MSC8122VT8000 - Quad SC140 DSP, 500MHz, 431-FCBGA | NXP
부품 번호: MSC8122VT8000 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $180.08 | $180.08 |
| 10 | $165.5 | $1,655.00 |
| 100 | $145 | $14,500.00 |
| 500 | $130 | $65,000.00 |
| 1,000 | $120 | $120,000.00 |
MSC8122VT8000 개요
A digital signal processor (DSP) is a specialized microprocessor optimized for numeric-intensive, real-time signal-processing workloads such as audio/video codecs, baseband demodulation, and packet inspection. SC140 is a fixed-point VLIW architecture from the StarCore family, distinguished by its four parallel arithmetic units per core and zero-overhead looping; the MSC8122 multiplies that capability by four cores on a single die, putting it in the same broad category as multicore baseband SoCs.
Key features that differentiate the MSC8122VT8000 include its quad-core SC140 fabric at 500 MHz, an aggregate 1436 Kbytes of internal SRAM M1 memory distributed across cores, four TDM serial interfaces for multi-channel telecom audio, an on-chip Ethernet MAC, and a hardware system interface unit for external memory and host control. The 431-FCBGA package exposes a 64-bit external memory bus plus dedicated TDM, Ethernet, RS-232, JTAG, and timer pins, allowing designers to keep the part on a single SoC footprint while addressing multi-channel voice, fax, modem, and packet-processing workloads.
Typical applications include 4-channel V.90 modem banks, multi-channel voice-over-IP (VoIP) gateways, TDM cross-connect systems, media gateway controllers, and packet-voice DSP farms. The wide peripheral mix also makes the device useful in legacy wireless base-station channel cards and software-defined radio (SDR) front-end processing cards where deterministic MIPS budgets are mandatory.
When designing with this device, allocate careful attention to thermal management: the FCBGA package must be mounted on a multilayer PCB with a continuous ground/power plane beneath the die to meet the 500 MHz per-core clock budget. Decoupling should follow the reference design's capacitor count per power rail, and JTAG access must be brought out for boundary-scan and multi-core debug using the SC140-aware toolchain.
드롭인 대체품: MSC8122VT8000 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MSC8122VT8000
✅ 드롭인✓ 재고 있음
$120 / 개
데이터시트 보기 →MSC8122TVT8000
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MSC8122VT8000B
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MSC8122VT8000 최대 정격 & 전기적 특성
| Architecture | StarCore SC140 quad-core (four extended DSP cores) |
| Core Clock Speed | 500 MHz |
| Internal SRAM M1 Memory | 1436 Kbytes total (224 Kbyte per core) |
| Instruction Cache | 16-way 16 Kbyte per core |
| Write Buffer | 4-entry per core |
| External Cache Support | Yes |
| Serial Interface | RS-232 |
| TDM Serial Interfaces | 4 |
| General-Purpose Timers | 32 |
| Ethernet Interface | On-chip Ethernet MAC |
| DMA Controller | Multi-channel DMA |
| System Interface Unit (SIU) | Flexible external memory and host control |
| 패키지 | 431-FCBGA (FC-PBGA) 20x20 mm |
| Bit Size | 16-bit core, 32-bit extended |
MSC8122VT8000 431-fcbga (fc-pbga) 20x20 mm 핀 구성 가이드
MSC8122VT8000(431-fcbga (fc-pbga) 20x20 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MSC8122VT8000.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MSC8122VT8000 적합 용도: 6 애플리케이션s: Multi-Channel V.90 Modem Bank, Voice-over-IP (VoIP) Media Gateway, TDM Cross-Connect / PSTN Switch, Legacy Wireless Base-Station Channel Card, Software-Defined Radio Front-End, Industrial Packet-Inspection Appliance.
Multi-Channel V.90 Modem Bank
The MSC8122VT8000's quad SC140 cores at 500 MHz deliver enough MIPS to run four concurrent V.90 analog modem channels on a single chip. Each core's 224 Kbyte M1 SRAM holds a full DSP image plus per-channel buffers, while the four TDM serial interfaces connect directly to upstream framer/slicer devices. The on-chip Ethernet MAC lets a populated modem card attach to a LAN management plane without a companion NIC. This consolidation eliminates a multi-chip DSP farm in legacy DSLAM or remote-access equipment designs.
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Voice-over-IP (VoIP) Media Gateway
Voice-over-IP media gateways require deterministic per-channel DSP budget for G.711/G.723/G.729 codecs, echo cancellation, and jitter buffering. The MSC8122VT8000's four cores each handle a stack of voice channels while sharing the 1436 Kbyte aggregate M1 SRAM, and its TDM ports interface directly to T1/E1 framers. Ethernet connectivity allows packet-side processing on the same chip. Real-time determinism is preserved because each core has its own instruction cache and write buffer.
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TDM Cross-Connect / PSTN Switch
Public-switched telephone network cross-connects need a high-density timeslot switch fabric with deterministic latency. The MSC8122VT8000's four TDM serial interfaces each carry 32+ timeslots that can be reshuffled under SC140 firmware, while the multi-channel DMA controller offloads buffer management from the cores. System Interface Unit pins support external SRAM/SSRAM for timeslot lookup tables. Designers can cascade multiple MSC8122 chips to scale beyond a single 512-timeslot fabric without an external ASIC.
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Legacy Wireless Base-Station Channel Card
In 2G/3G base-station channel cards, the MSC8122VT8000 runs uplink chip-rate, symbol-rate, and channel decoding DSP on separate SC140 cores with hard real-time guarantees. The 16-way 16 Kbyte instruction cache per core keeps the working set on-chip for deterministic cycle counts, while the Ethernet MAC uplinks decoded MAC frames to the baseband controller. Designers value the FCBGA's compact 20x20 mm footprint for high channel density on a single line card.
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Software-Defined Radio Front-End
Software-defined radio implementations benefit from the MSC8122VT8000's mix of TDM serial interfaces (which can carry digitized IF data from a wideband ADC) and a programmable SC140 core fabric for demodulation chains. Each SC140 core runs an FFT or filter-bank kernel, while the DMA engine keeps data movement off the cores' critical paths. With Ethernet, the demodulated bitstream is forwarded to a host SDR controller. The 431-FCBGA package supports a single-SoC radio front-end per channel.
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Industrial Packet-Inspection Appliance
Packet-inspection appliances and line-rate monitoring probes need per-packet DSP work for flow classification, header compression, and voice/video transcoding. The MSC8122VT8000's four SC140 cores offer enough thread-level parallelism to handle multiple 10/100 Ethernet streams in parallel, with Ethernet MAC plus DMA keeping packet movement off the cores. The 1436 Kbyte aggregate SRAM supports deep flow tables on-chip. The 32 general-purpose timers anchor per-flow scheduling without burdening the cores.
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추천 제품 요약
엔지니어링 참조 데이터: MSC8122VT8000 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MSC8122TVT8000 | MSC8122VT8000B |
|---|---|---|---|
| Brand | NXP Semiconductors (Freescale legacy) | NXP Semiconductors | NXP Semiconductors |
| Package | 431-FCBGA (20x20 mm) | 431-FCBGA (20x20 mm) - same | 431-FCBGA (20x20 mm) - same |
| Architecture | StarCore SC140 quad-core | StarCore SC140 quad-core | StarCore SC140 quad-core |
| Core Clock | 500 MHz per core | 500 MHz per core | 500 MHz per core |
| On-chip SRAM M1 | 1436 Kbyte total (224 Kbyte/core) | 1436 Kbyte total | 1436 Kbyte total |
| TDM Serial Interfaces | 4 | 4 | 4 |
| Ethernet MAC | On-chip | On-chip | On-chip |
| Lifecycle Status | Obsolete | Obsolete (temperature-grade variant) | Obsolete (silicon rev B) |
주요 차별점
- Quad SC140 cores on one die (vs MSC8152SVT1000B)
- On-chip Ethernet MAC (vs MSC8152SVT1000B)
- Four TDM serial interfaces (vs MSC8152SVT1000B)
설계 노트
The 431-FCBGA package dissipates significant heat at 500 MHz quad-core operation. Use a multilayer PCB with continuous ground and power planes beneath the die footprint and follow the reference design's via-in-pad pattern with filled and plated-over vias. Without proper thermal vias and board copper weight, junction temperature will exceed the rated maximum at full load and cause clock-throttling or failure.
Place at least the manufacturer-recommended count of decoupling capacitors directly beneath and adjacent to the FCBGA footprint, with short, wide traces to the balls. Use 0.1 uF and 0.01 uF ceramic capacitors in parallel for high-frequency noise suppression on each power rail (DVDD, CVDD, AVDD, etc.). The JTAG, RESET, and clock pins must be brought out to test points for boundary-scan and emulator access per the datasheet pinout section.
Do not assume the MSC8122VT8000 shares firmware with the MSC815x family - the boot loader and SC140 toolchain are different from the SC3850 toolchain. Verify date code and traceability when sourcing from independent brokers, as counterfeits of obsolete Freescale DSPs are common in the secondary market. Also note that lifecycle status is obsolete; plan for last-time-buy plus aftermarket inventory before committing to a new design.
The 64-bit external memory bus and TDM serial interfaces can exhibit ringing on long PCB traces. Maintain 50 ohm controlled-impedance routing for the memory bus and use length-matched differential pairs for the TDM clock and frame-sync lines. Add source-series termination on heavily-loaded address and data lines if the reference design's terminator count is insufficient for the chosen PCB stack-up.
규정 준수 정보
RoHS/REACH/lead-free status not present in Verified Web Data; classified as unknown per Data Authenticity Rule. AEC-Q100 not applicable (telecom/industrial DSP SoC).
