MTFDKCC7T6TFR-1BC1ZABYY - 7.68TB U.3 NVMe Data Center SSD | Micron
부품 번호: MTFDKCC7T6TFR-1BC1ZABYY ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1299 | $1,299.00 |
| 10 | $1249 | $12,490.00 |
| 50 | $1199 | $59,950.00 |
| 100 | $1159 | $115,900.00 |
| 500 | $1099 | $549,500.00 |
MTFDKCC7T6TFR-1BC1ZABYY 개요
A U.3 (SFF-TA-1001) NVMe SSD is a 2.5-inch enterprise storage device that uses the PCIe interface to deliver significantly higher performance than SATA SSDs. U.3 (also known as U.2 backwards-compatible) supports hot-swap and tri-mode operation (NVMe/SATA/SAS) on compatible backplanes. The Micron 7450 PRO family uses TLC NAND with a 1 DWPD (Drive Write Per Day) endurance rating, positioning it for read-intensive workloads like content delivery, streaming, and boot drives.
Key features of the MTFDKCC7T6TFR-1BC1ZABYY include PCIe Gen4 x4 NVMe 1.4 interface, 7.68TB usable capacity, 176-layer TLC NAND, and a 1 DWPD endurance rating for 5 years. The drive operates on a 12V supply and supports enterprise features such as power-loss protection, end-to-end data protection, AES-256 encryption (non-SED variant), and SMART/OCP-compliant telemetry. The U.3 15mm form factor provides robust thermal dissipation for sustained workloads.
The 7450 PRO SSD uses Micron's proprietary controller and firmware stack, which implements advanced LDPC error correction and adaptive thermal throttling. The drive's latency profile is tuned for consistent QoS under mixed random read/write workloads, which is critical for virtualization and database deployments. PCIe Gen4 doubles the per-lane bandwidth of Gen3, enabling the 7450 to saturate the interface on sequential transfers.
Typical applications include cloud-scale object storage, CDN edge caches, virtual desktop infrastructure (VDI) boot drives, read-intensive databases, AI/ML training data staging, and hyperscaler primary storage tiers. The 7.68TB capacity point is the most common for read-intensive workloads in the 7450 family.
When designing with this drive, ensure the host platform supports U.3 hot-swap backplanes with proper PCIe bifurcation for x4 lanes. Validate firmware compatibility with the system BMC and OCP profile support for telemetry. For write-intensive workloads, consider the 7450 MAX (3 DWPD) variant instead.
This page synthesizes distributor pricing, drop-in alternatives, and practical deployment notes not found in the manufacturer datasheet.
드롭인 대체품: MTFDKCC7T6TFR-1BC1ZABYY — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MTFDKCC7T6TFR-1BC1ZABYY (동일 폼 팩터 및 풋프린트) — 차이점: Form Factor, Interface, Series, Capacity, Operating Temperature.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MTFDKCC7T6TFR-1BC1ZA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCC7T6TFR-1BC1ZABYYR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCC7T6TFR-1BC15ABYY
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCB7T6TFR-1BC1ZABYY
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCC15T7TFR-1BC1ZABYY
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MZQL27T6HBLA-00W7C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MZ7L37T6HBLA-00W7C
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MTFDKCC7T6TFR-1BC1ZABYY 사양 (제조사 공개)
| Manufacturer | Micron Technology |
| Series | 7450 PRO |
| Capacity | 7.68 TB |
| 인터페이스 | PCIe Gen4 x4 NVMe 1.4 |
| Form Factor | U.3 2.5-inch (SFF-TA-1001, 15mm) |
| NAND Type | Micron 176-layer 3D TLC |
| Endurance | 1 DWPD (5 years) |
| Encryption | Non-SED (AES-256 capable controller) |
| 동작 온도 | 0C to +70C (case) |
| Power Supply | 12V +/- 10% |
| Hot-Swap Support | Yes (U.3 hot-swap compliant) |
| Power-Loss Protection | Yes |
| Dimensions | 69.85mm x 100.45mm x 15mm |
| Compliance | RoHS, NVMe 1.4, OCP 1.0a |
MTFDKCC7T6TFR-1BC1ZABYY 인터페이스 및 커넥터
MTFDKCC7T6TFR-1BC1ZABYY에 대해 제조사에서 공개한 인터페이스 목록이 없습니다. 커넥터 및 헤더 세부 정보는 제조사 문서를 참조하십시오.
다음을 참조하십시오: 제조사 문서 전체 확장 헤더 핀아웃 및 커넥터 핀 번호는 다음을 참조하십시오.
전력 및 열 특성
| 동작 온도 | 0C to +70C (case) |
제조사에서 공개한 MTFDKCC7T6TFR-1BC1ZABYY의 전력 입력 및 열 파라미터입니다.
일반적인 애플리케이션
MTFDKCC7T6TFR-1BC1ZABYY 적합 용도: 6 애플리케이션s: Cloud-Scale Object Storage, CDN Edge Cache, Virtual Desktop Infrastructure (VDI) Boot Drives, Read-Intensive Database Storage, AI/ML Training Data Staging, Hyperscaler Primary Storage Tier.
Cloud-Scale Object Storage
The MTFDKCC7T6TFR-1BC1ZABYY fits cloud-scale object storage deployments where capacity density and predictable read latency dominate cost models. The drive's 7.68TB capacity point on a U.3 15mm footprint delivers up to 30TB per 1U server when fully populated, while PCIe Gen4 x4 NVMe throughput sustains concurrent multi-tenant GET requests at lower P99 latency than SATA equivalents. The 1 DWPD rating suits bucket and blob storage where writes are append-only and infrequent, and Micron's 176-layer TLC provides endurance headroom for periodic compaction operations.
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CDN Edge Cache
The MTFDKCC7T6TFR-1BC1ZABYY serves as an effective CDN edge cache tier due to its high sequential read throughput over PCIe Gen4 and large 7.68TB capacity per slot. Content delivery nodes benefit from the drive's ability to absorb large object fetches while maintaining low queue depths, and the U.3 15mm form factor provides thermal headroom for sustained peak traffic. The 1 DWPD endurance is well-matched to edge cache workloads where reads vastly outnumber writes, typically by 100:1 or more.
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Virtual Desktop Infrastructure (VDI) Boot Drives
The MTFDKCC7T6TFR-1BC1ZABYY excels as VDI boot drives where hundreds of desktop sessions share a small read-dominant working set. Each 7.68TB drive can host 50 to 80 linked-clone or instant-clone desktops, and PCIe Gen4 NVMe provides the IOPS required for login storms and OS image hydration. The 1 DWPD rating covers typical boot-storm patterns where writes occur primarily during patch distribution. Power-loss protection ensures session integrity during unexpected reboots.
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Read-Intensive Database Storage
The MTFDKCC7T6TFR-1BC1ZABYY suits read-intensive databases such as analytics platforms, data warehousing fact tables, and OLAP cubes where queries scan large datasets. The 7.68TB capacity allows consolidation of multiple tables per drive, reducing query latency by minimizing table-to-table seek overhead. PCIe Gen4 x4 NVMe eliminates the storage I/O bottleneck in columnar scan workloads, and the 7450 PRO firmware is tuned for consistent tail latency under mixed concurrent read patterns.
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AI/ML Training Data Staging
The MTFDKCC7T6TFR-1BC1ZABYY is well-suited for AI/ML training data staging where large image and tensor datasets are loaded into GPU memory sequentially. The drive's high sequential read throughput over PCIe Gen4 keeps up with multi-GPU training pipelines, and the 7.68TB capacity holds entire ImageNet-scale datasets on a single drive. The 1 DWPD rating covers the write-heavy checkpoint and dataset versioning patterns common in MLOps workflows without sacrificing cost-efficiency.
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Hyperscaler Primary Storage Tier
The MTFDKCC7T6TFR-1BC1ZABYY functions as a primary storage tier in hyperscaler deployments where predictable performance at scale is paramount. The U.3 15mm hot-swap form factor fits standard hyperscaler sled designs, and the drive's OCP 1.0a telemetry compliance enables integration with hyperscaler monitoring stacks. Power-loss protection and end-to-end data path protection meet the durability SLAs required for primary storage roles. Volume procurement through Micron OEM channels enables cost optimization at hyperscaler scale.
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추천 제품 요약
엔지니어링 참조 데이터: MTFDKCC7T6TFR-1BC1ZABYY — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MTFDKCC7T6TFR-1BC1ZA | MTFDKCB7T6TFR-1BC1ZABYY | MTFDKCC15T7TFR-1BC1ZABYY | MZQL27T6HBLA-00W7C | MZ7L37T6HBLA-00W7C |
|---|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Samsung | Samsung |
| Package | U.3 15mm | U.3 15mm | U.3 7mm | U.3 15mm | U.3 15mm | U.3 15mm |
| Capacity | 7.68 TB | 7.68 TB | 7.68 TB | 15.36 TB | 7.68 TB | 7.68 TB |
| Interface | PCIe Gen4 x4 NVMe | PCIe Gen4 x4 NVMe | PCIe Gen4 x4 NVMe | PCIe Gen4 x4 NVMe | PCIe Gen4 x4 NVMe | SATA III |
| Endurance (DWPD) | 1 DWPD | 1 DWPD | 1 DWPD | 1 DWPD | 1 DWPD | 1 DWPD |
| Encryption | Non-SED | SED (TCG Enterprise) | Non-SED | Non-SED | SED (TCG Opal 2.0) | Non-SED |
| NAND Type | 176-layer TLC | 176-layer TLC | 176-layer TLC | 176-layer TLC | Samsung V-NAND TLC | Samsung V-NAND TLC |
| Hot-Swap Support | Yes | Yes | Yes | Yes | Yes | Yes |
주요 차별점
- Highest capacity within the 7450 PRO family at U.3 15mm (vs MTFDKCC3T8TFR-1BC1ZABYY (3.84TB variant))
- Superior thermal headroom versus 7mm sibling (vs MTFDKCB7T6TFR-1BC1ZABYY (U.3 7mm))
- Open firmware with broad OEM validation (vs MZQL27T6HBLA-00W7C (Samsung PM9A3))
설계 노트
The MTFDKCC7T6TFR-1BC1ZABYY in U.3 15mm form factor requires airflow of at least 300 LFM (linear feet per minute) across the drive bay for sustained workload operation. In dense server chassis with 24+ NVMe bays, validate thermal telemetry to ensure the case temperature stays below 70C; Micron specifies thermal throttling thresholds above this point. Deploy the 7mm variant (MTFDKCB7T6TFR-1BC1ZABYY) only when chassis depth or weight constraints require the lower z-height.
When designing PCIe lane allocation for servers housing MTFDKCC7T6TFR-1BC1ZABYY drives, allocate one x4 PCIe Gen4 link per drive to avoid sharing lanes across bays. On backplanes with PCIe switching, validate that the switch ASIC supports bifurcation to x4 and that the system BIOS exposes the bifurcation in setup. For NVMe-oF deployments, allocate 25 GbE or higher networking to avoid storage-network bottlenecks.
Do not deploy the MTFDKCC7T6TFR-1BC1ZABYY (non-SED variant) in environments with mandatory encryption-at-rest compliance requirements; instead order the SED SKU (MTFDKCC7T6TFR-1BC1ZA). Avoid mixing Micron 7450 PRO drives with MAX variants in the same RAID or erasure-coding group, as endurance mismatches can cause premature wear-out of the lower-DWPD drives. Always update drive firmware to the latest Micron release before deployment to capture the latest QoS improvements.
규정 준수 정보
RoHS and REACH compliance per Micron product page. AEC-Q100 not applicable for data center SSD. Non-SED variant - choose MTFDKCC7T6TFR-1BC1ZA for SED encryption compliance.
