PIC16F15354-I/MV - 8-Bit MCU, 7KB Flash, 32MHz, 28-UQFN | Microchip
부품 번호: PIC16F15354-I/MV ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.42 | $1.42 |
| 10 | $1.28 | $12.80 |
| 100 | $1.05 | $105.00 |
| 500 | $0.89 | $445.00 |
| 1,000 | $0.78 | $780.00 |
PIC16F15354-I/MV 개요
An 8-bit microcontroller (MCU) is a single-chip computer that combines a CPU, non-volatile program memory (Flash), volatile data memory (RAM), and a set of on-chip peripherals around a reduced instruction set computing (RISC) core. PIC microcontrollers occupy the microcontroller -> embedded controller -> semiconductor IC hierarchy and are designed for deterministic real-time control. The XLP™ (eXtreme Low Power) designation means the PIC16F15354 belongs to Microchip's ultra-low-power MCU family, typically drawing nanoampere-level sleep currents and supporting battery-powered designs. This part sits within the broader PIC16F153xx family, which adds Core Independent Peripherals (CIPs), Intelligent Analog, and 2x EUSART plus SPI/I2C communication.
Key features include four 10-bit PWM channels, a 5-bit DAC, a comparator, an ADC, a Complementary Waveform Generator (CWG), and two Enhanced USART (EUSART) peripherals for asynchronous or synchronous serial communication, plus SPI and I2C. The device operates from 2.5V to 5.5V, supports up to 32 MHz CPU speed via the internal HFINTOSC, and offers nanWatt sleep modes for battery-backed applications.
The PIC16F15354 uses Microchip's enhanced mid-range 8-bit RISC core with a 14-bit instruction word, providing deterministic instruction timing of one instruction per two clock cycles. On-chip peripherals are largely CIP-based, meaning they operate without CPU intervention, reducing firmware complexity and active power. The 28-UQFN package integrates an exposed pad that provides a low-resistance thermal path, allowing higher-power dissipation within a 4x4 mm footprint.
Typical applications include consumer electronics, low-power IoT sensor nodes, automotive body and interior systems, battery-backed instrumentation, and small home appliances. The 5V-tolerant digital and analog blocks plus the wide 2.5V–5.5V supply range make it compatible with both 3.3V and 5V system rails.
When designing with this device, ensure the exposed thermal pad is soldered to a sufficient copper pour on the PCB to achieve rated thermal performance. For applications that require IEC 60730 or Class B safety compliance, the on-chip CRC, windowed watchdog, and hardware limit timer simplify firmware self-test.
This page synthesizes distributor pricing, drop-in same-family alternatives, application guidance, and PCB design notes not found in the manufacturer datasheet alone, optimized for engineers selecting this part for new designs.
드롭인 대체품: PIC16F15354-I/MV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F15354-I/MV (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Core Architecture, Package, DAC, Program Memory (Flash).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F15354-E/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F15355-I/MV
✅ 드롭인✓ 재고 있음
$1.05 / 개
데이터시트 보기 →PIC16F15344-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F15345-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F15325-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F15354-I/MV 최대 정격 & 전기적 특성
| Core Architecture | PIC16 enhanced mid-range 8-bit RISC |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| Data Memory (RAM) | 512 bytes |
| Maximum CPU Speed | 32 MHz |
| Supply Voltage Range | 2.5 V to 5.5 V |
| 동작 온도 범위 | -40 °C to +85 °C (industrial grade) |
| 패키지 | 28-pin UQFN (4x4 mm) with exposed pad |
| ADC | ADC with multiple channels |
| PWM Channels | 4 x 10-bit PWM |
| DAC | 5-bit DAC |
| Comparator | Yes |
| Communication Interfaces | 2 x EUSART, SPI, I2C |
| Complementary Waveform Generator (CWG) | Yes |
| Low-Power Technology | XLP™ (eXtreme Low Power) |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
PIC16F15354-I/MV 핀 구성
| 핀 1 | RA5 — Bidirectional I/O / analog input / DAC output |
| 핀 2 | RA4 — Bidirectional I/O / analog input |
| 핀 3 | RA3 — Bidirectional I/O / analog input / MCLR |
| 핀 4 | RA2 — Bidirectional I/O / analog input |
| 핀 5 | RA1 — Bidirectional I/O / analog input |
| 핀 6 | RA0 — Bidirectional I/O / analog input |
| 핀 7 | VDD — Positive supply voltage |
| 핀 8 | VSS — Ground reference |
| 핀 9 | RB7 — Bidirectional I/O / ICSP programming clock |
| 핀 10 | RB6 — Bidirectional I/O / ICSP programming data |
| 핀 11 | RB5 — Bidirectional I/O |
| 핀 12 | RB4 — Bidirectional I/O |
| 핀 13 | RB3 — Bidirectional I/O |
| 핀 14 | RB2 — Bidirectional I/O |
| 핀 15 | RB1 — Bidirectional I/O |
| 핀 16 | RB0 — Bidirectional I/O / interrupt-on-change |
| 핀 17 | RC7 — Bidirectional I/O / EUSART TX |
| 핀 18 | RC6 — Bidirectional I/O / EUSART RX |
| 핀 19 | RC5 — Bidirectional I/O |
| 핀 20 | RC4 — Bidirectional I/O |
| 핀 21 | RC3 — Bidirectional I/O / SPI/I2C clock |
| 핀 22 | RC2 — Bidirectional I/O |
| 핀 23 | RC1 — Bidirectional I/O / analog input |
| 핀 24 | RC0 — Bidirectional I/O / analog input |
| 핀 25 | RA7 — Bidirectional I/O / analog input |
| 핀 26 | RA6 — Bidirectional I/O / analog input |
| 핀 27 | VDDIO — I/O supply voltage reference |
| 핀 28 | VSS — Ground reference |
일반적인 애플리케이션
PIC16F15354-I/MV 적합 용도: 6 애플리케이션s: Battery-Powered IoT Sensor Node, Automotive Body and Interior Module, Home Appliance User Interface, Low-Cost Data Acquisition Front-End, LED Lighting Controller, Small Consumer Electronic Device.
Battery-Powered IoT Sensor Node
The PIC16F15354-I/MV fits battery-powered IoT sensor nodes because its XLP™ (eXtreme Low Power) technology delivers nanoampere-level sleep currents, allowing multi-year coin-cell operation. The 2.5V to 5.5V supply range lets the MCU run directly from a single lithium primary cell down to its end-of-life voltage, while the on-chip 10-bit ADC and 5-bit DAC digitize sensor signals without external components. The 32 MHz HFINTOSC provides enough MIPS for protocol stacks like Modbus or simple BLE beaconing, and the four 10-bit PWM channels can drive indicator LEDs or low-side FETs. Placed as the central MCU with the sensor on RA0-RA3, this PIC16F15354 delivers typical sleep currents below 1 uA per the Microchip datasheet, enabling coin-cell lifetimes in the 5-10 year range for periodic-sensing applications.
추천
Automotive Body and Interior Module
The PIC16F15354-I/MV is suitable for automotive body and interior modules including seat controllers, mirror adjusters, and ambient lighting drivers. The on-chip Complementary Waveform Generator (CWG) provides hardware-generated complementary PWM with dead-band control for driving half-bridges in LED lighting and small motor loads, while the two EUSART peripherals support LIN bus communication via a LIN transceiver. The 4x 10-bit PWM channels can dim multiple LED strings independently. Placed between the 12V automotive rail and the LIN bus, the MCU regulates its own 5V rail via an external LDO and handles LIN slave protocol in firmware. The industrial -40C to +85C grade covers most cabin environments; under-hood designs require the PIC16F15354-E/MV extended grade variant.
추천
Home Appliance User Interface
The PIC16F15354-I/MV integrates a complete user-interface controller for home appliances such as coffee machines, microwave ovens, and washing machine control panels. The 4x PWM channels drive LED backlights and indicator rings, the comparator handles zero-crossing detection for triac-fired heating elements, and the 5-bit DAC produces analog reference voltages for thermistor bridge sensing. The two EUSART ports plus SPI allow connection to a separate Wi-Fi or BLE module for smart-appliance connectivity. Placed as the front-panel MCU, it scans capacitive or matrix keypads on RB0-RB7, drives the LED display via PWM, and exchanges commands with the main appliance controller over UART. The 7 KB Flash easily accommodates state-machine control code plus a USB stack or display library.
추천
Low-Cost Data Acquisition Front-End
The PIC16F15354-I/MV serves as a low-cost multi-channel data acquisition front-end for industrial sensors, HVAC monitoring, and test equipment. Its 10-bit ADC with multiple input channels handles thermocouple, RTD, or 4-20 mA current-loop signal conditioning through external amplifiers, while the on-chip comparator triggers threshold alarms without CPU wake-up. The two EUSART peripherals provide simultaneous Modbus master and debug-port operation. Placed near the analog signal sources, the MCU samples, filters, and forwards data to a host PLC or gateway via RS-485. The XLP sleep modes between conversion cycles drop average current to microampere levels, making it ideal for solar-powered remote telemetry units and battery-backed measurement systems.
추천
LED Lighting Controller
The PIC16F15354-I/MV is well matched to LED lighting controllers and architectural dimmers thanks to its four 10-bit PWM channels and Complementary Waveform Generator (CWG). The CWG produces complementary outputs with programmable dead time, eliminating shoot-through in high-current LED driver stages, while the PWMs deliver smooth logarithmic dimming curves and color-mixing for RGBW fixtures. The 2.5V to 5.5V supply accepts direct power from a 5V or 12V LED driver auxiliary rail. Placed downstream of an AC-DC LED driver, the PIC16F15354 reads button or 0-10V dim inputs on ADC channels and translates them to PWM duty cycles. The EUSART interface accepts DMX512 or wireless module commands for networked lighting installations.
추천
Small Consumer Electronic Device
The PIC16F15354-I/MV anchors small consumer electronics such as remote controls, toys, personal-care devices, and entry-level wearables. Its tiny 4x4 mm UQFN footprint leaves PCB space for sensors, batteries, and user interfaces, while the 32 MHz core delivers enough MIPS to drive small TFT displays, audio tones, and BLE handshaking. The XLP sleep currents in the nanoampere range extend AAA or coin-cell life across the product's shelf life. Placed as the central controller, it handles button scanning on PORTB, drives a small OLED or LED matrix via SPI, and wakes on timer or button interrupt. The PIC16F15354's broad peripheral set lets designers replace multiple discrete timers and drivers with one integrated MCU.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F15354-I/MV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F15354-E/MV | PIC16F15355-I/MV | PIC16F15344-I/MV |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Flash Memory | 7 KB | 7 KB | 14 KB | 3.5 KB |
| RAM | 512 bytes | 512 bytes | 1 KB | 256 bytes |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Supply Voltage Range | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V | 2.5 V to 5.5 V |
| Operating Temperature | -40 °C to +85 °C (I grade) | -40 °C to +125 °C (E grade) | -40 °C to +85 °C | -40 °C to +85 °C |
| PWM Channels | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit | 4 x 10-bit |
| Communication Interfaces | 2 x EUSART, SPI, I2C | 2 x EUSART, SPI, I2C | 2 x EUSART, SPI, I2C | 2 x EUSART, SPI, I2C |
| 1-unit Price (USD, as of 2026-09-19) | 1.42 | 1.55 | 1.65 | 1.30 |
주요 차별점
- Balanced 7 KB Flash / 512 B RAM in smallest UQFN package (vs PIC16F15344-I/MV)
- Industrial temperature range sufficient for most non-underhood designs (vs PIC16F15354-E/MV)
- XLP technology for true nanampere-level sleep (vs PIC16F15355-I/MV)
설계 노트
The 28-UQFN (4x4 mm) MV package includes an exposed thermal pad (EP) on pin 29 underneath the die. This EP must be soldered to a PCB thermal pad with at least 8 thermal vias to the inner ground plane to achieve the rated thermal resistance. Without proper EP soldering, junction temperature can exceed 150 °C at modest power dissipation, triggering thermal shutdown or long-term reliability degradation. Recommended stencil aperture is a 1:1 ratio with the EP land size to ensure consistent solder joint thickness.
Place a 0.1 µF ceramic decoupling capacitor as close as possible to the VDD pin (pin 7) with the trace length to VDD kept below 2 mm. Add a bulk 1 µF to 10 µF tantalum or ceramic capacitor on the same node for switching transient suppression. The PIC16F15354's ADC accuracy is sensitive to VDD noise; if the application uses ADC at high resolution, dedicate an additional 0.1 µF cap near the VDDCORE pin (internal regulator output) per the Microchip datasheet. Estimated: at 32 MHz active current ~5 mA plus peripheral loads, total VDD decoupling must hold ripple below 50 mVpp.
Do not leave the MCLR pin (RA3) floating in production designs - an internal weak pull-up is enabled in software but a noisy environment can still cause unintended resets. Tie MCLR to VDD through a 10 kΩ resistor and add a 100 nF cap to ground for hardware reset robustness. For ICSP programming, both RB6 (ICSP clock) and RB7 (ICSP data) must be accessible on the final PCB layout; do not place series resistors above 4.7 kΩ on these lines or programming will fail.
Route the HFINTOSC clock trace away from sensitive analog inputs to minimize coupled noise on ADC readings. If the design uses an external crystal or resonator, place it within 5 mm of the OSC1/OSC2 pins and guard both traces with a ground pour on each side. The 28-UQFN's small 0.4 mm pin pitch requires 4 mil trace width with 4 mil spacing to maintain manufacturability at most PCB fab houses. Use a reference plane on layer 2 directly under the MCU for clean return paths on high-speed EUSART or SPI signals.
규정 준수 정보
RoHS and lead-free compliance confirmed from Microchip product page and DigiKey listing. AEC-Q100 qualification not applicable for industrial-grade 'I' suffix; automotive applications should select AEC-Q100-qualified variants from the PIC16F15354 family.
