N25Q064A11E12A0F - 64Mb SPI NOR Flash 1.8V 108MHz | Micron
부품 번호: N25Q064A11E12A0F ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.69 | $1.69 |
| 10 | $1.6 | $16.00 |
| 100 | $1.48 | $148.00 |
| 500 | $1.38 | $690.00 |
| 1,000 | $1.3 | $1,300.00 |
N25Q064A11E12A0F 개요
Serial NOR flash is a nonvolatile memory category that stores code and data while allowing byte-level random access over a serial peripheral interface (SPI). Within the memory hierarchy, NOR flash sits alongside NAND flash and DRAM as a core memory IC, and its execute-in-place (XIP) capability makes it the default boot-code storage for embedded processors, microcontrollers, and FPGAs. Multiple I/O (dual and quad SPI) variants increase effective bandwidth without widening the physical footprint.
Key features include 64Mb SLC NOR density organized as 16M x 4, a 108 MHz maximum SPI clock that supports double data rate operation for higher throughput, a wide 1.7V to 2.0V supply range, and an industrial-to-automotive operating temperature range of -40C to +125C. The device supports single, dual, and quad I/O commands plus memory-mapped XIP execution, allowing hosts to boot code directly from flash.
Technically, the N25Q family uses single-level-cell NOR technology with sector and subsector erase granularity, block protection, and standard JEDEC SFDP serial flash discoverable parameters for host enumeration. The 24-ball T-PBGA footprint is compact for board layouts where routing a wide parallel bus would be impractical.
Typical applications include boot firmware storage for FPGAs and SoCs in automotive and industrial systems, BIOS/UEFI code storage in networking equipment, configuration data for embedded displays, and firmware repositories in telematics and telematics-adjacent modules.
A key design consideration is SPI signal integrity: at 108 MHz, keep clock and data traces short and matched, and verify that the host controller supports the N25Q command set or an SFDP-driven driver. Budget erase times when planning field firmware updates.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: N25Q064A11E12A0F — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: N25Q064A11E12A0F (동일 폼 팩터 및 풋프린트) — 차이점: Density, FBGA Code, Interface, Memory Type, Package.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
MT25QL128ABB8E12-0AUT
✅ 드롭인✓ 재고 있음
$3.62 / 개
데이터시트 보기 →MT25QL256ABA8E12-0AUT
✅ 드롭인✓ 재고 있음
$12.5 / 개
데이터시트 보기 →MT25QU512ABB8E12-0AUT
✅ 드롭인✓ 재고 있음
가격 문의
데이터시트 보기 →W25Q64AWDRI
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
MX25L6406EMI-10G
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
N25Q064A11E12A0F 사양
| Density | 64 Mb (8 MB) |
| 메모리 구성 | 16M x 4 (SLC NOR) |
| 메모리 유형 | Serial NOR Flash |
| 인터페이스 | SPI / Dual SPI / Quad SPI |
| 최대 클록 주파수 | 108 MHz |
| 공급 전압 | 1.7 V to 2.0 V (nominal 1.8 V) |
| 동작 온도 | -40C to +125C |
| 패키지 | 24-T-PBGA (6x8 mm, TBGA) |
| Number of Terminals | 24 |
| 실장 유형 | Surface Mount |
| Cell Type | SLC (Single-Level Cell) |
| Temperature Grade | Automotive |
| FBGA Code | N/A (per distributor data) |
| Chipset Validation | N/A (per distributor data) |
N25Q064A11E12A0F 24-t-pbga (6x8 mm, tbga) 핀 구성 가이드
N25Q064A11E12A0F(24-t-pbga (6x8 mm, tbga) 패키지)의 핀 구성입니다. 핀 번호, 기능, 연결 다이어그램은 제조사 데이터시트에 정의되어 있습니다. 정확한 풋프린트와 솔더링 지침은 해당 문서를 참조하십시오.
다음에 대한 상세 핀아웃 데이터 없음: N25Q064A11E12A0F.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
N25Q064A11E12A0F 적합 용도: 6 애플리케이션s: FPGA Boot Code Storage, Automotive Telematics and Infotainment, Industrial PLC and Automation Controllers, Networking Equipment Firmware Storage, Embedded Display and HMI Systems, Test and Measurement Instrumentation.
FPGA Boot Code Storage
The N25Q064A11E12A0F stores configuration bitstreams for FPGAs and SoCs in industrial and networking systems, where its 108 MHz quad SPI interface minimizes configuration time. Its 64 Mb (8 MB) capacity accommodates multiple bitstream versions, enabling dual-image fail-safe updates. Because the device supports execute-in-place (XIP) operation, host processors can fetch code directly from flash over the memory-mapped SPI bus without first copying to RAM, reducing boot latency and external memory cost. Layout consideration: keep the SPI clock and data traces short and length-matched to preserve signal integrity at 108 MHz, and use the SFDP table so the configuration controller auto-detects the device command set.
추천
Automotive Telematics and Infotainment
With an operating temperature range of -40C to +125C and an automotive temperature grade per distributor data (Partstack, Vyrian), the N25Q064A11E12A0F is well suited to telematics control units, dash cameras, and infotainment modules that must survive under-hood and direct-solar thermal environments. Its SLC NOR technology delivers deterministic erase and program behavior and superior endurance compared to MLC alternatives, which matters for firmware-over-the-air update logs. The 1.8V supply matches the low-voltage rails of modern automotive SoCs, minimizing level-shifting. Designers should budget the sector-erase time (on the order of hundreds of milliseconds per the N25Q family datasheet) when scheduling background firmware updates.
추천
Industrial PLC and Automation Controllers
Programmable logic controllers and factory automation nodes use the N25Q064A11E12A0F to store boot firmware, application code, and nonvolatile parameter sets. The wide -40C to +125C range covers unconditioned electrical cabinets, and the 8 MB capacity holds both resident code and logged configuration data. Quad SPI operation at 108 MHz lets industrial MCUs and SoCs boot quickly, reducing line restart time after power interruptions - a key requirement in continuous-process plants. The 24-ball BGA package provides a compact footprint for dense I/O cards. Use block protection on parameter sectors to prevent accidental corruption from firmware faults, and validate the SPI bus with worst-case capacitive loading before release.
추천
Networking Equipment Firmware Storage
Routers, switches, and base-station hardware rely on serial NOR flash such as the N25Q064A11E12A0F for BIOS/UEFI and boot ROM images. Its 64 Mb density accommodates compressed firmware images plus environment variables, while the 108 MHz quad SPI interface shortens cold-boot times on rack equipment that must recover rapidly after power events. The device's JEDEC SFDP discoverable parameters allow one bootloader driver to enumerate multiple flash vendors during production, easing supply-chain flexibility. In high-availability designs, pair two devices with a failover bootloader and use the SLC NOR's predictable erase latency to guarantee bounded recovery times within carrier-grade uptime targets.
추천
Embedded Display and HMI Systems
Human-machine interface panels and embedded displays use the N25Q064A11E12A0F to store graphics assets, fonts, and application firmware alongside boot code. The 8 MB capacity holds compressed bitmaps and icon sets for mid-range GUIs, while XIP execution lets the display controller stream code directly from flash. The 1.8V supply integrates cleanly with low-power display SoCs, and the compact 24-ball 6x8 mm BGA fits behind display modules where board height and area are constrained. Designers should reserve contiguous erase blocks for the graphics file system and account for quad-SPI signal integrity at 108 MHz with controlled-impedance traces to avoid visual corruption during asset fetches.
추천
Test and Measurement Instrumentation
Oscilloscopes, spectrum analyzers, and signal generators store calibration constants, instrument firmware, and user settings in the N25Q064A11E12A0F. The SLC NOR architecture gives deterministic program/erase timing, important for instrument self-test routines that verify storage health at startup, and the -40C to +125C range supports bench-to-field portability. Its 64 Mb array can be partitioned so calibration data sits in hardware-protected blocks, guarding against loss during firmware updates - a common failure mode in field instruments. The quad SPI interface at 108 MHz accelerates instrument boot sequences, and the BGA package resists vibration in portable measurement equipment.
추천
추천 제품 요약
엔지니어링 참조 데이터: N25Q064A11E12A0F — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MT25QL128ABB8E12-0AUT | MT25QL256ABA8E12-0AUT | W25Q64AWDRI | MX25L6406EMI-10G |
|---|---|---|---|---|---|
| Brand | Micron Technology | Micron Technology | Micron Technology | Winbond Electronics | Macronix |
| Package | 24-T-PBGA (6x8 mm) | 24-ball BGA family | 24-ball BGA family | 8-contact surface-mount (footprint differs - verify) | 8-contact surface-mount (footprint differs - verify) |
| Density | 64 Mb (8 MB) | 128 Mb | 256 Mb | 64 Mb | 64 Mb |
| Interface | SPI / Dual / Quad | SPI / Dual / Quad | SPI / Dual / Quad | SPI / Dual / Quad | SPI / Dual / Quad |
| Memory Cell Type | SLC NOR | SLC NOR | SLC NOR | SLC NOR | SLC NOR |
| Generation | N25Q (previous generation) | MT25Q (current generation) | MT25Q (current generation) | Winbond W25Q SPI series | Macronix MX25L SPI series |
주요 차별점
- Compact 24-ball BGA footprint with automotive temperature range (vs W25Q64AWDRI)
- Quad SPI at 108 MHz with XIP for fast boot (vs MX25L6406EMI-10G)
- Same-footprint upgrade path to higher density (vs MT25QL128ABB8E12-0AUT)
설계 노트
At the 108 MHz maximum SPI clock, treat the quad-SPI bus as a moderate-speed transmission line: keep traces under ~100 mm where possible, maintain controlled impedance (~50 ohm single-ended), and length-match the clock to IO0-IO3 within a few millimeters. Add 22-33 ohm series resistors near the host controller to damp reflections if traces are long. The HOLD#/IO3 and WP#/IO2 pins become active quad-I/O signals, so their pull-ups from legacy single-SPI designs must be reviewed to avoid bus contention during quad transfers.
Never connect the 1.8V-class N25Q064A11E12A0F directly to a 3.3V SPI host. If the host is 3.3V, use level translators or select a host with 1.8V-tolerant IO banks. Additionally, N25Q parts from different generations may implement different command opcodes; rely on the JEDEC SFDP table read (address 0x000000, SFDP command) for host enumeration instead of hard-coding opcodes, so a future drop-in to MT25Q devices does not require bootloader changes.
Decouple VCC with a 100 nF ceramic capacitor placed within 2-3 mm of the BGA ball, plus a 4.7-10 uF bulk capacitor nearby. For the 24-ball 6x8 mm T-PBGA, design the footprint per the Micron package drawing in the N25Q datasheet and place a small ground keep-out beneath the ball field. Verify reflow profile against the package peak reflow specification before production - the peak reflow value was not available in the verified data and should be confirmed from the Micron package documents.
Estimated: with a 1.8V supply and typical active-read current in the low-mA range for the N25Q family, average read power is only a few milliwatts; however, program and erase operations draw pulsed current at higher amplitude. Size the 1.8V rail's bulk capacitance (4.7-10 uF) so the rail does not droop during erase bursts, which can cause write faults. Confirm exact ICC values from the Micron N25Q datasheet DC characteristics table - the verified data did not include current figures.
규정 준수 정보
Verified web data did not include explicit RoHS/REACH/AEC-Q100 compliance statements. Partstack/Vyrian list 'Temperature Grade: AUTOMOTIVE', but formal AEC-Q100 qualification must be confirmed with Micron.
