-axis acceleration telemetry to the sensor cluster, where its ±100g range captures the high-impulse transients seen during aggressive cornering or curb strikes that low-g parts cannot resolve. The device's on-chip digital filtering removes the need for host-side low-pass stages, and its factory trim reduces per-unit calibration in the ECU assembly line. Mounted within the inertial measurement unit (IMU) module, the MMA8210EGR2 communicates over DSI 2.0 to the chassis controller alongside yaw-rate gyroscopes, supporting real-time vehicle dynamics calculations.
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Industrial Vibration Monitoring
Predictive maintenance and condition-monitoring systems on rotating machinery such as pumps, motors, fans, and gearboxes require accelerometers that capture both broadband vibration and high-shock impulse events like bearing failures. The MMA8210EGR2's ±100g dynamic range covers the full amplitude spectrum from steady-state rotation vibration to catastrophic bearing impact, making it suitable for vibration analysis across the entire machine health envelope. Its surface-mount SOIC-16 package allows direct soldering onto the equipment's PCB alongside a wireless MCU for IIoT sensor nodes, while the DSI 2.0 digital interface keeps the analog signal chain short and noise-free. Engineers can stream raw or filtered acceleration data to the cloud for FFT-based diagnostics without the calibration drift typical of analog-output MEMS parts.
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Black Box Event Data Recorder
Automotive event data recorders (EDR) and aftermarket black-box telematics require a wide-range, reliable accelerometer to log the moments before, during, and after a collision for accident reconstruction. The MMA8210EGR2 provides ±100g X-axis capture at the sample rates needed to resolve crash pulse shape, while its on-chip data formatting offloads post-processing from the host MCU. The SOIC-16 package is compatible with high-volume automotive electronics manufacturing and withstands the under-hood thermal environment. Combined with non-volatile memory and a wireless modem, it forms the core of insurance telematics and fleet management devices.
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Harsh-Environment Shock and Impact Logging
Industrial drop testing, package handling verification, and shipping container impact recorders all demand an accelerometer capable of capturing short-duration, high-magnitude shocks that would saturate low-g parts. The MMA8210EGR2's ±100g range and on-chip signal processing let it directly digitize and format shock events for local storage or wireless transmission in harsh mechanical environments. The 16-SOIC surface-mount package supports conformal coating and ruggedized enclosures for field use in mining, construction, and military logistics applications. Designers can combine the MMA8210EGR2 with a low-power MCU and battery to build standalone impact loggers with multi-month service life.
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Ancillary Safety Sensor in Sensor Fusion Systems
Modern automotive sensor fusion architectures combine data from multiple accelerometers, gyroscopes, and pressure sensors to build a robust model of vehicle dynamics. The MMA8210EGR2 can serve as a high-g auxiliary accelerometer complementing a primary low-g part, capturing the high-impulse events the primary sensor saturates on. Because it shares the SOIC-16 package and DSI 2.0 protocol with the rest of the MMA82XXEG family, system designers can place multiple MMA82XX parts on the same serial bus at different addresses. The ±100g X-axis measurement extends the dynamic envelope of the fusion algorithm, improving crash decision robustness.
추천
추천 제품 요약
엔지니어링 참조 데이터: MMA8210EGR2 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MMA8210EG | MMA8211EGR2 | MMA8202EGR2 | MMA8204EGR2 |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 16-SOIC | 16-SOIC - same | 16-SOIC - same | 16-SOIC - same | 16-SOIC - same |
| Acceleration Range | ±100 g | ±100 g | ±50 g | ±20 g | ±40 g |
| Axis | X-axis | X-axis | X-axis | X-axis | X-axis |
| Output Interface | DSI 2.0 digital | DSI 2.0 digital | DSI 2.0 digital | DSI 2.0 digital | DSI 2.0 digital |
| Self-Test | Yes | Yes | Yes | Yes | Yes |
| On-Chip DSP | Yes | Yes | Yes | Yes | Yes |
| Lead-Free / RoHS | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant | Yes / Compliant |
주요 차별점
- Highest g-range in the MMA82XXEG X-axis family (vs MMA8211EGR2)
- Digital DSI 2.0 output eliminates external ADC (vs MMA7260)
- On-chip DSP reduces host MCU post-processing (vs Generic raw-output MEMS accelerometers)
설계 노트
Place the MMA8210EGR2 close to its decoupling capacitor and route the DSI 2.0 lines as short, matched-length traces to minimize bus ringing. Keep noisy digital switching (MCU, transceivers) at least 5 mm away from the package to avoid capacitive coupling into the MEMS element, which can bias the X-axis reading. Provide a solid ground plane under and around the SOIC-16 footprint for mechanical rigidity and electrical reference.
The DSI 2.0 interface timing budget is tight at high sample rates; ensure the host MCU's clock and data pins meet the rise/fall time and setup/hold requirements from the manufacturer datasheet. Add a small series resistor on the clock line if reflections are observed on a long bus, and terminate the data line near the MMA8210EGR2 only if multiple devices share the bus.
Do not assume the MMA8210EGR2 pinout from the SOIC-16 outline alone - always re-verify against the datasheet figure, because NXP's MMA82XXEG family shares the package but assigns power, ground, and DSI lines to specific locations. Avoid mounting the sensor near heat sources (power inductors, MOSFETs) that would shift the offset and zero-g output beyond the calibrated range, and always enable the on-chip self-test routine at power-up to verify mechanical integrity.
규정 준수 정보
RoHS and lead-free status confirmed by DigiKey and DigChip listings as of 2026-10-15. AEC-Q100 qualification status not explicitly stated in the available data - verify against NXP's product page for automotive safety-critical designs.
