MPC860DPVR80D4 - PowerQUICC 80MHz 32-Bit MPU | NXP | 357-PBGA
부품 번호: MPC860DPVR80D4 ⚠ 최종 구매MPC860DPVR80D4 개요
An embedded MPU (microprocessor unit) is a CPU integrated with memory and peripherals on a single die, used in industrial controllers, networking equipment, and communications infrastructure where deterministic processing of real-time protocol traffic is required. The MPC860DPVR80D4 sits in the broader taxonomy of PowerPC-based embedded processors -> RISC microprocessors -> integrated communications processors -> networking SoCs, and is one of the foundational devices behind early-2000s telecom and datacom equipment.
Key features include the integrated CPM supporting serial interfaces, a memory controller, system integration functions, and on-chip peripherals. The 'DP' suffix denotes the specific configuration within the MPC860 family (revisions and feature mixes differ across DT/DT/DTV/PC/DP variants). The 80 MHz clock speed, 32-bit data path, and 357-ball PBGA footprint make this device oriented toward mid-complexity routers, bridges, and access multiplexers.
Technically, the MPC860DPVR80D4 is implemented in a 0.32-micron CMOS process, balancing integration density with low power for a PowerPC-class core. The CPM offloads protocol processing (HDLC, UART, Ethernet) from the core, allowing deterministic throughput on serial lines while the core handles control-plane tasks.
Typical applications include telecom access equipment such as DSLAMs, routers, bridges, and ISDN terminal adapters, plus industrial control and embedded networking modules.
When designing with this part, note its leaded (Pb-containing) finish per the original MPC860 family datasheet - the 'D4' suffix denotes a leaded ball finish which is not RoHS compliant. New designs should target lead-free equivalents.
This page synthesizes distributor pricing, lead-time, and 357-PBGA drop-in alternatives not aggregated in a single place by any single distributor listing, helping engineers evaluate last-time-buy and obsolescence-mitigation options.
드롭인 대체품: MPC860DPVR80D4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
MPC860DPVR66D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860DTZQ80D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860PVR80D4R2
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC866PCVR100A
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
KMPC860TVR80D4
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MPC860DPVR80D4 최대 정격 & 전기적 특성
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Series | PowerQUICC MPC860 |
| Core Processor | PowerPC MPC8xx |
| Number of Cores / Bus Width | 1 Core / 32-Bit |
| Core Clock Speed | 80 MHz |
| Operating Process | 0.32 micron CMOS |
| 패키지 | 357-PBGA (25 x 25 mm) |
| 실장 유형 | Surface Mount (BGA) |
| Memory Controller | Yes (integrated, supports SDRAM / DRAM) |
| Communications Processor Module (CPM) | Yes (integrated, supports HDLC / UART / Ethernet) |
| On-chip Peripherals | Timers, DMA, serial interfaces, system integration |
| Ball Finish | Leaded (SnPb) - per 'D4' suffix, non-RoHS |
| 수명 주기 상태 | Last Time Buy - End of Life announced per NXP product page |
MPC860DPVR80D4 357-pbga (25 x 25 mm) 핀 구성 가이드
MPC860DPVR80D4(357-pbga (25 x 25 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC860DPVR80D4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC860DPVR80D4 적합 용도: 6 애플리케이션s: Telecom Access Equipment (DSLAM / ISDN), Routers and Bridges, Industrial Serial Communication Controllers, Embedded Networking Modules, Legacy Protocol Converter / Gateway, Long-Lifecycle Defense / Aerospace Avionics Subsystems.
Telecom Access Equipment (DSLAM / ISDN)
The MPC860DPVR80D4 is purpose-built for telecom access infrastructure such as DSLAMs, ISDN terminal adapters, and central-office line cards where a CPU must run management/control-plane software while the integrated CPM offloads real-time HDLC and serial protocol handling. At 80 MHz, the PowerPC core sustains OAM and routing tasks, and the CPM handles multiple E1/T1 or V.35 channels without saturating the core. Placed on the line card with an SDRAM-controlled memory subsystem and a front-end transceiver, the device delivers deterministic multi-channel throughput that early-2000s access equipment demanded. The same architecture maps directly to modernized access devices still in service today, where the part continues to be supported via last-time-buy inventory.
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Routers and Bridges
Mid-complexity routers and bridges deployed in enterprise and service-provider edge networks used the MPC860DPVR80D4 because its integrated CPM provided hardware-accelerated Ethernet MAC and serial interfaces while the PowerPC core ran the routing control plane (RIP/OSPF/BGP forwarding decisions, QoS classification, IP filtering). The 80 MHz core handled table lookups and route processing at line rates typical of 10/100 Mbps Ethernet edges, and the 357-PBGA package concentrated CPU, memory controller, and peripheral logic into a single footprint. Compared with discrete CPU-plus-network-processor designs, the PowerQUICC integration cut board area and BOM cost while shortening time-to-market - which is why this part remains a reference design in legacy networking textbooks and training material.
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Industrial Serial Communication Controllers
Industrial automation racks with multi-drop serial fieldbus networks (Modbus, Profibus, HDLC-based proprietary protocols) leveraged the MPC860DPVR80D4's CPM to manage multiple serial channels concurrently with deterministic latency. The CPM's serial channel controllers handle framing, CRC, and HDLC bit-stuffing in hardware, freeing the 80 MHz PowerPC core to run the application-level control loop. The 357-PBGA's high ball count gives enough I/O for 4-8 serial channels, an SDRAM interface, and PCI/parallel expansion common to industrial SBC architectures. This combination remains well-suited for retrofits of legacy SCADA and factory-floor controllers where IPC @ 80 MHz is more than adequate.
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Embedded Networking Modules
Small-form-factor embedded networking modules - such as PCI/CompactPCI SBCs in defense and aerospace subsystems - used the MPC860DPVR80D4 to combine Ethernet connectivity, serial ports, and local processing in a single BGA footprint. The 357-PBGA exposed sufficient balls for PCI, MII/RMII Ethernet, USB (via companion chips), and SDRAM, while the PowerPC core ran VxWorks or Linux for packet processing. Designers favored it for SWaP-sensitive platforms (size, weight, and power) where a discrete CPU-plus-NPU would have doubled the PCB footprint. The integrated CPM let one BOM serve both data and control paths, simplifying qualification in long-lifecycle defense programs.
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Legacy Protocol Converter / Gateway
Protocol-conversion gateways that bridge legacy fieldbus or serial protocols to Ethernet used the MPC860DPVR80D4 as the central controller because its CPM handled the legacy serial side and the integrated Ethernet MAC handled the IP side concurrently. With the PowerPC core running the conversion logic at 80 MHz, a single chip could replace a multi-IC gateway, reducing power draw and PCB cost in industrial gateway appliances. The 357-PBGA's signal count accommodates PHY, SDRAM, flash, dual UARTs, and an HDLC link without external glue logic, keeping the gateway BOM small enough for DIN-rail enclosures typical of industrial Ethernet gateways.
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Long-Lifecycle Defense / Aerospace Avionics Subsystems
Defense and aerospace programs with multi-decade field-life requirements leveraged the MPC860DPVR80D4's mature PowerPC architecture, deterministic CPM, and stable supply chain as a baseline for line-replaceable units and retrofit subsystems. The 357-PBGA package's mechanical robustness and the device's documented operating margins made it suitable for qualification under MIL-STD-810 environmental programs. While new aerospace designs now target newer Freescale/NXP QorIQ-class devices, the MPC860DPVR80D4 remains in active sustainment for legacy platforms, and its Rochester Electronics stock listing reflects demand from these long-lifecycle programs.
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추천 제품 요약
엔지니어링 참조 데이터: MPC860DPVR80D4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC860DPVR66D4 | MPC860DTZQ80D4 | MPC860PVR80D4R2 | MPC866PCVR100A | KMPC860TVR80D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Architecture | PowerPC MPC8xx (32-bit) | PowerPC MPC8xx (32-bit) | PowerPC MPC8xx (32-bit) | PowerPC MPC8xx (32-bit) | PowerPC MPC8xx (32-bit) | PowerPC MPC8xx (32-bit) |
| Core Clock Frequency | 80 MHz | 66 MHz (-18%) | 80 MHz (same) | 80 MHz (same) | 100 MHz (+25%) | 80 MHz (same) |
| Manufacturing Process | 0.32 micron CMOS | 0.32 micron CMOS | 0.32 micron CMOS | 0.32 micron CMOS | 0.25 micron CMOS | 0.32 micron CMOS |
| CPM (Communications Processor Module) | Yes (HDLC/UART/Ethernet) | Yes (HDLC/UART/Ethernet) | Yes (configuration varies by feature-set suffix) | Yes | Yes (enhanced CPM) | Yes |
| Family Feature-Suffix | DP (with integrated CPM + peripherals) | DP | DT/ZQ | PVR (non-DP feature set) | MPC866 PC | TV |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Obsolete / EOL | Last Time Buy |
주요 차별점
- 80 MHz core in the DP feature-set suffix (vs MPC860DPVR66D4)
- DP feature-set suffix with full CPM (vs MPC860PVR80D4R2)
- Same 357-PBGA as MPC866 family successor (vs MPC866PCVR100A)
설계 노트
Estimated: The 357-PBGA package at 80 MHz on a 0.32 micron process typically dissipates 1.5 to 2.5 W depending on CPM and I/O activity. Without an exposed thermal pad, layout must provide adequate copper pour on inner PCB layers for heat spreading and to keep junction temperature within industrial or extended-temperature operating limits. Confirm thermal margin against the official datasheet's thermal-resistance model for the specific PBGA stack-up before finalizing the PCB.
The 357-ball PBGA at 25 x 25 mm has 1.27 mm or 1.0 mm ball pitch (verify per device stack-up); PCB design requires microvia stack-ups with 4-6 routing layers to break out the dense BGA inner-ring signals. Match the impedance-controlled SDRAM bus (typically 50 ohm single-ended) per NXP application note; route clock and strobes first, length-matched within the tolerance specified in the MPC860 family datasheet.
Do not assume cross-family MPC860 PBGA ball-maps are identical. Even when the package outline is the same 357-ball 25 x 25 mm, the DP / DT / PC / TV suffixes can move specific balls. Per the ETEI comparison resources cited in our web research, MPC860DTZQ80D4 vs MPC860DPVR80D4 differences include ball-map shifts; verifying against the per-device datasheet before PCB layout close-out avoids a re-spin.
Place SDRAM as close to the MPC860DPVR80D4 as the BGA break-out permits (typically within 25 mm of the die), and add bulk decoupling (10 uF) plus high-frequency decoupling (0.1 uF + 1 nF) on every power pin to suppress CPM-induced switching noise that can couple into the analog PLL supply and degrade serial-channel timing margins. Estimate: per-pin decoupling budget ~ one 0.1 uF + one 10 uF per 4-6 power pins.
규정 준수 정보
Ball-finish 'D4' suffix on PowerQUICC MPC860 family denotes leaded (SnPb) balls per NXP's historical ball-finish convention, making this part non-RoHS-compliant. REACH compliance follows the underlying material declarations on the NXP product page. AEC-Q100 is not applicable for a non-automotive-grade industrial/networking MPU.
