MTA18ASF2G72PZ-2G6E1 - 16GB DDR4-2666 ECC RDIMM | Micron
부품 번호: MTA18ASF2G72PZ-2G6E1 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $89.5 | $89.50 |
| 10 | $82 | $820.00 |
| 100 | $74.5 | $7,450.00 |
| 500 | $68 | $34,000.00 |
| 1,000 | $62.5 | $62,500.00 |
MTA18ASF2G72PZ-2G6E1 개요
A DDR4 RDIMM is a type of registered dual in-line memory module that places a register buffer between the DRAM chips and the memory controller, reducing the electrical load on the controller and enabling higher capacity and reliability per channel. Within the broader hierarchy, RDIMMs belong to the DRAM module category, which itself falls under memory modules, memory ICs, and ultimately semiconductors. RDIMMs are the standard memory form for two-socket and four-socket x86 servers, where ECC and registered buffering are required for data integrity and platform stability.
The MTA18ASF2G72PZ-2G6E1 features on-module thermal sensors, parity checking on command/address signals through the register, and 1.2 V operation that reduces module power by approximately 20% versus DDR3 LRDIMMs. The x4 data organization maximizes error-correction granularity, allowing single-bit correctable errors to be detected and fixed without affecting adjacent data lanes. Rank count and organization make this module compatible with platforms validated for 16 GB 1Rx4 DDR4-2666 RDIMMs.
Typical applications include HPE ProLiant Gen10 servers such as the BL460c, DL160, DL180, and DL325 platforms, virtualization hosts running VMware ESXi or Hyper-V, in-memory database servers for SAP HANA or Redis Enterprise, and high-performance computing nodes. The 2666 MT/s speed and ECC support make it well-suited for transactional database workloads where predictable latency and data integrity are critical.
When deploying this module, ensure the server platform supports 1Rx4 16 GB DDR4-2666 RDIMMs at the rated speed; some older platforms will down-clock to 2400 MT/s. Always populate identical MPNs per memory channel to avoid mixed-rank compatibility issues. Given its obsolete status per Micron, designers should verify long-term availability before specifying this part in new designs.
드롭인 대체품: MTA18ASF2G72PZ-2G6E1 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MTA18ASF2G72PZ-2G6
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTA18ASF2G72PZ-2G6D1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTA18ASF2G72PZ-2G6H1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTA18ASF2G72PZ-2G6J1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTA18ASF2G72PZ-3G2E1
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTA18ASF2G72PZ-2G6E1 최대 정격 & 전기적 특성
| 메모리 유형 | DDR4 SDRAM |
| Module Type | RDIMM (Registered DIMM) with ECC |
| Capacity | 16 GB |
| Speed Grade | DDR4-2666 (PC4-21300) |
| 데이터 속도 | 2666 MT/s |
| CAS 레이턴시 | CL19 |
| Rank Configuration | 1Rx4 (Single Rank x4) |
| Operating Voltage (VDD) | 1.2 V |
| 핀 수 | 288 pins |
| Form Factor | RDIMM |
| ECC Support | Yes (ECC Registered) |
| 동작 온도 | 0C to +85C (server grade) |
| Height | 31.25 mm (standard RDIMM) |
| RoHS 상태 | Compliant |
| Lead-Free | Yes |
| 할로겐 프리 | Yes |
| Thermal Sensor | Yes (on-module TSOD) |
| Register Buffer | Yes |
| 수명 주기 상태 | Obsolete (per Micron obsolete RDIMM catalog) |
MTA18ASF2G72PZ-2G6E1 standard 핀 구성 가이드
MTA18ASF2G72PZ-2G6E1(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MTA18ASF2G72PZ-2G6E1.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MTA18ASF2G72PZ-2G6E1 적합 용도: 6 애플리케이션s: HPE ProLiant Gen10 Server Memory Upgrade, Virtualization and Cloud Server Memory, In-Memory Database Server, High-Performance Computing (HPC) Node, Enterprise Storage Server Memory, AI Inference Server Memory.
HPE ProLiant Gen10 Server Memory Upgrade
The MTA18ASF2G72PZ-2G6E1 16 GB 1Rx4 DDR4-2666 RDIMM is a validated memory option for HPE ProLiant BL460c Gen10, DL160 Gen10, DL180 Gen10, and DL325 Gen10 servers per the vendor cross-reference (HPE equivalent P/N 864707-591). The 2666 MT/s data rate and ECC Registered design meet HPE's ProLiant Gen10 memory population rules, supporting configurations up to 768 GB per socket in supported platforms. The 1Rx4 organization maximizes error-correction granularity for virtualization hosts running VMware ESXi or Microsoft Hyper-V workloads where single-bit correctable errors must be detected without impacting adjacent memory lanes.
추천
Virtualization and Cloud Server Memory
The MTA18ASF2G72PZ-2G6E1 delivers 16 GB of ECC Registered DDR4-2666 capacity per module, making it well-suited for hypervisor hosts running 50-100 virtual machines per socket. The registered buffer reduces the electrical load on the memory controller, enabling higher density per channel (typically up to 6 DIMMs per channel on Gen10 platforms) compared to unbuffered modules. ECC corrects single-bit errors caused by cosmic ray-induced soft errors in dense memory arrays, which become statistically significant at datacenter scale. Compared to consumer UDIMMs, the registered design trades slightly higher latency for substantially higher supported capacity.
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In-Memory Database Server
The MTA18ASF2G72PZ-2G6E1's combination of 2666 MT/s bandwidth (21.3 GB/s peak per module), CL19 latency, and ECC error correction makes it suitable for in-memory database workloads such as SAP HANA, Redis Enterprise, and Memcached clusters. In-memory databases are particularly sensitive to memory errors since all committed transactions reside in DRAM until checkpointed; a single-bit error that escapes detection can corrupt database pages. The 1Rx4 x4 organization maximizes the effectiveness of ECC by allowing correction granularity down to 4-bit nibbles. Populating 12-16 of these modules per server delivers 192-256 GB of fault-tolerant memory.
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High-Performance Computing (HPC) Node
The MTA18ASF2G72PZ-2G6E1 supports HPC cluster nodes where predictable memory bandwidth and ECC are required for scientific simulation, CFD, and computational chemistry workloads. The registered DIMM topology reduces signal integrity issues across heavily-populated memory channels, allowing stable operation in dense 2-socket nodes with 8-12 DIMMs per socket. The 1.2 V VDD reduces module power consumption versus DDR3 LRDIMMs by approximately 20%, which becomes a meaningful datacenter operational expense at scale. For tightly-coupled MPI workloads, the consistent CL19 latency profile simplifies performance modeling and tuning.
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Enterprise Storage Server Memory
The MTA18ASF2G72PZ-2G6E1 is appropriate for enterprise storage controllers and storage virtualization appliances where write caching, deduplication metadata, and ZFS intent logs must remain in DRAM for low-latency response. ECC Registered memory is mandatory in this application class because storage metadata corruption can cause silent data loss across entire pools. The 16 GB capacity per module allows economical scaling to the 128-256 GB cache footprints typical of mid-range SAN controllers. The 288-pin JEDEC-standard form factor ensures broad compatibility across storage OEMs.
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AI Inference Server Memory
The MTA18ASF2G72PZ-2G6E1 16 GB DDR4-2666 RDIMM supports AI inference servers running image classification, NLP, and recommendation workloads on CPUs, where large memory pools hold model weights and feature embeddings. While GPU-attached HBM or GDDR memory holds the hot inference tensors, the host CPU memory typically holds pre-processing buffers, batch aggregation, and intermediate results that benefit from ECC. The 1.2 V operation keeps per-server power within typical 2P server thermal envelopes even when populated with 16+ modules. The registered buffer enables stable operation at high DIMM counts needed for large embedding tables.
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추천 제품 요약
엔지니어링 참조 데이터: MTA18ASF2G72PZ-2G6E1 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MTA18ASF2G72PZ-2G6 | MTA18ASF2G72PZ-2G6D1 | MTA18ASF2G72PZ-2G6H1 | MTA18ASF2G72PZ-2G6J1 | MTA18ASF2G72PZ-3G2E1 |
|---|---|---|---|---|---|---|
| Package | 288-pin RDIMM | 288-pin RDIMM | 288-pin RDIMM | 288-pin RDIMM | 288-pin RDIMM | 288-pin RDIMM |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| Capacity | 16 GB | 16 GB | 16 GB | 16 GB | 16 GB | 16 GB |
| Speed Grade | DDR4-2666 | DDR4-2666 | DDR4-2666 | DDR4-2666 | DDR4-2666 | DDR4-3200 |
| Rank Configuration | 1Rx4 | 1Rx4 | 1Rx4 | 1Rx4 | 1Rx4 | 1Rx4 |
| Module Type | ECC Registered RDIMM | ECC Registered RDIMM | ECC Registered RDIMM | ECC Registered RDIMM | ECC Registered RDIMM | ECC Registered RDIMM |
| Voltage (VDD) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| CAS Latency | CL19 | CL19 | CL19 | CL19 | CL19 | CL22 |
주요 차별점
- Micron original manufacturer with full datasheet traceability (vs Aftermarket A-Tech compatible module)
- Highest speed at same 1Rx4 capacity (vs MTA18ASF2G72PZ-3G2E1 (DDR4-3200))
- Single-rank x4 organization (vs MTA18ASF2G72PDZ-2G6E1 (2Rx8 dual-rank))
설계 노트
Mixing 1Rx4 and 2Rx8 modules in the same memory channel can cause platform POST failures or down-clocking. The MTA18ASF2G72PZ-2G6E1 is 1Rx4 - do NOT mix with the 2Rx8 variant MTA18ASF2G72PDZ-2G6E1 in the same channel. Always populate identical MPNs per channel or strictly follow the platform memory population guide. Even within the same Micron family, different rank organizations can trigger incompatible SPD profiles that prevent the memory controller from initializing all channels at full speed.
DDR4 RDIMMs operate within a 0C to 85C ambient specification, but densely populated server chassis can push DIMM temperatures higher. The MTA18ASF2G72PZ-2G6E1 includes an on-module thermal sensor (TSOD) that platform BMCs read via the I2C/SMBus interface to throttle fan curves. Ensure your chassis provides adequate front-to-back airflow across all DIMM slots; a 2U chassis typically supports higher DIMM counts than 1U at acceptable thermal margins. Estimated: 8 DIMMs at full 1.2 V and active read/write bandwidth dissipate approximately 5 W per module.
The MTA18ASF2G72PZ-2G6E1 is a JEDEC-standard 288-pin RDIMM with a single key notch position matching DDR4. There is no PCB design work for the end user - the module plugs into the platform DIMM socket. However, when validating a new server platform, ensure the motherboard's SPD EEPROM correctly identifies this module's 1Rx4 rank organization. Mis-programmed SPD data is a common cause of intermittent boot failures that look like hardware defects. Refer to Micron's RDIMM Core Data Sheet for the canonical SPD contents.
규정 준수 정보
JEDEC DDR4 standard compliant. RoHS and REACH compliance per Micron product declaration. AEC-Q100 not applicable for server DRAM modules.
