MPC8264AZUPJDB - PowerQUICC II MPU 300MHz | NXP Semiconductors
부품 번호: MPC8264AZUPJDB ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $85 | $85.00 |
| 10 | $78 | $780.00 |
| 100 | $72 | $7,200.00 |
| 500 | $65 | $32,500.00 |
| 1,000 | $58 | $58,000.00 |
MPC8264AZUPJDB 개요
A microprocessor (MPU) is an integrated circuit that contains the arithmetic logic unit, control unit, registers and primary cache of a computer system on a single die. The MPC8264 sits in the MPU taxonomy as: PowerPC G2 -> embedded MPU -> communications processor -> integrated processor. The PowerQUICC II family specifically targets telecom and networking infrastructure, integrating a PowerPC core with on-chip SCCs, FCCs, MCCs, and a CPM (Communications Processor Module) to offload networking tasks from the main CPU.
Key features include the 300 MHz PowerPC G2 core, 16 KB instruction cache and 16 KB data cache, a 64-bit 60x bus interface, integrated Ethernet (10/100), ATM, and serial peripheral support, and hardware fast Ethernet controllers. The device supports SDRAM, DRAM, SRAM, and Flash memory interfaces through its memory controller, plus a 32-bit PCI interface for system expansion. Industrial temperature grade and extended lifecycle support make it suitable for long-term telecom deployments.
The MPC8264 architecture separates communications processing (handled by the embedded CPM RISC engine) from the host CPU, which dramatically reduces host CPU load in protocol-intensive applications. This dual-engine design accelerates routing, bridging, and protocol termination tasks compared with general-purpose MPUs that must handle communications in software.
Typical applications include WAN access routers, DSLAM line cards, ATM switches, ISDN routers, TDM switching equipment, frame relay access devices, wireless base station controllers, and industrial communications controllers. The integrated CPM with multi-channel HDLC support is particularly valuable for legacy telecom equipment still in service today.
When designing with the MPC8264, ensure power sequencing requirements are met (3.3V I/O, internal core voltage regulation) and that the high-density TBGA PCB layout uses microvia technology for escape routing. Thermal management requires attention because industrial temperature operation and sustained communications loads elevate power dissipation.
This page synthesizes NXP datasheet specifications, distributor pricing, drop-in alternatives in the same MPC82xx family, and practical design notes not aggregated in any single manufacturer document.
드롭인 대체품: MPC8264AZUPJDB — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC8264AZUPJDB (동일 폼 팩터 및 풋프린트) — 차이점: Communications Processor Module (CPM), Mounting Type, Process Technology, RoHS Status.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8264AZUPEB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8264AVG400
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8265AZUPJDB
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8260AZUPJDB
✅ 드롭인✓ 재고 있음
$165 / 개
데이터시트 보기 →MPC8255AZU300B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8264AZUPJDB 최대 정격 & 전기적 특성
| Core Architecture | PowerPC G2 |
| Number of Cores | 1 |
| 데이터 버스 폭 | 32-bit |
| 최대 클록 주파수 | 300 MHz |
| Package Type | 480-TBGA (37.5 x 37.5 mm) |
| Family | PowerQUICC II (MPC82xx) |
| Process Technology | 0.25 micron HiP4 CMOS |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Communications Processor Module (CPM) | Integrated |
| Memory Controller | SDRAM / SRAM / Flash support |
| PCI Interface | 32-bit PCI |
| Ethernet Support | 10/100 Mbps (FCC) |
| Serial Communications | SCC, FCC, MCC (multi-channel HDLC) |
| 실장 유형 | Surface Mount (TBGA) |
| RoHS 상태 | Compliant |
MPC8264AZUPJDB 480-tbga (37.5 x 37.5 mm) 핀 구성 가이드
MPC8264AZUPJDB(480-tbga (37.5 x 37.5 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8264AZUPJDB.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8264AZUPJDB 적합 용도: 6 애플리케이션s: WAN Access Router, DSLAM Line Card Controller, ATM Switch Control Plane, Industrial Communications Controller, Wireless Base Station Controller, Frame Relay Access Device.
WAN Access Router
The MPC8264AZUPJDB fits WAN router designs because its integrated PowerPC G2 core plus dedicated CPM (Communications Processor Module) handles IP routing, NAT, and protocol termination in hardware. With 300 MHz CPU clock and multi-channel HDLC support through MCCs and SCCs, it terminates multiple WAN links simultaneously while the host CPU runs the routing stack. The 32-bit PCI interface enables connection to crypto accelerators or DSL/ADSL front-end chipsets. Compared with software-only solutions, the MPC8264's offloaded communications paths reduce host CPU load by 50-70%, allowing fanless router designs. Its industrial temperature grade supports deployment in outdoor enclosures and uncontrolled cabinet environments typical of ISP POP sites.
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DSLAM Line Card Controller
DSLAM line cards require a processor that can aggregate many ADSL subscriber links into the upstream network. The MPC8264AZUPJDB's integrated CPM with multi-channel HDLC and ATM SAR support maps directly to DSL line card requirements, terminating per-subscriber PPPoA/PPPoE sessions in hardware. The 300 MHz PowerPC G2 core runs the aggregation logic, while the 32-bit PCI bus connects to upstream switching fabric. The 480-TBGA package provides the thermal headroom needed for line cards operating at industrial temperatures in central-office environments. Its long-term availability through NXP's extended-lifecycle program supports the 10+ year deployment horizons common in telecom access networks.
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ATM Switch Control Plane
ATM switching equipment requires a control-plane processor that handles routing table updates, signaling (UNI/NNI), and management interfaces while the data plane performs cell switching. The MPC8264AZUPJDB fits this role because its CPM contains dedicated UTOPIA interfaces for ATM PHY connection and multiple SCCs for management LANs. The 300 MHz PowerPC G2 core runs routing protocols (PNNI, OSPF), while the integrated CPM offloads AAL5 SAR work from the host CPU. The 64-bit 60x external bus enables high-throughput links to TCAM and forwarding ASICs, and the 32-bit PCI bus connects to switching fabric chips. Industrial temperature operation ensures reliability in central-office deployments.
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Industrial Communications Controller
Industrial communication gateways and protocol converters require a robust processor that supports multiple legacy serial interfaces alongside modern Ethernet. The MPC8264AZUPJDB's combination of FCCs (10/100 Ethernet), SCCs (serial protocols), and an industrial temperature grade makes it suitable for factory floor gateways converting Modbus, Profibus, and proprietary protocols to Ethernet. The PowerPC G2 core at 300 MHz runs the conversion stack, while the dedicated CPM handles real-time serial protocol termination without host CPU intervention. The 480-TBGA package provides mechanical robustness, and the part's mature lifecycle status (with NXP long-term support) matches the 10-15 year deployment cycles of industrial systems.
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Wireless Base Station Controller
Wireless base station controllers aggregate traffic from multiple radio heads and terminate backhaul protocols. The MPC8264AZUPJDB fits this application because its multi-channel HDLC controllers terminate backhaul E1/T1 links, while the PowerPC G2 host runs the BTS management software. The 300 MHz CPU performance is sufficient for 2G/3G BTS controllers handling dozens of TRX links. The 32-bit PCI interface connects to the baseband modem ASICs, and the dedicated CPM handles real-time Abis/Abis-IP protocol processing. Industrial temperature support ensures operation in outdoor or uncontrolled BTS cabinet environments. The part's mature status and NXP's extended-lifecycle commitment align with telecom infrastructure deployment cycles.
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Frame Relay Access Device
Frame Relay Access Devices (FRADs) aggregate and concentrate frame relay PVCs from multiple endpoints onto a single uplink. The MPC8264AZUPJDB's integrated CPM with HDLC controllers and SCCs maps directly to FRAD requirements, terminating dozens of frame relay PVCs in hardware. The 300 MHz PowerPC G2 host runs the FRAD management software and PVC concentration algorithms. The 32-bit PCI interface enables connection to higher-layer routers or switches, while the integrated Ethernet MACs support IP uplink ports. The 480-TBGA package and industrial temperature grade suit enterprise CPE and carrier-side deployment environments.
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추천 제품 요약
엔지니어링 참조 데이터: MPC8264AZUPJDB — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8264AZUPEB | MPC8264AVG400 | MPC8265AZUPJDB | MPC8260AZUPJDB | MPC8255AZU300B |
|---|---|---|---|---|---|---|
| Package | 480-TBGA (37.5x37.5 mm) | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same | 480-TBGA - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 | PowerPC G2 |
| Core Frequency | 300 MHz | 300 MHz | 400 MHz | 300 MHz | 300 MHz | 300 MHz |
| Data Bus Width | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit | 32-bit |
| CPM (Communications Processor) | Integrated | Integrated | Integrated | Integrated | Integrated (full) | Integrated (reduced) |
| Ethernet Support | 10/100 Mbps (FCC) | 10/100 Mbps (FCC) | 10/100 Mbps (FCC) | 10/100 Mbps (FCC) | 10/100 Mbps (FCC) | 10/100 Mbps (FCC) |
| PCI Interface | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI | 32-bit PCI |
주요 차별점
- Mature PowerQUICC II platform with long-term availability (vs MPC8255AZU300B)
- Lower MPQ cost than higher-feature variant (vs MPC8260AZUPJDB)
- Extended temperature grade variant available (vs MPC8264AZUPEB)
설계 노트
The 480-TBGA package dissipates an estimated 2.5W to 4W under typical 300 MHz operation with full CPM activity. Provide at least 1 oz copper pour on inner PCB layers beneath the BGA land pattern and consider 2 oz copper on top/bottom layers. For sealed enclosures without forced airflow, derive the thermal design figure using theta_JA from the NXP PowerQUICC II hardware specifications document and derate for industrial temperature operation. Heatsink attachment is generally not required for the TBGA package, but PCB copper area is critical.
The 480-TBGA at 1.27 mm ball pitch standard PCB escape requires microvia technology (laser-drilled stacked vias) for inner-row fan-out, or via-in-pad with plating and filling. Use a 4+ layer stack-up with continuous ground planes beneath the BGA. Match the trace impedance to 50 ohms single-line for high-speed signals. Reflow must follow JEDEC J-STD-020 profile for large-body BGAs; do not use high-GRTC BGA profiles that may warp the TBGA. Place decoupling capacitors adjacent to every power pin pair.
Common pitfalls when designing with the MPC56xx PowerQUICC II include: (1) failing to provide the correct power-on reset sequencing for 3.3V I/O and the internal core voltage regulator; (2) using general-purpose BGA escape routing that violates the 1.27 mm pitch design rules; (3) not enabling the JTAG TEST pins correctly, which can lock the device; (4) over-driving the CPM clocks beyond specification, causing Ethernet/multi-bit errors; and (5) omitting proper bus-termination on the 64-bit 60x external bus, causing signal integrity issues at 66-83 MHz bus speeds. Refer to AN2242 and the hardware specifications document for routine interrupt configuration.
규정 준수 정보
RoHS compliant per NXP product documentation. Not AEC-Q100 qualified - this is a communications processor MPU, not an automotive-grade MCU. HW limitations for REACH and conflict minerals are available on request through NXP support.