MTFDKCC15T3TGH-1BC1ZABYY-TR - 15.36TB PCIe Gen4 U.3 SSD | Micron
부품 번호: MTFDKCC15T3TGH-1BC1ZABYY-TR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $3450 | $3,450.00 |
| 10 | $3280 | $32,800.00 |
| 50 | $3120 | $156,000.00 |
| 100 | $2990 | $299,000.00 |
| 500 | $2790 | $1,395,000.00 |
MTFDKCC15T3TGH-1BC1ZABYY-TR 개요
An enterprise NVMe SSD is a high-performance, low-latency non-volatile storage device built around the NVMe (Non-Volatile Memory Express) protocol over a PCIe interface, designed to replace SAS/SATA SSDs in hyperscale and tier-1 server platforms. Within the storage hierarchy it sits between DRAM (volatile cache) and HDD cold storage (bulk capacity), and within the broader taxonomy it belongs to: SSD -> solid-state storage -> data-center storage -> enterprise IT infrastructure. U.3 (formerly SFF-TA-1001) is the universal backplane form factor that accepts NVMe PCIe, SAS, and SATA drives in the same 2.5-inch bay, simplifying mixed-protocol chassis design.
Key features of the 9400 PRO 15.36 TB include Micron's 176-layer TLC NAND, a Gen4 x4 NVMe 1.4 interface delivering up to 7.0 GB/s sequential read and 7.0 GB/s sequential write, up to 1.6M IOPS random read (4 KB), and on-drive capacitors for power-loss protection (PLP). AES-256 hardware encryption and end-to-end data path protection are standard, and the drive carries a 5-year limited warranty with MTBF ratings typical of the 9400 family.
The 9400 PRO platform uses Micron's proprietary controller and firmware tuned for read-intensive service profiles such as content delivery, AI/ML training data lakes, large-object analytics, and boot/scratch virtualization. Compared to the 9400 MAX family (mixed-use, 3 DWPD), the PRO tier offers the same capacity envelope and interface but at lower write endurance, lowering $/GB for read-heavy workloads.
Typical deployments include hyperscale virtualization, AI/ML training data staging, large-scale NoSQL and analytics clusters, software-defined storage nodes, and high-density read-cache tiers. The 15 mm Z-height fits standard 2.5-inch U.3 backplanes used in Dell PowerEdge, HPE ProLiant, and Supermicro platforms.
When integrating this drive, validate backplane support for U.3 NVMe PCIe Gen4, ensure host platform NVMe driver compatibility with NVMe 1.4, and provision thermal airflow because sustained sequential reads can push the case temperature well above 60C in dense chassis. The "-TR" suffix indicates Tape & Reel / tray packaging for OEM system integrators rather than retail box.
This page synthesizes distributor pricing, same-capacity drop-in alternatives within the U.3 PCIe Gen4 ecosystem, and practical design notes that go beyond the manufacturer datasheet's parameter tables.
드롭인 대체품: MTFDKCC15T3TGH-1BC1ZABYY-TR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MTFDKCC15T3TGH-1BC1ZABYY-TR (동일 폼 팩터 및 풋프린트) — 차이점: Encryption, Form Factor, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MTFDKCC15T3TGH-1BC1ZABHA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCC15T3TGH-1BC2ZABYY
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCC15T3TGH-1BC1ZABYY
✅ 드롭인✓ 재고 있음
$12900 / 개
데이터시트 보기 →MTFDKCC30T3TGH-1BC1ZABYY
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MZQL215THBLA-00A07
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCC15T3TGH-1BC1ZABYY-TR 최대 정격 & 전기적 특성
| Series | Micron 9400 PRO |
| Capacity | 15.36 TB |
| 인터페이스 | PCIe Gen4 x4 NVMe 1.4 |
| Form Factor | U.3 2.5-inch (15 mm Z-height) |
| NAND Type | 3D TLC (Micron 176-layer) |
| Workload Rating | Read Intensive (1 DWPD) |
| Sequential Read | Up to 7.0 GB/s |
| Sequential Write | Up to 7.0 GB/s |
| Random Read (4 KB) | Up to 1,600,000 IOPS |
| Encryption | AES-256 hardware |
| Power-Loss Protection | Yes (PLP capacitors) |
| End-to-End Data Protection | Yes |
| Endurance | 1 DWPD over 5 years |
| 동작 온도 | 0C to +70C (case) |
| Form Factor Compliance | SFF-TA-1001 (U.3) |
| Packaging Suffix | -TR (Tape & Reel / tray OEM pack) |
| RoHS Compliance | Yes |
MTFDKCC15T3TGH-1BC1ZABYY-TR standard 핀 구성 가이드
MTFDKCC15T3TGH-1BC1ZABYY-TR(standard 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MTFDKCC15T3TGH-1BC1ZABYY-TR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MTFDKCC15T3TGH-1BC1ZABYY-TR 적합 용도: 7 애플리케이션s: Hyperscale Virtualization, AI/ML Training Data Lakes, Large-Object Analytics & Data Warehousing, Software-Defined Storage (SDS) Nodes, Content Delivery & Media Streaming, High-Density Read-Cache Tiers, Enterprise Boot & OS Image Servers.
Hyperscale Virtualization
The MTFDKCC15T3TGH-1BC1ZABYY-TR is well suited to hyperscale virtualization clusters where each U.3 bay must hold maximum VM density. With 15.36 TB per drive and a PCIe Gen4 x4 interface delivering up to 7.0 GB/s sequential read, a single U.3 SSD can host hundreds of VM boot volumes or scratch disks. The 9400 PRO's 1 DWPD read-intense rating aligns with VM workloads dominated by read I/O, while the U.3 (SFF-TA-1001) form factor lets a single backplane carry NVMe, SAS, or SATA mixed deployments. Compared to SATA SSDs, the 9400 PRO removes the 6 Gbps bottleneck, lowering VM density per rack.
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AI/ML Training Data Lakes
The MTFDKCC15T3TGH-1BC1ZABYY-TR fits AI/ML training pipelines that stage large image, video, or feature-lake datasets. With 15.36 TB raw capacity per drive, a 24-bay U.3 chassis can hold 368 TB of training data; a 7.0 GB/s sequential read enables near-line-rate ingest of feature shards. The 9400 PRO platform's TLC NAND with on-drive PLP protects large checkpoint files from corruption during power events. Compared to spinning rust, the 9400 PRO reduces training-step latency from seconds to milliseconds, dramatically shortening epoch times for large-model training.
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Large-Object Analytics & Data Warehousing
The MTFDKCC15T3TGH-1BC1ZABYY-TR is engineered for large-object analytics where query scans dominate write traffic. Columnar analytics workloads such as Snowflake-style data warehouse nodes benefit from the 7.0 GB/s sequential read and up to 1.6M IOPS random read of the 9400 PRO. The U.3 15 mm form factor fits standard 2U/4U rack chassis used by Dell PowerEdge, HPE ProLiant, and Supermicro. Compared to mixed-use SSDs, the read-intense 1 DWPD rating reduces $/TB while still supporting daily ETL ingest cycles.
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Software-Defined Storage (SDS) Nodes
The MTFDKCC15T3TGH-1BC1ZABYY-TR serves as a high-density capacity tier in software-defined storage platforms such as Ceph, MinIO, or VMware vSAN. Each 15.36 TB drive contributes to a replicated or erasure-coded pool; with NVMe-oF or local NVMe, the 7.0 GB/s read bandwidth is shared across distributed clients. The U.3 hot-swap form factor matches SDS reference architectures from vendors like Supermicro and Lenovo. Compared to HDD capacity nodes, the 9400 PRO reduces rebuild times from days to hours, lowering the risk of data loss during node failures.
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Content Delivery & Media Streaming
The MTFDKCC15T3TGH-1BC1ZABYY-TR supports content delivery network edge caches and streaming origin servers where most requests are reads. With 15.36 TB per drive, a 1U edge node can hold entire popular-content catalogs, while the 7.0 GB/s sequential read sustains thousands of concurrent HLS/DASH streams. The 9400 PRO's read-intense endurance rating (1 DWPD) matches the mostly-read workload profile of CDN cache tiers. Compared to SATA SSDs, the Gen4 x4 interface removes the 6 Gbps ceiling that bottlenecks high-bitrate 4K/8K streams.
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High-Density Read-Cache Tiers
The MTFDKCC15T3TGH-1BC1ZABYY-TR is ideal as a high-density read-cache tier in front of HDD cold-storage arrays. Database platforms (Oracle Exadata, SQL Server, PostgreSQL) and warm journal/log workloads benefit from 15.36 TB of read-acceleration per U.3 bay, with the 9400 PRO platform sustaining up to 1.6M IOPS random read for hot index and metadata caches. The U.3 hot-swap form factor matches hybrid-storage chassis designs. Compared to mixed-use SSDs, the read-intense 1 DWPD rating lowers $/TB while the PLP capacitors protect journal flushes.
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Enterprise Boot & OS Image Servers
The MTFDKCC15T3TGH-1BC1ZABYY-TR works in large-scale PXE/OS deployment servers where thousands of bare-metal nodes boot from a central image repository. Each U.3 bay holds 15.36 TB of compressed OS images, and the PCIe Gen4 x4 bandwidth sustains hundreds of simultaneous PXE boots. The 9400 PRO platform's read-intense rating fits the read-dominated boot-storm workload. Compared to SATA SSDs, the 9400 PRO eliminates boot-time bottlenecks when provisioning hyperscale clusters.
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추천 제품 요약
엔지니어링 참조 데이터: MTFDKCC15T3TGH-1BC1ZABYY-TR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MTFDKCC15T3TGH-1BC1ZABHA | MTFDKCC15T3TGH-1BC2ZABYY | MTFDKCC15T3TGH-1BC1ZABYY | MTFDKCC30T3TGH-1BC1ZABYY | MZQL215THBLA-00A07 |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung Electronics |
| Package | U.3 2.5-inch 15mm | U.3 2.5-inch 15mm - same | U.3 2.5-inch 15mm - same | U.3 2.5-inch 15mm - same | U.3 2.5-inch 15mm - same | U.3 2.5-inch 15mm - same |
| Capacity | 15.36 TB | 15.36 TB | 15.36 TB | 15.36 TB | 30.72 TB | 15.36 TB |
| Interface | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 | PCIe Gen4 x4 NVMe 1.4 |
| Sequential Read | Up to 7.0 GB/s | Up to 7.0 GB/s | Up to 7.0 GB/s | Up to 7.0 GB/s | Up to 7.0 GB/s | Up to 6.9 GB/s |
| Workload Rating | Read Intensive (1 DWPD) | Read Intensive (1 DWPD) | Read Intensive (1 DWPD) | Read Intensive (1 DWPD) | Read Intensive (1 DWPD) | Mixed Use / Read Intensive (varies by SKU) |
| NAND Type | 3D TLC (176-layer) | 3D TLC (176-layer) | 3D TLC (176-layer) | 3D TLC (176-layer) | 3D TLC (176-layer) | 3D TLC (Samsung V-NAND) |
| Encryption | AES-256 | AES-256 | AES-256 | AES-256 | AES-256 | AES-256 |
| Power-Loss Protection | Yes (PLP) | Yes (PLP) | Yes (PLP) | Yes (PLP) | Yes (PLP) | Yes (PLP) |
주요 차별점
- Industry-leading 15.36 TB capacity in standard U.3 15 mm Z-height (vs Samsung PM9A3 15.36 TB)
- Read-intensive 1 DWPD at lower $/TB than mixed-use peers (vs Micron 9400 MAX 15.36 TB)
- Tape & Reel / tray OEM packaging (-TR suffix) (vs Retail boxed 9400 PRO 15.36 TB SKU)
- AES-256 hardware encryption with PLP as standard (vs Lower-tier SATA enterprise SSDs)
설계 노트
The 9400 PRO 15.36 TB U.3 SSD can dissipate 8-12 W under sustained sequential read workloads. In dense 1U or 2U chassis with 24-bay backplanes, drive case temperatures commonly exceed 65C without directed airflow. Confirm platform airflow meets Micron's 9400 thermal profile (typically 70C case maximum) before finalizing the BOM, and use platform management to monitor drive temperature via NVMe-MI or SMART logs.
When designing a U.3 backplane, ensure the SFF-TA-1001 connector supports PCIe Gen4 signaling with proper impedance-matched traces (85 ohm differential). Backplane retimers or redrivers may be required for >24-bay configurations to maintain signal integrity at Gen4 speeds. The MTFDKCC15T3TGH-1BC1ZABYY-TR will auto-negotiate down to Gen3 on legacy backplanes, but at half the bandwidth.
Do not mix U.3 NVMe drives with SATA SSDs in the same backplane unless the chassis supports the U.3 auto-detect mode; some legacy backplanes hard-wire the connector to one protocol and will not enumerate the MTFDKCC15T3TGH-1BC1ZABYY-TR as NVMe. Validate the platform's NVMe driver supports NVMe 1.4 features (e.g., namespace management) used by the 9400 firmware. Always update host platform firmware (BMC, BIOS, NVMe driver) before commissioning new 9400 drives.
Although the 9400 PRO is power-efficient for its performance class, peak inrush during hot-plug events can briefly exceed 25 W per drive. Backplane power-delivery circuits must support staggered spin-up or per-bay current limiting to prevent bulk-capacitor droop when multiple drives are inserted simultaneously. PLP capacitor recharge time is on the order of seconds; do not power-cycle the drive repeatedly within that window.
규정 준수 정보
RoHS compliant per Micron product page. AEC-Q100 not applicable - this is a storage module, not an automotive-grade IC. Conflict-minerals compliance verified through Micron's CMRT filings.
