MPC8548EPXAUJD557 - PowerQUICC III 1.333GHz e500 SoC | NXP
부품 번호: MPC8548EPXAUJD557 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $665.26 | $665.26 |
| 10 | $632 | $6,320.00 |
| 100 | $598.5 | $59,850.00 |
| 500 | $555 | $277,500.00 |
| 1,000 | $519.5 | $519,500.00 |
MPC8548EPXAUJD557 개요
A PowerQUICC III communications processor is a system-on-chip that combines a Power Architecture CPU core with specialized I/O controllers for networking and telecom equipment. The MPC85xx family sits at the boundary between communications processors (CPUs with dedicated I/O acceleration) and full system-on-chip designs. It belongs to the broader category of embedded MPU/MCU, bridging general-purpose computing with deterministic packet-processing hardware. This integration makes PowerQUICC III devices ideal for routing, switching, and secure line-card applications where discrete CPU plus I/O ASICs would consume excessive board space.
Key features include a single e500 core running at 1.333 GHz, 36-bit physical addressing, integrated SEC 3.0 cryptographic accelerator supporting DES, 3DES, AES, RSA and ECC, two 64-bit DDR2 SDRAM controllers with ECC, four Gigabit Ethernet MACs with SGMII support, two PCI Express interfaces, two Serial RapidIO endpoints, and dual 32-bit PCI/PCI-X interfaces. The 783-FCPBGA package provides the high pin density required for parallel memory, networking, and expansion buses. The integrated security and I/O blocks eliminate the need for companion ASICs, reducing system BOM.
Typical applications include secure routers, multiservice switches, DSLAM line cards, wireless base-station controllers, industrial control, and defense/aerospace secure communications. The combination of e500 core throughput, hardware cryptography, and multi-protocol high-speed I/O suits packet-processing workloads where deterministic latency and hardware-accelerated security are mandatory.
When designing with this device, ensure proper DDR2 signal-integrity layout (matched-length, controlled-impedance traces) and adequate thermal dissipation. The 783-FCPBGA package demands a multilayer PCB with internal power planes; refer to NXP application note AN2589 for BGA break-out routing guidance. Programming requires the standard e500 toolchain plus NXP-specific BSP support.
This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: MPC8548EPXAUJD557 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MPC8548EPXAUJ
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8548EVXAUJD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8548EPXAQJD557
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
MPC8536EBXAUQH
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8548EPXAVJD
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC8548EPXAUJD557 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Series | PowerQUICC III, MPC85xx |
| Core Architecture | Power Architecture e500 |
| Core Count | 1 |
| 데이터 버스 폭 | 32-bit |
| Maximum Core Frequency | 1.333 GHz |
| 동작 온도 | 0C to +105C |
| 패키지 / 케이스 | 783-FCPBGA (29x29 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Memory Controller | Dual 64-bit DDR2 with ECC |
| Ethernet | 4x 10/100/1000 MAC with SGMII |
| PCI Express | 2x PCIe interfaces |
| Serial RapidIO | 2x SRIO endpoints |
| PCI / PCI-X | Dual 32-bit PCI/PCI-X |
| Security Engine | SEC 3.0 (DES/3DES/AES/RSA/ECC) |
| RoHS 상태 | Compliant |
MPC8548EPXAUJD557 783-fcpbga (29x29 mm) 핀 구성 가이드
MPC8548EPXAUJD557(783-fcpbga (29x29 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC8548EPXAUJD557.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC8548EPXAUJD557 적합 용도: 6 애플리케이션s: Secure Enterprise Routers, Multiservice Switches / DSLAM Line Cards, Wireless Base Station Controllers, Defense and Aerospace Secure Communications, Industrial Control and SCADA Gateways, Storage Area Network Controllers.
Secure Enterprise Routers
The MPC8548EPXAUJD557 is well-suited for secure enterprise and edge routers because it integrates a 1.333 GHz e500 core with hardware SEC 3.0 acceleration for IPsec, SSL/TLS, and MACsec line-rate encryption. The four Gigabit Ethernet MACs with SGMII SerDes enable multi-WAN uplink designs without external PHYs. Unlike a discrete CPU plus encryption coprocessor, the integrated SEC offloads AES/RSA from the e500 core, leaving CPU headroom for routing protocols and management plane tasks. Dual DDR2 controllers with ECC provide the memory bandwidth required for routing tables and encrypted packet buffers.
추천
Multiservice Switches / DSLAM Line Cards
In DSLAM and multiservice switch line cards, the MPC8548EPXAUJD557 delivers deterministic packet processing at wire rate across dual PCI-X buses and the Serial RapidIO fabric. The e500 core handles forwarding table lookup, QoS classification, and OAM processing, while the integrated SEC accelerates subscriber authentication. The 783-FCPBGA package keeps the BOM compact by absorbing CPU, memory controller, and I/O into a single device. Dual DDR2 controllers with ECC enable large subscriber-table storage with error correction for telecom-grade reliability requirements.
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Wireless Base Station Controllers
For wireless base-station controller cards, the MPC8548EPXAUJD557 integrates the e500 core, four Gigabit Ethernet MACs, two Serial RapidIO endpoints, and two PCI Express interfaces - all needed to backhaul aggregated baseband data and connect to radio cards. The hardware SEC engine accelerates 3G/4G authentication (AKA, SNOW 3G) directly on-chip. The 0 to 105C operating temperature supports outdoor-cabinet and indoor base-station deployments. Dual DDR2 controllers with ECC enable large RLC/MAC buffer pools for HARQ retransmission handling.
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Defense and Aerospace Secure Communications
The MPC8548EPXAUJD557 is qualified for defense and aerospace secure-communications platforms because of its Type-1-capable SEC 3.0 engine, deterministic e500 core, and 0 to 105C operating range. Integrated HAIPE/IPSEC acceleration enables high-assurance encrypted links without exposing key material to software. The long lifecycle of PowerQUICC III makes it suitable for programs with multi-decade deployment horizons. The 783-FCPBGA package supports ruggedized PCB construction with underfill for vibration tolerance.
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Industrial Control and SCADA Gateways
For industrial control and SCADA gateway designs, the MPC8548EPXAUJD557 combines the e500 real-time-friendly core with hardware cryptography for secure Modbus/TCP, DNP3, or IEC 60870-5-104 tunneling. The four Gigabit Ethernet MACs support redundant ring topologies common in substations and factory automation. The 0 to 105C temperature rating handles outdoor cabinet installations. Dual PCI-X buses can interface legacy industrial I/O cards, preserving investment in existing PLC cards during the migration to Ethernet-based control.
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Storage Area Network Controllers
In storage area network (SAN) controllers and RAID-on-chip appliances, the MPC8548EPXAUJD557 connects to host servers via PCI Express and to disk arrays via Serial RapidIO or SATA bridges. The e500 core runs the storage stack (iSCSI, FC, NFS) while hardware SEC accelerates encrypted-volume and self-encrypting drive management. Dual DDR2 controllers provide the bandwidth for cache and metadata operations. The 783-FCPBGA package's high pin count supports simultaneous PCIe, SRIO, and Ethernet ports without external switching.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC8548EPXAUJD557 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC8548EPXAUJ | MPC8548EVXAUJD | MPC8548EPXAQJD557 | MPC8536EBXAUQH | MPC8548EPXAVJD |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 783-FCPBGA (29x29) | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same | 783-FCPBGA (29x29) - same |
| Core Architecture | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 | Power Architecture e500 |
| Security Engine (SEC) | Yes (SEC 3.0) | Yes (SEC 3.0) | Yes (SEC 3.0) | Yes (SEC 3.0) | Yes (SEC 3.0) | Yes (SEC 3.0) |
| Gigabit Ethernet MACs | 4 | 4 | 4 | 4 | 2 | 4 |
| PCI Express | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C |
주요 차별점
- Hardware cryptographic acceleration integrated on-chip (vs MPC8536EBXAUQH)
- Higher core frequency within same package (vs MPC8548EPXAVJD)
- Four Gigabit Ethernet MACs in a single SoC (vs MPC8536EBXAUQH)
설계 노트
The 783-FCPBGA package requires a multilayer PCB with internal power planes and microvia/stacked-via technology for fan-out. Per NXP application note AN2589, maintain 50 ohm controlled-impedance traces for DDR2, Ethernet SerDes, and PCIe/SRIO differential pairs. Match DDR2 byte-lane trace lengths within 25 mil and use fly-by topology for command/address signals to avoid timing violations at 1.333 GHz core frequency.
Estimated: at 1.333 GHz core frequency with all four Ethernet MACs and SEC active, total power dissipation is approximately 8 to 10 W. The 783-FCPBGA package requires thermal vias under the die and a copper spreader to keep junction temperature below 105C. Use thermal interface material if attaching an external heatsink, and verify with a thermal probe under full load before sealing the enclosure.
Do not skip the DDR2 calibration sequence - both controllers require run-time calibration via the SPD EEPROM on I2C. Place the DDR2 SDRAM devices within 25 mm of the BGA to minimize signal integrity issues. Power-on reset sequencing between Vdd core, DDR2 I/O, and SerDes supplies must follow the order specified in the datasheet; otherwise the device may latch into an unrecoverable state.
SerDes lanes (PCIe, SRIO, SGMII) require AC-coupling capacitors placed close to the transmitter. Reference NXP AN2826 for PCIe layout and AN2935 for SRIO layout. Do not route SerDes pairs across PCB splits; maintain a continuous ground reference plane beneath each pair. Differential intra-pair skew should not exceed 5 mil to meet 6.25 Gbps SRIO and 5 Gbps PCIe Gen 2 jitter budgets.
규정 준수 정보
RoHS and REACH compliant per NXP product page. Not AEC-Q100 qualified - this part is intended for communications infrastructure, not automotive. For defense applications, verify with NXP whether the specific lot is compliant with customer-specific export-control and MIL-spec requirements.