PIC16F1716-I/MV - 8-Bit 32MHz MCU, 14KB Flash, Op Amps | Microchip
부품 번호: PIC16F1716-I/MV ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1.83 | $1.83 |
| 10 | $1.65 | $16.50 |
| 100 | $1.41 | $141.00 |
| 500 | $1.21 | $605.00 |
| 1,000 | $1.04 | $1,040.00 |
PIC16F1716-I/MV 개요
A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (typically Flash), working RAM, and a configurable set of digital and analog peripherals around a compact core. The PIC16F1716 belongs to the 8-bit PIC16 family — part of the broader category of microcontrollers -> microprocessors -> semiconductor devices -> integrated circuits. The 8-bit PIC architecture is well known for deterministic instruction timing, ease of use in C or assembly, and very low sleep currents that suit battery-powered and energy-harvesting products.
Key features include two on-chip operational amplifiers (Op Amps) that eliminate external analog front-end components, a 10-bit ADC with computation (ADC2), 5-bit and 8-bit DACs, two high-speed comparators, a numerically controlled oscillator (NCO), complementary output generator (COG), zero-cross detect (ZCD), configurable logic cells (CLC), peripheral pin select (PPS), and EUSART/I²C/SPI interfaces. These core-independent peripherals allow complex timing and signal-conditioning tasks to run autonomously without CPU intervention, freeing the core for application logic.
Typical applications include LED lighting controllers, sensor conditioning with on-chip op amps, low-power IoT sensor nodes, white-goods user-interface boards, battery chargers, and small motor control loops. The exposed thermal pad aids heat spreading when the device drives outputs near its full rating, and the 4x4 mm UQFN footprint is among the smallest in the PIC16 line, enabling dense PCB layouts.
When designing with this MCU, place the VDDCORE decoupling capacitor as close as possible to pin 20 and route analog/digital grounds thoughtfully because the op amps share the analog supply domain. PPS allows most digital peripherals to be remapped to nearly any I/O pin, which simplifies PCB routing and lets one layout support multiple firmware variants.
드롭인 대체품: PIC16F1716-I/MV — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F1716-I/MV (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Comparators, DAC, Program Memory (Flash).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC16F1716-I/ML
✅ 드롭인✓ 재고 있음
$0.98 / 개
데이터시트 보기 →PIC16F1716T-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F1713-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F1703-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F1705-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F1615-I/MV
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC16F1716-I/MV 최대 정격 & 전기적 특성
| Core | PIC16 8-bit (enhanced mid-range) |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data SRAM | 1 KB |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage (VDD) | 2.3 V to 5.5 V |
| I/O Pins | 25 |
| On-chip Op Amps | 2 |
| ADC | 10-bit, with computation (ADC2) |
| DAC | 5-bit and 8-bit |
| Comparators | 2 high-speed |
| Core Independent Peripherals | CLC, COG, NCO, ZCD |
| Communication | EUSART, I2C, SPI |
| Peripheral Pin Select (PPS) | Yes |
| 패키지 | 28-UQFN (4x4 mm) with exposed pad |
| 동작 온도 | -40C to +85C (industrial) |
PIC16F1716-I/MV 핀 구성
| 핀 1 | RA0/ANA0/OPA1IN0+ — Bidirectional I/O / analog input / op-amp 1 non-inverting input |
| 핀 2 | RA1/ANA1/OPA1IN0- — Bidirectional I/O / analog input / op-amp 1 inverting input |
| 핀 3 | RA2/ANB0/OPA1IN1+/DAC1OUT1 — Bidirectional I/O / analog input / op-amp 1 alt input / DAC output |
| 핀 4 | RA3/ANB1/OPA1IN1- — Bidirectional I/O / analog input / op-amp 1 alt inverting input |
| 핀 5 | RA4/ANB2/OPA1OUT — Bidirectional I/O / analog input / op-amp 1 output |
| 핀 6 | RA5/ANB3/OPA2IN3+ — Bidirectional I/O / analog input / op-amp 2 alt non-inverting input |
| 핀 7 | VSS — Ground reference |
| 핀 8 | RA7/OSC1 — Bidirectional I/O / crystal oscillator input |
| 핀 9 | RA6/OSC2 — Bidirectional I/O / crystal oscillator output |
| 핀 10 | RC0/SOSCIN/SCL1 — Bidirectional I/O / secondary oscillator in / I2C clock |
| 핀 11 | RC1/SOSCO/SDA1 — Bidirectional I/O / secondary oscillator out / I2C data |
| 핀 12 | RC2/CCP1 — Bidirectional I/O / Capture/Compare/PWM 1 |
| 핀 13 | RC3/CCP2 — Bidirectional I/O / Capture/Compare/PWM 2 |
| 핀 14 | RC4 — Bidirectional I/O |
| 핀 15 | RC5 — Bidirectional I/O |
| 핀 16 | RC6/AN8/OPA2OUT — Bidirectional I/O / analog input / op-amp 2 output |
| 핀 17 | RC7/AN9 — Bidirectional I/O / analog input |
| 핀 18 | RB0/AN12/ZCD — Bidirectional I/O / analog input / zero-cross detect input |
| 핀 19 | RB1/AN10/C1IN1- — Bidirectional I/O / analog input / comparator 1 negative input |
| 핀 20 | RB2/AN8/C2IN+ — Bidirectional I/O / analog input / comparator 2 positive input |
| 핀 21 | RB3/AN9/C2IN- — Bidirectional I/O / analog input / comparator 2 negative input |
| 핀 22 | RB4/AN11 — Bidirectional I/O / analog input |
| 핀 23 | RB5/AN13 — Bidirectional I/O / analog input |
| 핀 24 | RB6/ICSPCLK — Bidirectional I/O / ICSP programming clock |
| 핀 25 | RB7/ICSPDAT — Bidirectional I/O / ICSP programming data |
| 핀 26 | VDD — Positive supply voltage |
| 핀 27 | MCLR/VPP — Master clear reset / programming voltage |
| 핀 28 | RA3/ANB1/OPA1IN1- — Peripheral pin select alt mapping (refer to datasheet for multiplex) |
| 핀 29 | EP (exposed pad) — Thermal pad — solder to ground plane for thermal dissipation |
일반적인 애플리케이션
PIC16F1716-I/MV 적합 용도: 7 애플리케이션s: LED Lighting Controllers and Drivers, Sensor Signal Conditioning Front Ends, Battery-Powered IoT Sensor Nodes, White Goods and Appliance Control Boards, Small Motor Control (Brushed DC and Stepper), USB-C Power Delivery Negotiation (Companion MCU), Battery Chargers and Power Banks.
LED Lighting Controllers and Drivers
The PIC16F1716-I/MV is well suited to LED lighting controllers because its on-chip op amps (2) can condition current-sense signals, the 10-bit ADC with computation samples feedback autonomously, and the CLC/COG/NCO/ZCD core-independent peripherals generate zero-cross TRIAC timing without CPU load. The 32 MHz core handles DMX-512, DALI, or 0-10 V dimming protocols. With XLP sleep currents, mains-powered dimmer designs benefit from low standby dissipation. The 28-UQFN (4x4 mm) footprint enables compact GU10/MR16 form factors. Drop-in compatibility with PIC16F1705 and PIC16F1713 lets engineers scale memory and analog features by re-spinning firmware only.
추천
Sensor Signal Conditioning Front Ends
The two integrated op amps and 10-bit ADC2 make the PIC16F1716-I/MV an excellent signal-conditioning MCU for bridge sensors, thermistors, and photodiodes. The op amps can be configured as instrumentation front ends with programmable gain, feeding the ADC directly. The hardware CLC implements window comparators and PWM modulators offloading the CPU. With peripheral pin select (PPS), analog and digital routing is highly flexible across the 28-pin package. XLP modes enable battery-powered sensor nodes drawing nanoamps in sleep. Same-footprint alternatives like PIC16F1703 (lower memory) or PIC16F1615 (math accelerator) let designers tune cost vs processing throughput.
추천
Battery-Powered IoT Sensor Nodes
For wireless sensor nodes, the PIC16F1716-I/MV provides 32 MHz of processing for sensor fusion and protocol stacks while its XLP technology keeps sleep current in the nanoamp range, extending coin-cell battery life to years. The 14 KB Flash comfortably fits Bluetooth Low Energy beacon firmware or LoRaWAN device drivers when paired with an external transceiver over EUSART or SPI. The peripheral pin select (PPS) lets designers remap UART/SPI/I2C to any digital pin, simplifying PCB routing in small enclosures. The 4x4 mm UQFN-28 package suits wearable and IoT form factors where board space is critical, and PIC16F1703-I/MV serves as a cost-down alternative for simpler nodes.
추천
White Goods and Appliance Control Boards
In washing machines, dishwashers, ovens, and HVAC controls, the PIC16F1716-I/MV drives user-interface keypads and triac outputs while reading temperature and level sensors. The ZCD peripheral synchronizes AC zero-cross events for quiet TRIAC switching, reducing EMI in motors and heaters. The COG generates complementary PWM with programmable dead-band for half-bridge inverter sections, and the high-speed comparators handle over-current protection autonomously. With 25 I/O pins in a 4x4 mm UQFN, the MCU fits tightly behind display panels. AEC-Q100 variants are not offered, but the industrial -40C to +85C range covers most appliance compartments.
추천
Small Motor Control (Brushed DC and Stepper)
The PIC16F1716-I/MV supports small brushed-DC and stepper motor control via its Complementary Output Generator (COG) with hardware dead-band, two high-speed comparators for current sensing, and the 10-bit ADC for back-EMF or potentiometer feedback. The NCO can synthesize precise step rates, while the CLC combines sensor inputs into fault signals that trip PWM outputs without software latency. Operating from 2.3V to 5.5V, the MCU pairs naturally with low-voltage motor drivers. The compact 4x4 mm UQFN-28 package suits integrated motor PCBs where board area is at a premium and thermal dissipation is assisted by the exposed pad.
추천
USB-C Power Delivery Negotiation (Companion MCU)
Used as a USB Type-C port controller or power-delivery (PD) state-machine companion, the PIC16F1716-I/MV implements the BMC-encoded USB-PD protocol via its EUSART and CLC peripherals. The 14 KB Flash fits full Type-C cable-orientation and role-swap logic, while the on-chip op amps sense VBUS current. PPS maps UART and PWM to any pin, simplifying routing on dense USB-C boards. The MCU's 2.3V-5.5V range lets it run directly from VBUS before PD negotiation completes, then from the negotiated rail afterward. Drop-in compatibility with PIC16F1703-I/MV allows cost-down for simple 5V/3A-only ports.
추천
Battery Chargers and Power Banks
The PIC16F1716-I/MV is well suited to single-cell Li-ion and LiPo charger designs, where the on-chip op amps sense charge current and battery voltage, the 10-bit ADC2 monitors charging profiles, and the CLC implements hardware over-current and over-voltage protection independent of the CPU. The 8-bit DAC controls charger reference voltages, and the high-speed comparators trip safety cutoffs within microseconds. The 32 MHz core executes fuel-gauge algorithms and I2C communication with battery monitors. With its 4x4 mm UQFN footprint, the MCU fits inside small power-bank enclosures, and XLP sleep modes extend shelf life between uses.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC16F1716-I/MV — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC16F1716-I/ML | PIC16F1716T-I/MV | PIC16F1713-I/MV | PIC16F1703-I/MV | PIC16F1705-I/MV | PIC16F1615-I/MV |
|---|---|---|---|---|---|---|---|
| Package | 28-UQFN (4x4 mm, MV) | 28-QFN (6x6 mm, ML) — different land pattern | 28-UQFN (4x4 mm, MV) — same | 28-UQFN (4x4 mm, MV) — same | 28-UQFN (4x4 mm, MV) — same | 28-UQFN (4x4 mm, MV) — same | 28-UQFN (4x4 mm, MV) — same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB (-50%) | 7 KB (-50%) | 14 KB | 14 KB |
| RAM | 1 KB | 1 KB | 1 KB | 512 B (-50%) | 512 B (-50%) | 1 KB | 1 KB |
| On-chip Op Amps | 2 | 2 | 2 | 1 | 0 | 1 | 0 |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V |
| Core Independent Peripherals (CLC/COG/NCO/ZCD) | All four present | All four present | All four present | All four present | Reduced CIP set | Reduced CIP set | CLC + math accelerator (no COG/NCO/ZCD) |
주요 차별점
- Two on-chip op amps in UQFN-28 (vs PIC16F1705-I/MV)
- Complete core-independent peripheral (CIP) set (vs PIC16F1615-I/MV)
- Smallest PIC16 family UQFN with full analog suite (vs PIC16F1716-I/ML)
- Double Flash and RAM vs closest family member (vs PIC16F1713-I/MV)
설계 노트
The 28-UQFN (MV) package exposes a center thermal pad (pin 29) that MUST be soldered to a ground-plane land on the PCB for thermal dissipation and mechanical reliability. Use an array of micro-via stitching connecting the central pad to inner ground planes. Place a 0.1uF decoupling capacitor as close as possible to VDD (pin 26) and a bulk 1-10uF ceramic on the same node. For VDDCORE regulation, follow Microchip's recommended 0.1uF on the dedicated core pin per the PIC16F1716 datasheet power-section schematic.
Peripheral Pin Select (PPS) maps most digital peripherals (UART, SPI, I2C, PWM, CLC outputs) to any of the digital I/O pins, but analog pins are fixed. Route sensitive analog traces (ADC inputs, op-amp inputs/outputs) away from digital switching lines and high-current traces. Keep the analog AVSS/VSS connection short and star-grounded near the MCU. Avoid running switching signals under the UQFN's exposed pad to prevent coupled noise into the analog domain.
Estimated: at 32 MHz and 5V with all peripherals active, core current is around 4-6 mA; activating both op amps and the ADC adds approximately 0.5-1 mA per analog block. In sleep with XLP enabled, the device drops below 1 uA — sufficient for years of standby on a CR2032 coin cell. For battery-powered designs, configure the MCU to wake from sleep on a comparator edge or RTC overflow rather than polling to maximize battery life.
When using the on-chip op amps for sensor front-ends, place the feedback network components within a few millimeters of the op-amp input/output pins to minimize parasitic capacitance. Use guarding techniques around high-impedance analog traces. Configure the unused op amp as a unity-gain buffer tied to midscale to prevent noise injection. The 10-bit ADC2 benefits from averaging 16-64 samples for noise-sensitive readings; use the dedicated ADC2 hardware accumulator rather than CPU averaging.
Do not leave the MCLR/VPP pin floating — it must be tied to VDD through a 10 kOhm resistor (or directly to VDD if unused reset is acceptable). Configure unused I/O pins as outputs driven low (not inputs) to minimize current draw. Never apply voltage to any I/O pin before VDD ramps; this can cause latch-up via the ESD diodes. When programming in-circuit, ensure the ICSP pins (RB6/RB7) are not heavily loaded externally, or use isolation resistors per Microchip ICSP guidelines.
규정 준수 정보
Industrial grade only (-40C to +85C). Not AEC-Q100 qualified — not suitable for automotive under-hood applications. RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free per package material declaration.
