Texas Instruments

MSP430G2553CY - 16MHz 16KB Flash Mixed-Signal MCU | TI

부품 번호: MSP430G2553CY ✓ 활성
3.3 V to 3.6 V Vdss 0.1 µA Id QFN-32 family Package 16 MHz Speed 16 KB Memory
MOQ: 1 |

MSP430G2553CY 개요

Texas Instruments MSP430G2553CY is a 16-bit mixed-signal microcontroller operating at 16 MHz, with 16 KB of Flash memory and 512 bytes of SRAM. The device combines a comparator, timers, UART, SPI, and I2C interfaces in a 32-pin QFN package. The supplied ordering information identifies this orderable MPN as a die-sale device, so package-specific mechanical details and production procurement terms must be confirmed with TI before assembly.

A mixed-signal microcontroller is an embedded semiconductor that combines a programmable digital controller with analog or sensing functions. In the product hierarchy, this MSP430 belongs to the microcontroller, embedded processor, semiconductor, and mixed-signal controller classes. Its 16-bit MSP430 CPU architecture makes it suitable for compact control systems requiring low power, deterministic peripheral access, and several communication interfaces without a separate analog processor.

The verified device information identifies a 16 MHz operating speed, 16 KB Flash, 512 B SRAM, one comparator, UART/SPI/I2C connectivity, and timers. DigChip additionally lists 24 I/O ports, a 3.3 V to 3.6 V supply range, and a 0.1 µA off-mode current with RAM retention. These figures position MSP430G2553CY for low-power sensing, control, instrumentation, and communications designs where memory and integrated interfaces are more important than high-speed digital processing.

The MSP430G2xx family architecture is oriented toward low-power embedded control. Its integrated comparator supports threshold-based sensing, while UART, SPI, and I2C support connections to sensors, displays, transceivers, and external nonvolatile memory. The timer resources can provide event timing and periodic service functions, but individual timer channels, capture/compare resources, and interrupt assignments must be selected from the MSP430G2x53 datasheet for the exact die.

Typical applications include battery-powered sensor nodes, compact industrial monitors, digital thermometers, environmental measurement systems, motor or actuator controllers, and simple serial gateways. For a new PCB, the CY suffix and die-sale status require careful review: developers should not assume that the QFN-32 package information found in generic listings corresponds to the CY deliverable. Board assembly may instead require the documented die-sale process, bonding method, and package outline.

Before layout, confirm the exact pin assignment and exposed-pad requirements in the official MSP430G2x53 datasheet and with TI. Program development commonly uses an MSP430-compatible toolchain, but the verified data does not identify a specific IDE version, debugger, or programming adapter. Power, ground, decoupling, reset, boot-strapping, communication, and exposed-pad connections should therefore follow the authoritative device documentation rather than generic QFN assumptions.

This page consolidates verified manufacturer and distributor information, separates die-sale ordering facts from generic family specifications, and identifies unresolved package, pricing, pinout, lifecycle, and compliance details instead of guessing. It is intended as an engineering-data starting point for MSP430G2553CY sourcing and design review, not as a substitute for TI's final orderable datasheet and quality documentation.

드롭인 대체품: MSP430G2553CY — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 제품에는 사용 가능한 드롭인 대체품이 없습니다.

대체품 요청

MSP430G2553CY 최대 정격 & 전기적 특성

Product Type 16-bit mixed-signal microcontroller
CPU Architecture MSP430 RISC
Maximum Clock Speed 16 MHz
Flash Memory 16 KB
SRAM 512 bytes
Integrated Comparator 1 comparator
Serial Interfaces UART, SPI, and I2C
Timer Support Timer resources
I/O Ports 24 ports
공급 전압 3.3 V to 3.6 V
Maximum Supply Voltage 3.6 V
Off-Mode Current with RAM Retention 0.1 µA
Package Family QFN-32 family
실장 유형 Surface mount
Orderable Form Die sale
Operating Range Industrial

MSP430G2553CY qfn-32 family 핀 구성 가이드

MSP430G2553CY(qfn-32 family 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.

MSP430G2553CY의 qfn-32 family 패키지 핀아웃 다이어그램

다음에 대한 상세 핀아웃 데이터 없음: MSP430G2553CY.

다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.

일반적인 애플리케이션

MSP430G2553CY 적합 용도: 7 애플리케이션s: Battery-Powered Sensor Node, Digital Thermometer and Threshold Monitor, Compact Industrial Data Logger, Simple Actuator and Motor Controller, SPI Master Data Acquisition, Serial Configuration Bridge, Low-Power Environmental Monitor.

🧩

Battery-Powered Sensor Node

MSP430G2553CY fits a compact sensing node that periodically reads an analog signal, evaluates it against the integrated comparator, and transmits the result through UART, SPI, or I2C. Its 16 MHz MSP430 CPU provides timing for acquisition and protocol handling, while 16 KB Flash stores firmware and 512 bytes of SRAM supports short working buffers. The reported 0.1 µA off-mode current with RAM retention can help preserve state between measurements, although final battery life depends on the exact CY limits, sensor current, wake interval, and radio duty cycle.

🌡️

Digital Thermometer and Threshold Monitor

The MSP430G2553CY can supervise a resistive, semiconductor, or external sensor when the measured level must be compared with a threshold. Its integrated comparator supports a low-overhead decision path, while the 16-bit CPU can apply filtering, calibration, hysteresis, and offset correction. The 24 reported I/O ports provide flexible connections for sensor excitation, display control, and status indicators. For accurate results, follow the official family electrical guidance and obtain CY-specific limits because the verified data does not identify comparator timing or input-range details.

🏭

Compact Industrial Data Logger

MSP430G2553CY can serve as the control core for a compact logger that samples sensors, timestamps events, stores state, and forwards records through a serial link. Its 512 bytes of SRAM are sufficient for small control and packet buffers, while 16 KB Flash holds application firmware; larger nonvolatile histories require external SPI flash or another storage device. UART is useful for a local host, and I2C or SPI can connect sensors and memories. Production design work must reserve I2C pull-ups and verify bus voltage against the confirmed CY device limits.

🔧

Simple Actuator and Motor Controller

The MSP430G2553CY can coordinate a small actuator or motor subsystem by generating timing signals, reading feedback, enforcing limits, and reporting status. Its timers support periodic control tasks, and the comparator can monitor a feedback signal near a threshold. UART or SPI can connect to a host or power stage, while the 24 reported I/O ports provide discrete control and sensing lines. Because the verified information does not specify PWM channels, pin multiplexing, or absolute output limits, pin assignment and drive-current checks must use the exact MSP430G2x53 and CY documentation before power devices are connected.

📟

SPI Master Data Acquisition

MSP430G2553CY can act as an SPI master for sensors, ADCs, displays, and nonvolatile memory, using its 16 MHz CPU to organize transactions and process returned data. The UART interface can provide a separate debug or configuration channel, reducing contention with the SPI bus. Firmware can implement chip-select timing, DMA-like event handling with interrupts, and fault recovery based on the family peripherals. Engineers must verify the exact CY pin mux, maximum SPI clock, and electrical limits before relying on a specific bus rate or peripheral arrangement.

🌐

Serial Configuration Bridge

MSP430G2553CY can bridge a legacy local bus to a higher-level controller by translating commands between UART and SPI or I2C peripherals. Its small memory footprint suits protocol conversion, device discovery, register polling, and status aggregation, while the comparator can monitor an external fault signal. The design can sleep between transactions to reduce power and wake through an interrupt-capable interface. Firmware should include protocol timeouts, CRC checking where applicable, bus contention handling, and recovery logic because peripheral multiplexing and wake-capable pins require exact CY validation.

🌡️

Low-Power Environmental Monitor

MSP430G2553CY can supervise temperature, humidity, light, or gas sensing in a compact environmental monitor. The controller can wake periodically, power or interrogate a sensor, perform threshold decisions, and publish a result through UART, SPI, or I2C. Its 16-bit CPU supports calibration tables and digital filtering, while 512 bytes of SRAM is adequate for bounded measurement buffers. Reported 0.1 µA off-mode current with RAM retention is favorable for duty-cycled operation, but total energy per sample must include sensor, interface, and regulator overhead verified for the complete system.

What is the MSP430G2553CY?
The MSP430G2553CY is a Texas Instruments 16-bit mixed-signal microcontroller rated at 16 MHz, with 16 KB of Flash and 512 bytes of SRAM. According to the Texas Instruments product page, it integrates a comparator, timers, UART, SPI, and I2C. Distributor records identify MSP430G2553CY specifically as a die-sale orderable version, so its assembly and final package must be confirmed before use in a PCB design.
Where can I download the MSP430G2553 datasheet PDF?
The official MSP430G2553-family datasheet PDF is available from Texas Instruments at https://www.ti.com/lit/ds/symlink/msp430g2553.pdf. It is the preferred document for CPU, memory, peripherals, electrical limits, and package information. Because MSP430G2553CY is listed as a die-sale part, engineers should also contact TI for the exact CY bonding, pin-assignment, quality, and assembly requirements.
How much does MSP430G2553CY cost?
The only verified unit price supplied for MSP430G2553CY is $1.5191 as of 2026-10-22, shown by Heisener for 5,248 pieces. Because the source does not provide verified prices at quantities 1, 10, 100, 500, or 1000, this page repeats the quoted unit price only as a neutral tier placeholder and does not claim volume pricing. Request a quotation for production quantities and die handling.
Is MSP430G2553CY in stock and what is its lead time?
Heisener listed 5,248 pieces and stated “lead time to be confirmed” as of 2026-10-22, making stock and schedule uncertain. DigiKey’s result says “ships today,” but that statement does not provide a guaranteed quantity or standardized lead time for this die-sale MPN. Contact the selected authorized distributor or TI to confirm allocation, wafer condition, assembly capacity, and the current lead time before placing a production order.
Where can I buy MSP430G2553CY online?
MSP430G2553CY can be investigated through Texas Instruments and listed distributors including DigiKey, Mouser, and Heisener. The verified Heisener listing reported 5,248 pieces at $1.5191 each as of 2026-10-22, while DigiKey exposes a marketplace listing for the same die-sale MPN. Because die-sale inventory is specialized and lead time may be unconfirmed, request written stock confirmation and a production quotation before purchase.
What are the key specifications engineers should know about MSP430G2553CY?
MSP430G2553CY combines a 16-bit MSP430 RISC core running at 16 MHz with 16 KB of Flash, 512 bytes of SRAM, and 24 I/O ports. Texas Instruments also identifies one comparator, timers, UART, SPI, and I2C connectivity. DigChip reports a 3.3 V to 3.6 V supply range and 0.1 µA off-mode current with RAM retention, but the CY orderable is a die sale rather than a confirmed QFN-32 retail package.
What can replace MSP430G2553CY with a true drop-in part?
No verified true drop-in replacement for MSP430G2553CY was found in the supplied cross-reference results. A substitute must match the exact die or assembly interface, pin functions, memory map, peripheral resources, voltage limits, timing, programming model, and footprint; merely matching 16 MHz and 16 KB Flash is insufficient. Because MSP430G2553CY is sold as a die, contact TI for an authoritative pin-compatible or assembly-compatible source before considering any alternative.
Is MSP430G2553CY the same as MSP430G2553?
MSP430G2553CY belongs to the MSP430G2553 family, but its verified distributor ordering code identifies it as a die-sale part rather than a normal packaged-device code. The official family datasheet covers the common MSP430G2x53 architecture, yet the CY deliverable may have different bonding or assembly conditions. Obtain TI confirmation before treating the CY MPN and a packaged MSP430G2553 variant as electrically and mechanically interchangeable.
Is MSP430G2553CY suitable for a low-power sensor node?
MSP430G2553CY is suitable in principle for low-power sensor nodes because its family combines a 16 MHz MSP430 controller with 512 bytes of SRAM, a comparator, timers, and low-power modes. DigChip reports 0.1 µA off-mode current with RAM retention. Final suitability depends on the exact CY electrical limits, sensor interface, duty cycle, and power-budget calculations, none of which can be completed safely without the TI-controlled die documentation.
MSP430G2553CY vs MSP430G2452: which MCU should be selected?
MSP430G2553CY provides 16 KB Flash, 512 bytes of SRAM, a 16 MHz maximum clock, a comparator, UART/SPI/I2C, and more I/O than MSP430G2452 according to the supplied TI discussion. MSP430G2452 may be less expensive, while MSP430G2553CY provides more memory and resources. They are not verified as pin-to-pin drop-ins, so software, peripheral, package, and PCB differences must be reviewed before substitution.
When should I choose MSP430G2553CY over another MSP430 device?
Choose MSP430G2553CY when a design needs the verified combination of a 16 MHz MSP430 CPU, 16 KB Flash, 512 bytes of SRAM, a comparator, UART, SPI, I2C, timers, and 24 I/O ports. It is especially relevant when a die-sale procurement model is acceptable. Do not select it for a conventional SMT prototype until TI confirms the CY die interface, bonding method, and assembly requirements.
What is the MSP430G2553CY pinout?
The verified CY pinout is not publicly available in the supplied data. Generic search results describe an MSP430G2553 family QFN-32 package, but MSP430G2553CY is explicitly a die-sale orderable and must not inherit that package pinout by assumption. The pinout is therefore marked unknown pending TI-provided CY die or assembly documentation; using the generic QFN-32 drawing could produce an unsafe or nonfunctional assembly.
What programming tools are compatible with MSP430G2553CY?
MSP430G2553CY should be programmed through tooling compatible with the MSP430 CPU and the exact TI-supported programming interface, but the verified data does not identify a specific IDE, compiler version, debugger, or adapter. Do not assume that a standard LaunchPad programming header matches the CY die. Confirm the supported programming fixture, target voltage, isolation requirements, and flash-loading procedure with TI or an authorized programming specialist.
Does MSP430G2553CY comply with RoHS, REACH, or AEC-Q100?
The verified data does not explicitly state RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 status for MSP430G2553CY, so compliance remains unknown. Do not infer compliance from the industrial temperature description or the MSP430 family name. Request the current material declaration, qualification report, and product-change notices from TI for the exact die-sale orderable.
Why does MSP430G2553CY require careful PCB planning?
MSP430G2553CY is a die-sale component, so the generic QFN-32 family package cannot be treated as its confirmed physical form. PCB planning must account for the TI-approved die dimensions, pad or bond-wire interface, assembly process, exposed thermal path if applicable, and production test access. The supplied data omits those mechanical values; obtain them from TI before routing, footprint creation, or sourcing assembly services.

엔지니어링 참조 데이터: MSP430G2553CY — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose MSP430G2553CY when a low-power embedded design benefits from a 16 MHz 16-bit MSP430 core, 16 KB Flash, 512 bytes of SRAM, 24 reported I/O ports, an integrated comparator, timers, and UART/SPI/I2C connectivity. It is especially relevant when the procurement model explicitly supports a TI die sale and the assembler can work from controlled assembly documentation. Do not choose it for a conventional QFN-32 prototype until TI confirms the CY pinout, mechanical interface, and bonding process. MSP430G2452 may suit a lower-cost design that does not need the additional memory and resources, but it is not verified as a drop-in replacement. Other MSP430 or competitor MCUs should be considered only after software, peripheral, voltage, timing, pin, package, and lifecycle requirements are matched. No verified drop-in alternatives were found, so any substitution should begin with an authoritative TI cross-reference rather than distributor similarity results.

대체품과의 비교

파라미터 이 제품
Brand Texas Instruments
Package Die sale; physical dimensions require TI confirmation
CPU Architecture 16-bit MSP430 RISC
Maximum Clock Speed 16 MHz
Flash Memory 16 KB
SRAM 512 bytes
Comparator 1 comparator
Serial Interfaces UART, SPI, and I2C
I/O Ports 24 ports
Supply Voltage 3.3 V to 3.6 V
Off-Mode Current with RAM Retention 0.1 µA
Orderable Form Die sale
Verified Unit Price as of 2026-10-22 $1.5191 at Heisener quantity 5,248

주요 차별점

  • Verified MSP430G2553CY procurement identity (vs Generic packaged MSP430G2553 listings)
  • Integrated mixed-signal resources (vs Minimal general-purpose MCUs without an integrated comparator)
  • Multiple onboard serial peripherals (vs Single-interface low-end controllers)
  • Memory and I/O balance (vs MSP430G2452 discussed in the supplied TI forum result)

설계 노트

Do not create a footprint from the generic MSP430G2553 QFN-32 information. MSP430G2553CY is identified as a die sale, so obtain the controlled die dimensions, pad or bonding interface, die orientation, and assembly process from TI. The confirmed mechanical definition must precede PCB layout and production release because a family-package drawing may not represent the CY deliverable.

Use the verified 3.3 V to 3.6 V supply indication only as a family-level planning value until CY-specific limits are confirmed. Place local supply decoupling at the final package or bond interface, provide a clean return path, and size external components for the actual clock and bus loads. Avoid assuming that adjacent MSP430 devices have identical absolute-maximum ratings or power-up behavior.

A common design error is treating MSP430G2553CY as a packaged MSP430G2553. The verified ordering record says die sale, and generic listings mention QFN-32, but neither proves pin compatibility with that package. Another error is substituting another MSP430 based only on 16 MHz and 16 KB Flash; RAM, comparator resources, timers, pin mux, interrupt vectors, and assembly interface must also match.

Confirm which pins support UART, SPI, I2C, comparator inputs, timer capture/compare, interrupts, reset, and debug functions before assigning board signals. Keep sensitive comparator and sensor routes short, maintain continuous ground references, and isolate switching-converter paths from low-level analog inputs. These practices remain important even though the verified data does not provide a CY-specific recommended PCB layout.

For a duty-cycled design, begin the battery budget with the reported 0.1 µA off-mode current with RAM retention, but do not treat it as total system sleep current. Sensor leakage, pull resistors, interface state, regulators, and external memories may dominate consumption. Measure the assembled system across temperature and supply voltage after confirming the electrical limits for the exact die-sale lot.

규정 준수 정보

RoHS
Unknown
REACH
Unknown
AEC-Q100
Unknown
무연
Unknown
무할로겐
Unknown
분쟁 광물
Unknown

The supplied verified data does not explicitly state compliance status for MSP430G2553CY. Obtain current declarations and qualification documents from Texas Instruments for the exact die-sale orderable.

데이터 검증일: 2026-10-22 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Texas Instruments MSP430G2553CY MSP430G2553 MSP430G2x53 MSP430G2452 MSP430 CPU16 mixed-signal microcontroller embedded microcontroller 16-bit RISC 16 MHz 16 KB Flash 512-byte SRAM UART SPI I2C integrated comparator timer low-power mode die sale QFN-32 family battery-powered sensor node industrial data logger serial communication
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