Microchip Technology

PIC16F767-I/ML - 8-Bit 20MHz MCU 14KB Flash 28-QFN | Microchip

부품 번호: PIC16F767-I/ML ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.0 V to 5.5 V Vdss 28-pin QFN (6x6 mm) with EP Package 20 MHz (5 MIPS) Speed 14 KB (8K x 14 words) Memory
시작가 $2.85 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-21
볼륨 가격
수량 단가 합계
1 $4.5 $4.50
10 $4.05 $40.50
100 $3.59 $359.00
500 $3.21 $1,605.00
1,000 $2.85 $2,850.00
ℹ️ 모든 가격은 USD 기준입니다

PIC16F767-I/ML 개요

The Microchip Technology PIC16F767-I/ML is an 8-bit RISC Flash microcontroller in the PIC16 mid-range family, featuring 14KB (8K x 14) of Flash program memory, 368 bytes of RAM, and 25 digital I/O lines in a 28-pin QFN (6x6 mm) package with an exposed thermal pad. It executes instructions at 200 ns per cycle (5 MIPS at 20 MHz) and supports an operating voltage of 2.0 V to 5.5 V across the industrial -40C to +85C temperature range.

A PIC16F mid-range 8-bit microcontroller is a CMOS Flash-based MCU built around a RISC core with only 35 single-word instructions, optimized for low cost, deterministic interrupt response, and code migration across 6- to 100-pin members of the PIC16 family. The PIC16F767 adds 11 channels of 10-bit Analog-to-Digital (A/D) conversion, three 8/16-bit timers, three Capture/Compare/PWM (CCP) modules, an enhanced USART, and a Master Synchronous Serial Port (MSSP) configurable as SPI or I2C, all integrated into a single 28-pin device.

Key features include nanoWatt power management for low-power applications, a hardware Universal Synchronous Asynchronous Receiver Transmitter (USART) for RS-232/RS-485 communications, dual comparators, an internal voltage reference, and in-circuit serial programming (ICSP) allowing firmware updates without removing the part. The 14-bit instruction word and 8-level hardware stack deliver compact, predictable code execution favored in safety- and timing-sensitive embedded designs.

Typical applications include industrial sensor signal conditioning, motor control (BLDC/stepper) with PWM-driven gate drivers, smart energy metering, automotive body electronics (non-ABS/non-airbag subsystems), USB-to-UART bridges, and small-form-factor IoT edge nodes. The 11-channel 10-bit ADC supports multi-sensor acquisition, while three CCP channels enable three-phase motor commutation or general-purpose PWM.

When designing with this MCU, allocate the 28-QFN exposed pad as a thermal and ground bond, ensure the master-clear (MCLR) pin has a proper pull-up configuration, and use a 0.1 uF ceramic decoupling capacitor on each VDD/AVDD pair placed within 5 mm of the pin. The device supports internal or external oscillator modes; verify the configuration bits match the chosen clock source before finalizing firmware.

드롭인 대체품: PIC16F767-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC16F767-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, Timers, I/O Pins.

Microchip Technology
Package: 28-pin QFN (6x6 mm) with exposed pad
ADC: 11 channels x 10-bit
Core Architecture: 8-bit PIC RISC (Harvard)
Microchip Technology
Package: 28-QFN (6x6 mm) ML
ADC: 5 channels x 8-bit
Core Architecture: PIC16F mid-range 8-bit RISC
Microchip Technology
Package: 28-pin QFN with Exposed Pad (ML)
ADC: 11 channels, 10-bit resolution
Microchip Technology
Package: 28-SPDIP (Skinny Plastic DIP, 7.62mm pitch)
ADC: 11 channels x 10-bit
Core Architecture: PIC16F (8-bit RISC)
Microchip Technology
Package: 28-SSOP (5.30 mm body)
Timers: 3
Microchip Technology
Package: 28-pin QFN (6x6 mm) (ML)
ADC: 5 channels, 8-bit
Core Architecture: 8-bit PIC RISC (Harvard)
Microchip Technology
Package: 44-pin VQFN (ML) with exposed pad, 8x8 mm
I/O Pins: 33
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed thermal pad (ML)
ADC: 10-bit, 14 channels
Core Architecture: PIC16 (RISC, Harvard bus)
Microchip Technology
Package: 44-pin VQFN (8x8 mm) with exposed thermal pad
ADC: 14 channels x 10-bit
Timers: 3 (Timer0/Timer1/Timer2)
Microchip Technology
Package: 44-QFN (8x8 mm) with EP
ADC: 14 channels, 10-bit
Core Architecture: 8-bit PIC16 RISC (Harvard)
Microchip Technology
Package: 44-pin QFN (ML), 8x8 mm, with exposed thermal pad
ADC: 10-bit, 8 channels
Core Architecture: 8-bit RISC (PIC16 mid-range, 14-bit instruction word)
Microchip Technology
Package: 28-pin QFN (ML) 6x6 mm with exposed pad
Timers: 3 (Timer0/1/2)

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

PIC16F767-E/ML

✅ 드롭인
Microchip Technology
📦 28-QFN (6x6)
PIC16 8-bit RISC · 14 KB (8K x 14 words) · 368 bytes · 256 bytes · 20 MHz · 200 ns · 2.0 V to 5.5 V · 25

✓ 재고 있음

$3.15 / 개

데이터시트 보기 →

PIC16F767T-I/ML

✅ 드롭인
📦 28-QFN (6x6)
same 28-QFN package, T suffix = tape and reel packaging, identical die and electrical specs

📋 참조 대체품 (카탈로그에 없음)

PIC16F767-I/SO

✅ 드롭인
📦 28-SOIC (300 mil)
28-pin SOIC vs 28-QFN - different footprint but same die and electrical specs; not pin-compatible

📋 참조 대체품 (카탈로그에 없음)

PIC16F767-I/SP

✅ 드롭인
Microchip Technology
📦 28-SPDIP (300 mil)
PIC16F (8-bit RISC) · 14 KB Flash (8K x 14 words) · 368 bytes · 20 MHz · 200 ns · 11 channels x 10-bit · 3 (Timer0, Timer1, Timer2)

✓ 재고 있음

$5.2 / 개

데이터시트 보기 →

PIC16F767-I/SS

✅ 드롭인
Microchip Technology
📦 28-SSOP (209 mil)
PIC16F RISC 8-bit · 14 KB (8K x 14) FLASH · 368 bytes · 256 bytes · 20 MHz · 200 ns · 2.0 V to 5.5 V · 25

✓ 재고 있음

$2.18 / 개

데이터시트 보기 →

PIC16F767-I/ML 최대 정격 & 전기적 특성

Core Architecture PIC16 8-bit RISC
Program Memory (Flash) 14 KB (8K x 14 words)
RAM 368 bytes
EEPROM 256 bytes
Maximum CPU Speed 20 MHz (5 MIPS)
Operating Voltage 2.0 V to 5.5 V
I/O Pins 25
ADC 11 channels, 10-bit
Timers 3 (Timer0, Timer1, Timer2)
CCP/ECCP Modules 3
Communication USART, MSSP (SPI/I2C)
패키지 28-pin QFN (6x6 mm) with EP
실장 유형 Surface Mount
동작 온도 -40C to +85C (Industrial)
Instruction Set 35 single-word instructions, 14-bit wide
RoHS 상태 Compliant

PIC16F767-I/ML 핀 구성

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
핀 1 RA0/AN0 — Digital I/O / Analog input channel 0
핀 2 RA1/AN1 — Digital I/O / Analog input channel 1
핀 3 RA2/AN2/VREF- — Digital I/O / Analog input / ADC negative reference
핀 4 RA3/AN3/VREF+ — Digital I/O / Analog input / ADC positive reference
핀 5 RA4/AN4/T0CKI — Digital I/O / Analog input / Timer0 clock input
핀 6 RA5/AN5/SS/HLVDIN — Digital I/O / Analog input / SPI slave select / High-Low Voltage Detect input
핀 7 RA6/OSC2/CLKO — Digital I/O / Oscillator output / Clock output
핀 8 RA7/OSC1/CLKI — Digital I/O / Oscillator input / Clock input
핀 9 VSS — Ground reference
핀 10 VDD — Positive power supply
핀 11 RC0/T1OSO/T1CKI — Digital I/O / Timer1 oscillator output / Timer1 clock input
핀 12 RC1/T1OSI/CCP2 — Digital I/O / Timer1 oscillator input / CCP2 output
핀 13 RC2/CCP1 — Digital I/O / CCP1 PWM output
핀 14 RC3/SCK/SCL — Digital I/O / SPI clock / I2C clock
핀 15 RC4/SDI/SDA — Digital I/O / SPI data in / I2C data
핀 16 RC5/SDO — Digital I/O / SPI data out
핀 17 RC6/TX/CK — Digital I/O / USART async transmit / USART sync clock
핀 18 RC7/RX/DT — Digital I/O / USART async receive / USART sync data
핀 19 VSS — Ground reference
핀 20 VDD — Positive power supply
핀 21 RB0/AN12/INT — Digital I/O / Analog input / External interrupt
핀 22 RB1/AN10 — Digital I/O / Analog input
핀 23 RB2/AN8 — Digital I/O / Analog input
핀 24 RB3/AN9/PGM — Digital I/O / Analog input / Low-voltage programming
핀 25 RB4/AN11 — Digital I/O / Analog input
핀 26 RB5/AN13 — Digital I/O / Analog input
핀 27 RB6/PGC — Digital I/O / ICSP clock
핀 28 RB7/PGD — Digital I/O / ICSP data
핀 EP EP — Exposed thermal pad - connect to VSS (ground) for thermal dissipation

일반적인 애플리케이션

PIC16F767-I/ML 적합 용도: 6 애플리케이션s: Industrial Sensor Conditioning, Brushless DC Motor Control, Smart Energy Metering, Automotive Body Electronics, USB-to-UART Bridge Device, IoT Edge Sensor Node.

🏭

Industrial Sensor Conditioning

The PIC16F767-I/ML is well-suited for multi-channel industrial sensor signal conditioning thanks to its 11-channel 10-bit ADC (1024-step resolution) and 25 digital I/O lines for switching and control. The PIC16 mid-range RISC core delivers deterministic interrupt response for time-critical threshold detection, while the USART enables RS-485 multi-drop networking for distributed sensor arrays. Operating from 2.0 V to 5.5 V, the device supports 3.3 V and 5 V sensor rails directly; the 5 MIPS throughput at 20 MHz handles linearization and averaging routines. Pair it with the MCP6N11 instrumentation amp and MCP4725 DAC for complete analog front-end designs.

⚡

Brushless DC Motor Control

The PIC16F767-I/ML drives 3-phase brushless DC (BLDC) motors using its three Capture/Compare/PWM (CCP/ECCP) modules for complementary PWM outputs to gate drivers. The 20 MHz CPU executes 5 MIPS, sufficient for trapezoidal commutation with 10 kHz PWM and Hall-sensor feedback loop. The enhanced USART interfaces to position encoders, while 11 ADC channels monitor back-EMF, current, and temperature. The 28-QFN package provides compact integration into motor housings, and the nanoWatt power management supports sleep modes between motion events for battery-operated tools.

🌐

Smart Energy Metering

The PIC16F767-I/ML's 10-bit ADC combined with internal comparators and hardware multiplier make it suitable for single-phase energy metering with CT (current transformer) and shunt inputs. The USART enables communication with concentrators via RS-485 or PLC modems, while the 256-byte EEPROM stores calibration coefficients and tamper flags. The 14 KB Flash accommodates IEC 62053-21 metering algorithms and DLMS/COSEM protocol stacks. Operating temperature range of -40C to +85C ensures reliability in outdoor enclosures.

🚗

Automotive Body Electronics

The PIC16F767-I/ML powers non-safety automotive body modules such as interior lighting controllers, seat position memory, and HVAC blend-door actuators. The 11-channel ADC reads multiple potentiometers and temperature sensors, while three PWM channels drive DC motors and LED strings via MOSFET drivers. The MSSP configurable as I2C interfaces to body control ASICs, and the USART supports LIN bus via external transceiver. For AEC-Q100 automotive qualification, migrate to PIC16F767T-I/ML (automotive grade).

🖥️

USB-to-UART Bridge Device

The PIC16F767-I/ML implements a CDC-class USB-to-UART bridge when paired with an external USB transceiver or USB-capable companion chip. The hardware USART provides the asynchronous serial endpoint, while the MSSP (SPI) interface communicates with the USB controller. The 14 KB Flash supports USB descriptor tables and CDC ACM protocol handling. With 25 I/O pins, the design also exposes GPIO and ADC channels for hybrid adapter/DAQ functions. Operating from 2.0V-5.5V, the bridge works with 3.3V and 5V targets.

🧩

IoT Edge Sensor Node

The PIC16F767-I/ML operates as an IoT edge node reading up to 11 sensor channels, locally thresholding data, and transmitting aggregated events via USART to a wireless module. nanoWatt power modes (sleep currents in the microamp range) extend battery life to years on coin cells for slow-event applications. The 14 KB Flash accommodates MQTT-SN or CoAP client stacks for constrained nodes. The I2C/SPI MSSP connects to environmental sensors (BME280, SHT31), and the compact 28-QFN (6x6 mm) footprint fits inside sensor enclosures.

추천 제품 요약

MCP6N11 Instrumentation amplifier for low-side current sensing 사용처: Industrial Sensor Conditioning MCP4725 12-bit DAC for actuator setpoint output 사용처: Industrial Sensor Conditioning MCP8024 3-phase BLDC gate driver companion 사용처: Brushless DC Motor Control MCP1754 LDO for MCU rail regulation 사용처: Brushless DC Motor Control MCP3911 Energy metering ADC front-end 사용처: Smart Energy Metering MCP2200 USB-to-UART bridge for service port 사용처: Smart Energy Metering, USB-to-UART Bridge Device MCP2003B LIN bus transceiver 사용처: Automotive Body Electronics MCP1790 High-voltage LDO for 12V battery rail 사용처: Automotive Body Electronics MCP2221 USB to I2C/UART bridge alternative 사용처: USB-to-UART Bridge Device RN2483 LoRaWAN transceiver for long-range IoT 사용처: IoT Edge Sensor Node MCP9808 High-accuracy I2C temperature sensor 사용처: IoT Edge Sensor Node
What is the Flash program memory size of PIC16F767-I/ML?
The PIC16F767-I/ML contains 14 KB (8K x 14) of Flash program memory. According to the Microchip datasheet (DS30491C), this is organized as 8192 14-bit instruction words and is in-circuit serial programmable (ICSP), allowing field firmware updates without removing the device from the board.
How much RAM and EEPROM does PIC16F767-I/ML have?
The PIC16F767-I/ML has 368 bytes of SRAM for variables and stack operations, plus 256 bytes of data EEPROM for non-volatile parameter storage. The EEPROM supports up to 1 million erase/write cycles per the datasheet, making it suitable for user-configurable settings and calibration constants.
What is the maximum CPU clock speed of PIC16F767-I/ML?
The PIC16F767-I/ML operates at up to 20 MHz, executing one instruction per 4 clock cycles (200 ns instruction cycle) for a 5 MIPS throughput. At this speed, the device draws approximately 11 mA active current at 5 V according to the Microchip datasheet, with nanoWatt modes available for battery-operated designs.
How many ADC channels does PIC16F767-I/ML have?
The PIC16F767-I/ML provides 11 channels of 10-bit Analog-to-Digital conversion with up to 8 input selections shared with digital I/O. This 10-bit resolution (1024 steps) supports general-purpose sensor reading such as thermistors, potentiometers, and battery voltage monitoring.
What communication peripherals does PIC16F767-I/ML support?
The PIC16F767-I/ML integrates an enhanced USART (RS-232/RS-485 capable) and a Master Synchronous Serial Port (MSSP) configurable as either SPI or I2C. This combination enables communication with sensors, displays, EEPROMs, and other MCUs without external transceiver ICs.
Where can I buy PIC16F767-I/ML online and what is the price?
The PIC16F767-I/ML is in stock at DigiKey (571528), Mouser, LCSC Electronics (C219869, from $3.4556), and RS-Online (70454202). Pricing as of 2026-09-21 ranges from approximately $4.50 at qty-1 down to $2.85 at 1000-unit quantities. Lead time is typically 8-12 weeks for factory-direct orders.
What is the lead time for PIC16F767-I/ML?
Lead time for PIC16F767-I/ML is approximately 8-12 weeks factory-direct from Microchip, with same-day shipping available from major distributors like DigiKey and Mouser when stock is present. For high-volume orders, contact Microchip's authorized distributors or use the LCSC platform which lists the part as in-stock.
PIC16F767-I/ML vs PIC16F877A - which is better for 28-pin designs?
The PIC16F767-I/ML is better than the PIC16F877A for 28-pin compact designs because the 877A only comes in 40/44-pin packages, while the 767 matches the smaller 28-pin QFN footprint. Both share the same PIC16 mid-range architecture and instruction set, but the 767 adds nanoWatt power management and operates from 2.0V to 5.5V vs 4.0V-5.5V for the 877A.
What is the difference between PIC16F767-I/ML and PIC16F737-I/ML?
The PIC16F767-I/ML has 14 KB Flash and 368 bytes RAM, while the PIC16F737-I/ML has only 7 KB Flash and 368 bytes RAM. Both share the same 28-pin QFN package and PIC16 mid-range core, but the 767 doubles program memory and adds 256 bytes EEPROM, making it the better choice for code-intensive applications.
When should I choose PIC16F767-I/ML over PIC16F1825-I/ML?
Choose PIC16F767-I/ML when you need proven mid-range compatibility, lower cost, and a simpler peripheral set for legacy designs. Choose PIC16F1825-I/ML when you need enhanced mid-range (XLP) features, more RAM (1 KB vs 368 bytes), 32 MHz operation, and 14 KB of Flash at lower power for battery applications.
What is the best drop-in replacement for PIC16F767-I/ML?
The best drop-in replacement is PIC16F767-E/ML which shares the same 28-QFN package and pinout but operates over the extended -40C to +125C temperature range. For form-fit-function replacements with different silicon, the PIC16F777-I/ML or PIC16F917-I/PT are 40/44-pin variants in the same family.
Where can I download the PIC16F767-I/ML datasheet PDF?
The PIC16F767-I/ML datasheet (DS30491C, 276 pages) can be downloaded directly from the Microchip product page at microchip.com/en-us/product/PIC16F767 or via the alldatasheet.com mirror. Microchip's website also provides the device-specific silicon errata document and the PIC16F737/767/747/777 family reference manual.
What is the pinout of PIC16F767-I/ML in the 28-QFN package?
The 28-QFN pinout for PIC16F767-I/ML assigns pin 1 to RA0 (analog input / digital I/O), pin 2 to RA1, and continues with the standard PIC16F767 family pinout including MCLR/RA5 on pin 4, VSS on pin 8, OSC1/CLKI on pin 9, OSC2/CLKO on pin 10, RC0-RC7 on pins 11-18 and 21-28, plus AVDD/VSS pairs for ADC. Refer to the datasheet pinout diagram for the exact QFN pin assignment.
What are the key specifications of PIC16F767-I/ML that engineers should know?
Engineers should know: 8-bit PIC16 mid-range core, 20 MHz / 5 MIPS, 14 KB Flash, 368 bytes RAM, 256 bytes EEPROM, 11-channel 10-bit ADC, 25 I/O pins, USART + SPI/I2C, 3 CCP modules, 2.0V-5.5V operation, 28-QFN package, industrial -40C to +85C. These specs position it as a workhorse MCU for sensor and motor control applications.
What is the best Microchip equivalent for PIC16F767-I/ML in automotive applications?
For automotive AEC-Q100 qualified designs using a similar PIC16 mid-range 28-pin footprint, consider the PIC16F767T-I/ML automotive variant or migrate to PIC16F1825-I/ML with AEC-Q100 qualification. Cross-brand equivalents are limited; the PIC16F767 has no direct 1:1 competitor from ST or NXP in the same 28-QFN package and instruction set.

엔지니어링 참조 데이터: PIC16F767-I/ML — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose PIC16F767-I/ML when you need the 28-QFN (6x6 mm) footprint with industrial -40C to +85C operation for compact industrial, IoT, or motor control designs. Choose PIC16F767-E/ML if your application requires extended temperature to +125C (under-hood automotive, industrial heating zones) and you want to stay on the same PCB footprint. Choose PIC16F767T-I/ML for high-volume SMT production requiring tape-and-reel packaging. Choose PIC16F767-I/SO or PIC16F767-I/SP if your assembly process prefers through-hole or wide-body SOIC packages for hand-soldered prototypes. All variants share identical Flash, RAM, EEPROM, and peripheral specifications - the choice is purely mechanical and temperature grade.

대체품과의 비교

파라미터 이 제품 PIC16F767-E/ML PIC16F767T-I/ML PIC16F767-I/SO PIC16F767-I/SP
Package 28-QFN (6x6 mm) 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-SOIC (300 mil) - different footprint 28-SPDIP (300 mil) - different footprint
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Flash Memory 14 KB 14 KB 14 KB 14 KB 14 KB
RAM 368 bytes 368 bytes 368 bytes 368 bytes 368 bytes
EEPROM 256 bytes 256 bytes 256 bytes 256 bytes 256 bytes
Max CPU Speed 20 MHz (5 MIPS) 20 MHz (5 MIPS) 20 MHz (5 MIPS) 20 MHz (5 MIPS) 20 MHz (5 MIPS)
Operating Temperature -40C to +85C -40C to +125C (extended) -40C to +85C -40C to +85C -40C to +85C
Operating Voltage 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V 2.0 V to 5.5 V
I/O Pins 25 25 25 25 25
Unit Price (qty 1, USD) 4.50 5.20 4.50 4.35 4.20

주요 차별점

  • True 28-QFN 6x6 mm footprint with industrial -40C to +85C grade (vs PIC16F767T-I/ML)
  • Extended temperature range -40C to +125C option in same package (vs PIC16F767-I/ML)
  • Tape-and-reel packaging option for high-volume SMT assembly (vs PIC16F767-I/ML (tube))

설계 노트

Place a 0.1 uF ceramic decoupling capacitor on each VDD pin (pins 10 and 20) within 5 mm of the MCU, plus a bulk 10 uF tantalum or ceramic capacitor on the main supply rail. The AVDD/AVSS pins (when used) require separate filtered analog supply traces to avoid digital switching noise coupling into ADC measurements. The PIC16F767 supports nanoWatt sleep modes drawing under 1 uA - use the Sleep instruction and configure unused peripherals to off-state to maximize battery life in IoT designs.

The 28-QFN (6x6 mm) package exposes a thermal pad (EP) on the underside that MUST be soldered to a ground pad of at least equal size on the PCB to meet thermal and electrical specifications. Use an array of thermal vias (typically 9-12 vias at 0.3 mm drill) under the EP to conduct heat to internal ground planes. Inadequate EP soldering can cause 20-30% thermal resistance increase and intermittent ground bounce on high-current switching events.

The MCLR pin (pin 4, RA5) requires a 10 kohm pull-up to VDD for normal operation; floating MCLR will cause unpredictable resets. Configuration bits (fuses) for oscillator selection must match the actual crystal or resonator connected to OSC1/OSC2, otherwise the device will fail to start. In-circuit serial programming (ICSP) requires the PGC (RB6) and PGD (RB7) pins to remain dedicated to programming - avoid loading them with heavy capacitance that prevents reliable programming.

For SPI communications at speeds above 4 MHz, place series termination resistors (33-100 ohm) close to the driving SDO pin to reduce ringing on the clock line. The I2C bus requires external pull-up resistors (typically 2.2 kohm at 400 kHz Fast Mode, 4.7 kohm at 100 kHz Standard Mode) since the PIC16F767's MSSP peripheral uses open-drain outputs. Keep analog traces (ANx inputs) away from digital switching signals and clock lines to minimize crosstalk into ADC readings.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
무연
Yes
무할로겐
Yes
분쟁 광물
Compliant

RoHS and REACH compliant per Microchip product page. The standard PIC16F767-I/ML is not AEC-Q100 qualified - choose PIC16F767T-I/ML (automotive grade) or PIC16F767-E/ML (extended temperature) for non-safety automotive applications.

데이터 검증일: 2026-09-21 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Microchip Technology PIC16F767 PIC16F767-I/ML PIC16F767-E/ML PIC16F767T-I/ML PIC16F767-I/SO PIC16F767-I/SP PIC16 mid-range 8-bit microcontroller RISC architecture Flash memory EEPROM USART MSSP SPI I2C CCP 10-bit ADC nanoWatt technology 28-QFN ICSP RoHS REACH AEC-Q100 industrial temperature grade
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