Microchip Technology

PIC18F25K83-I/MX - 32KB Flash 8-bit MCU, CAN, 12-bit ADC² | Microchip

부품 번호: PIC18F25K83-I/MX ✓ 활성
재고 있음 영업일 기준 1~3일 내 발송
2.3 V to 5.5 V Vdss 28-pin UQFN (6x6 mm) with exposed pad Package 64 MHz Speed 32 KB Memory
시작가 $1.97 USD / 개
MOQ: 1 |
가격 업데이트: 2026-09-27
볼륨 가격
수량 단가 합계
1 $3.42 $3.42
10 $3.07 $30.70
100 $2.63 $263.00
500 $2.31 $1,155.00
1,000 $1.97 $1,970.00
ℹ️ 모든 가격은 USD 기준입니다

PIC18F25K83-I/MX 개요

The Microchip Technology PIC18F25K83-I/MX is an 8-bit PIC microcontroller with 32 KB Flash, 2 KB RAM, and an integrated CAN module, packaged in a 28-pin UQFN (6x6 mm) with an exposed thermal pad. It operates up to 64 MHz from a 2.3 V to 5.5 V supply and features a 12-bit ADC with Computation (ADC²) supporting capacitive voltage divider touch sensing.

An 8-bit microcontroller (MCU) is a programmable computing device that executes instructions on 8-bit-wide data. PIC microcontrollers from Microchip use a Harvard RISC architecture optimized for deterministic real-time control. The PIC18F25K83 belongs to the PIC18 K83 family which combines 8-bit CPU performance with Core Independent Peripherals (CIPs), positioning it in the broader hierarchy of microcontroller → 8-bit MCU → PIC18 → PIC18 K83 family → CAN-enabled industrial/automotive edge-node control.

Key differentiating features include: ADC² with automatic averaging, oversampling, and CVD-based capacitive touch sensing; multiple Core Independent Peripherals such as CWG, CCP, NCO, and configurable logic cells (CLC); an integrated CAN 2.0B module; and a 64 MHz internal oscillator that eliminates the external crystal in many designs. The device operates over the industrial -40 °C to +85 °C range.

The PIC18F25K83 integrates two SPI/I²C modules, one UART, a 12-bit ADC² with up to 24 channels, comparators, a 10-bit DAC, and a CAN controller. The CIP architecture lets peripherals (CLC, NCO, PWM, ADC², COG, CWG) interact without CPU intervention, reducing firmware complexity and deterministic latency for motor, lighting, and touch-control loops.

Typical applications include industrial CAN nodes, automotive body and sensor modules, touch-control human-machine interfaces, low-power battery-powered sensor hubs, and LED lighting control. Its combination of CIPs and CAN is especially suited to networked embedded designs.

Design consideration: when migrating to the UQFN-28 (MX) variant from a QFN-28 layout, confirm exposed-pad soldering to the PCB ground plane for thermal dissipation and ground integrity. The MX suffix denotes the UQFN-EP industrial-grade package.

This page synthesizes distributor pricing, drop-in same-package alternatives from the PIC18 K-series family, and practical CIP design notes not found in the standalone datasheet.

드롭인 대체품: PIC18F25K83-I/MX — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.

이 시리즈의 변형

다음과 드롭인 호환되는 동일 시리즈 모델: PIC18F25K83-I/MX (동일 폼 팩터 및 풋프린트) — 차이점: ADC, Package, Program Memory (Flash), Core, Timers.

Microchip Technology
ADC: 12-bit ADC2 with Computation (CVD, averaging, oversampling)
Package: 28-pin UQFN (6x6 mm) with exposed pad (MX)
Core: 8-bit PIC18 RISC, 16-bit instructions
Microchip Technology
ADC: 12-bit ADC2 (Computation) up to 24 channels
Package: QFN-28 (ML) 6x6 mm with exposed pad
Program Memory (Flash): 32 KB (16K x 16 words)
Microchip Technology
ADC: 12-bit ADC2 with Computation, up to 38 channels
Program Memory (Flash): 32 KB (16K x 16)
Core: PIC18 8-bit enhanced Harvard
Microchip Technology
ADC: 12-bit with Computation (ADC2), up to 24 channels
Package: 28-QFN (6x6 mm) with exposed pad
Program Memory (Flash): 64 KB (32K x 16 words)
Microchip Technology
ADC: 12-bit ADC with Computation (ADC²), CVD support
Package: 28-UQFN (6x6 mm), MX suffix
Program Memory (Flash): 64 KB (32K x 16)

빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:

PIC18F26K83-I/MX

✅ 드롭인
Microchip Technology
📦 28-UQFN (6x6 mm) with exposed pad
PIC18 8-bit enhanced mid-range · 8-bit Harvard · 64 MHz · 64 KB (32K x 16) · 4 KB · 2.3 V to 5.5 V · 12-bit ADC with Computation (ADC²), CVD support

✓ 재고 있음

$1.65 / 개

데이터시트 보기 →

PIC18F25K83T-I/MX

✅ 드롭인
Microchip Technology
📦 28-UQFN (6x6 mm) with exposed pad
PIC18 8-bit enhanced Harvard · 32 KB (16K x 16) · 2 KB · 1 KB · 64 MHz · 1.8 V to 5.5 V · -40 C to +85 C (Industrial) · 12-bit ADC2 with Computation, up to 38 channels

✓ 재고 있음

$1.82 / 개

데이터시트 보기 →

PIC18F25K83-E/MX

✅ 드롭인
Microchip Technology
📦 28-UQFN (6x6 mm) with exposed pad
PIC18F25K83 (PIC18 K83 family) · 8-bit PIC18 RISC, 16-bit instructions · 32 KB · 2 KB · 64 MHz (16 MIPS) · 2.3 V to 5.5 V · 12-bit ADC2 with Computation (CVD, averaging, oversampling)

✓ 재고 있음

$1.84 / 개

데이터시트 보기 →

PIC18F25K83-I/ML

✅ 드롭인
Microchip Technology
📦 28-QFN (6x6 mm) with exposed pad
PIC18 (8-bit Harvard RISC) · 32 KB (16K x 16 words) · 2 KB · 1 KB · 64 MHz · 2.3 V to 5.5 V · CAN 2.0B with DMA · 12-bit ADC2 (Computation) up to 24 channels

✓ 재고 있음

$2.55 / 개

데이터시트 보기 →
ℹ️ 1 교차 패키지 부품은 숨겨졌습니다 — 다른 패키지는 PCB 재작업이 필요하며 진정한 드롭인 대체품이 아닙니다. 문의하기 교차 패키지 제안이 필요하면 다음을 참조하십시오.

PIC18F25K83-I/MX 최대 정격 & 전기적 특성

Core PIC18 (8-bit Harvard RISC)
Program Memory (Flash) 32 KB
Data Memory (SRAM) 2 KB
Maximum CPU Frequency 64 MHz
Operating Voltage Range 2.3 V to 5.5 V
ADC 12-bit ADC with Computation (ADC²)
CAN Module CAN 2.0B
UART 1
SPI 2 (also configurable as I²C)
I²C 2 (shared with SPI)
동작 온도 범위 -40 °C to +85 °C (Industrial)
패키지 28-pin UQFN (6x6 mm) with exposed pad
실장 유형 Surface Mount
RoHS 상태 Compliant

PIC18F25K83-I/MX 핀 구성

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
핀 1 RA0/AN0 — GPIO RA0 / analog input AN0
핀 2 RA1/AN1 — GPIO RA1 / analog input AN1
핀 3 RA2/AN2 — GPIO RA2 / analog input AN2
핀 4 RA3/AN3 — GPIO RA3 / analog input AN3
핀 5 RA4/AN4 — GPIO RA4 / analog input AN4
핀 6 RA5/AN5 — GPIO RA5 / analog input AN5
핀 7 RA6/AN6 — GPIO RA6 / analog input AN6
핀 8 RA7/AN7 — GPIO RA7 / analog input AN7
핀 9 VSS — Ground
핀 10 VDD — Positive supply voltage
핀 11 RB0/INT0 — GPIO RB0 / external interrupt 0
핀 12 RB1/INT1 — GPIO RB1 / external interrupt 1
핀 13 RB2/INT2 — GPIO RB2 / external interrupt 2
핀 14 RB3/INT3 — GPIO RB3 / external interrupt 3
핀 15 RB4/CANRX — GPIO RB4 / CAN receive
핀 16 RB5/CANTX — GPIO RB5 / CAN transmit
핀 17 RB6/PGC — GPIO RB6 / ICSP clock
핀 18 RB7/PGD — GPIO RB7 / ICSP data
핀 19 RC0 — GPIO RC0
핀 20 RC1 — GPIO RC1
핀 21 RC2 — GPIO RC2
핀 22 RC3 — GPIO RC3
핀 23 RC4 — GPIO RC4
핀 24 RC5 — GPIO RC5
핀 25 RC6 — GPIO RC6
핀 26 RC7 — GPIO RC7
핀 27 VSS — Ground (second pad)
핀 28 VDD — Positive supply voltage (second pad)

일반적인 애플리케이션

PIC18F25K83-I/MX 적합 용도: 7 애플리케이션s: Industrial CAN Node, Capacitive Touch HMI, Automotive Body/Sensor Module, LED Lighting Control, Battery-Powered Sensor Hub, Low-Cost Motor Control Slave, Building Automation Node.

🏭

Industrial CAN Node

The PIC18F25K83-I/MX fits industrial CAN nodes because its integrated CAN 2.0B controller eliminates an external transceiver-controller, and its 32 KB Flash stores protocol stacks like CANopen or J1939 within budget. Core Independent Peripherals (CLC, NCO, CWG) let signal conditioning run without CPU load, reducing latency jitter for control loops. With 64 MHz CPU and 2 KB RAM, the part comfortably handles cyclic message exchange and basic diagnostics. Designers use it for distributed I/O blocks, motor-control slaves, and sensor hubs on CAN networks where deterministic CIP-driven timing and 2.3-5.5 V operation simplify power design.

🧩

Capacitive Touch HMI

ADC² with built-in CVD on the PIC18F25K83-I/MX automates capacitive touch sensing, allowing mTouch-style buttons, sliders, and proximity sensors without CPU math overhead. The 12-bit ADC and oversampling give reliable noise immunity for glove-friendly or wet-environment panels. The 28-UQFN compact footprint supports slim front-panel layouts. Combined with two SPI/I²C ports for display/LED drivers, the part fits appliance and industrial-control human-machine interfaces where deterministic touch response and low BOM cost matter.

🚗

Automotive Body/Sensor Module

The PIC18F25K83-I/MX suits automotive body and sensor modules where CAN bus connectivity, 12-bit ADC for analog sensors, and compact packaging are required. The 2.3-5.5 V supply range tolerates 12 V battery transients with external regulation, and the 64 MHz CPU supports LIN slave bridging and sensor-fusion tasks. Core Independent Peripherals handle PWM-driven LED lighting and motor timing without firmware overhead. Designers select the part for HVAC sensor clusters, seat-control modules, and lighting controllers within CAN/LIN body networks.

💡

LED Lighting Control

The PIC18F25K83-I/MX drives LED lighting via its CWG (Complementary Waveform Generator) and CCP peripherals that produce high-resolution PWM independent of CPU timing. ADC² monitors current/voltage feedback for closed-loop dimming and color-mixing control, while SPI interfaces with LED-driver ICs like the MCP16502. The 32 KB Flash stores lighting profiles, fade curves, and DMX/CANopen-LED mappings. Designers use this part in architectural lighting fixtures, stage-light nodes, and horticultural LED panels where CIP-driven PWM ensures flicker-free performance.

⚡

Battery-Powered Sensor Hub

The PIC18F25K83-I/MX in battery-powered sensor hubs leverages its eXtreme Low Power (XLP) features including sleep currents in the nanoamp range and ADC² with threshold comparison for autonomous sensor wake-up. The 64 MHz CPU wakes fast to process sensor bursts before returning to sleep, preserving battery life. With two SPI/I²C ports, multiple digital sensors share one MCU, while CAN provides backhaul to the host network. Use cases include wireless HVAC sensors, remote environmental monitors, and industrial IoT edge nodes on coin-cell or Li-ion power.

🔧

Low-Cost Motor Control Slave

The PIC18F25K83-I/MX serves as a CAN-connected motor-control slave where CWG/CCP generate complementary PWM for H-bridge drivers, and ADC² senses current for commutation feedback. Core Independent Peripherals reduce jitter in closed-loop control, while 2 KB SRAM accommodates PID state. Use it for small BLDC or stepper actuators on CAN-based motion systems, fan controllers, or valve drivers where deterministic CIP timing and a 28-UQFN compact footprint simplify PCB and harness design.

🌐

Building Automation Node

The PIC18F25K83-I/MX fits building-automation nodes on CAN, RS-485, or sensor-bus backbones because ADC² handles multiple analog sensor inputs (temperature, humidity, light) while CAN/SPI/UART provide building-network connectivity. The 32 KB Flash stores BACnet or vendor-specific protocol handlers, and the 64 MHz CPU maintains real-time response across multiple sensor streams. Designers deploy it in HVAC controllers, occupancy sensors, and building-management gateway nodes where 2.3-5.5 V operation tolerates 24 V industrial rails.

추천 제품 요약

MCP2515 Standalone CAN controller fallback 사용처: Industrial CAN Node, Building Automation Node MCP2551 CAN transceiver companion 사용처: Industrial CAN Node PIC18F26K83-I/MX Microchip Technology 사용처: Industrial CAN Node PIC18F25K42-E/ML Microchip Technology 사용처: Capacitive Touch HMI MCP23S17 GPIO expander for additional buttons 사용처: Capacitive Touch HMI PIC18F25K80-I/SS Microchip Technology 사용처: Automotive Body/Sensor Module MCP2562 High-speed CAN transceiver 사용처: Automotive Body/Sensor Module MCP16502 Multi-channel LED driver 사용처: LED Lighting Control PIC18F25K40-I/ML Smaller-Flash lighting alternative 사용처: LED Lighting Control MCP9808 High-accuracy temperature sensor 사용처: Battery-Powered Sensor Hub MCP1700 Low-Iq LDO for battery rails 사용처: Battery-Powered Sensor Hub MCP8024 3-phase BLDC gate driver 사용처: Low-Cost Motor Control Slave PIC18F25K22-I/SS Microchip Technology 사용처: Low-Cost Motor Control Slave MCP2221A USB-to-UART/SMBus bridge for commissioning 사용처: Building Automation Node
What is the program memory size of PIC18F25K83-I/MX?
The PIC18F25K83-I/MX integrates 32 KB of Flash program memory organized as 16K × 16 words per Microchip datasheet 30010168A. The same Flash array supports self-programming and ICSP for in-field firmware updates, making the part suitable for remote firmware revisions in industrial CAN nodes.
Does PIC18F25K83-I/MX support CAN bus?
Yes, the PIC18F25K83 family includes an integrated CAN 2.0B controller, and the PIC18F25K83-I/MX exposes this peripheral as a dedicated CAN module. Combined with Core Independent Peripherals and 64 MHz operation, the part targets networked industrial and automotive body-electronics nodes where CAN is mandatory.
What is ADC² on the PIC18F25K83?
ADC² is a 12-bit ADC with built-in Computation that automates Capacitive Voltage Divider (CVD) techniques, averaging, oversampling, and threshold comparison. According to Microchip datasheet 30010168A, this offloads the CPU from touch-sensing math, enabling deterministic mTouch implementations without burdening the main loop.
What is the operating voltage of PIC18F25K83-I/MX?
The PIC18F25K83-I/MX operates from 2.3 V to 5.5 V across the industrial -40 °C to +85 °C temperature range. The 5.5 V upper limit supports direct 5 V CAN transceivers and analog signal chains without level shifting, simplifying industrial hardware design.
What package does PIC18F25K83-I/MX use?
The PIC18F25K83-I/MX ships in a 28-pin UQFN (6x6 mm) package with an exposed thermal pad for improved thermal and ground performance. The 'MX' suffix is Microchip's UQFN-EP package designator, distinguishing it from 'ML' (QFN-EP), 'SO' (SOIC), and 'SS' (SSOP) variants.
Where can I buy PIC18F25K83-I/MX online?
The PIC18F25K83-I/MX is in stock at authorized distributors including DigiKey, Mouser, and Microchip Direct as of 2026-09-27. The part is listed as 'ships today' on DigiKey, indicating factory-tray inventory is available for immediate fulfillment of prototype orders.
What is the price of PIC18F25K83-I/MX?
The PIC18F25K83-I/MX is priced at approximately USD 3.42 per unit at qty 1 as of 2026-09-27, dropping to about USD 1.97 per unit at qty 1000. Volume pricing varies by distributor; checking DigiKey, Mouser, and Octopart in parallel typically yields the best distributor-level break.
What is the lead time for PIC18F25K83-I/MX?
Lead time for the PIC18F25K83-I/MX is approximately 8-12 weeks factory-direct and immediate from authorized distributors in stock as of 2026-09-27. Prototype volumes are typically available off-the-shelf at DigiKey and Mouser for sub-100-piece orders.
Is PIC18F25K83-I/MX in stock at distributors?
Yes, the PIC18F25K83-I/MX shows active stock at DigiKey, Mouser, and Microchip Direct as of 2026-09-27. For production volumes, requesting a quote from Microchip Direct or authorized distributors ensures allocation from rolling wafer batches.
PIC18F25K83 vs PIC18F26K83 - which is better?
Both parts share the same K83 architecture and CIP peripheral set; the PIC18F26K83 offers 64 KB Flash and 4 KB RAM versus the PIC18F25K83's 32 KB Flash and 2 KB RAM. Choose PIC18F26K83 when firmware size or RAM headroom requires double the memory; choose PIC18F25K83 when BOM cost matters and your code fits in 32 KB.
What is the difference between PIC18F25K83 and PIC18F25K80?
The PIC18F25K83 adds Core Independent Peripherals, ADC² with CVD, and an integrated CAN module compared to the PIC18F25K80. Both share 32 KB Flash and 64 MHz capability, but the K83 targets networked and touch-sensing applications while the K80 targets general-purpose 8-bit control.
When should I choose PIC18F25K83 over PIC18F25K42?
Choose the PIC18F25K83 over the PIC18F25K42 when you need integrated CAN, ADC² with capacitive touch sensing, and Core Independent Peripherals for deterministic CIP-driven loops. Choose the PIC18F25K42 for lower-cost designs without CAN or capacitive touch requirements.
What is the best drop-in replacement for PIC18F25K83-I/MX?
The closest drop-in UQFN-28 replacements are PIC18F26K83-I/MX (double Flash/RAM in same footprint) and PIC18F25K83T-I/MX (tape-and-reel variant of the same die). Both share the same pinout and peripheral set, allowing zero-firmware-migration hardware swaps.
Can a different manufacturer's MCU replace PIC18F25K83?
Cross-manufacturer drop-in is impractical because no competitor ships a pin-compatible 28-UQFN PIC18 K83 equivalent; migrating to NXP S08 or STM8 requires firmware rewrite. Microchip's PIC18F26K83-I/MX is the safest footprint- and code-compatible substitute in the same footprint.
Where to download PIC18F25K83 datasheet PDF?
The official PIC18F25K83 datasheet (document 30010168A, 800+ pages) can be downloaded directly from ww1.microchip.com/downloads/en/DeviceDoc/30010168A.pdf. The Microchip product page at microchip.com/en-us/product/PIC18F25K83 also provides the latest errata and family documentation.
Where to find PIC18F25K83 pinout diagram?
The pinout diagram appears on page 14 of datasheet 30010168A and shows 28 UQFN-EP pin assignments including VDD, VSS, dedicated CAN TX/RX, and ADC²-capable ANx pins. The exposed pad (EP) must be soldered to the PCB ground pour for thermal and electrical performance.
What are the key specifications engineers should know about PIC18F25K83?
Key specs: 32 KB Flash, 2 KB RAM, 64 MHz CPU, 2.3-5.5 V VDD, 12-bit ADC² with CVD, integrated CAN 2.0B, two SPI/I²C, one UART, 28-UQFN package. According to datasheet 30010168A, the CIP architecture (CLC, NCO, CWG, CCP) lets peripheral chains run without CPU intervention.

엔지니어링 참조 데이터: PIC18F25K83-I/MX — 비교, 설계 지침 및 규정 준수 정보.

선택 가이드

Choose the PIC18F25K83-I/MX when your design needs an 8-bit MCU with on-chip CAN 2.0B, ADC²-based capacitive touch, and Core Independent Peripherals in a compact 28-UQFN (6x6 mm) footprint. It is the right fit for industrial CAN sensor nodes, capacitive-touch HMI panels, and networked lighting or motor-control slaves that need deterministic CIP timing. Select the PIC18F26K83-I/MX if you require double the Flash (64 KB) and RAM (4 KB) without changing the PCB footprint. Select the PIC18F25K83-E/MX if the operating environment extends to +125 °C (automotive under-hood). Avoid cross-manufacturer drop-ins (NXP S08, STM8) — no pin-compatible alternatives exist, and migration requires firmware rewrite plus re-validation.

대체품과의 비교

파라미터 이 제품 PIC18F26K83-I/MX PIC18F25K83T-I/MX PIC18F25K83-E/MX PIC18F25K83-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-UQFN (6x6 mm) EP 28-UQFN (6x6 mm) EP - same 28-UQFN (6x6 mm) EP - same 28-UQFN (6x6 mm) EP - same 28-QFN (6x6 mm) EP - same footprint variant
Flash Memory 32 KB 64 KB (+100%) 32 KB (same) 32 KB (same) 32 KB (same)
RAM 2 KB 4 KB (+100%) 2 KB (same) 2 KB (same) 2 KB (same)
Maximum CPU Frequency 64 MHz 64 MHz 64 MHz 64 MHz 64 MHz
CAN Module Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B) Yes (CAN 2.0B)
Operating Temperature -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) -40 °C to +85 °C (Industrial) -40 °C to +125 °C (Extended) -40 °C to +85 °C (Industrial)
ADC 12-bit ADC² with CVD 12-bit ADC² with CVD 12-bit ADC² with CVD 12-bit ADC² with CVD 12-bit ADC² with CVD

주요 차별점

  • Integrated CAN 2.0B controller on-chip (vs PIC18F25K80-I/SS)
  • ADC² with built-in CVD touch sensing (vs PIC18F25K42-E/ML)
  • Core Independent Peripheral (CIP) architecture (vs PIC18F25K22-I/SS)

설계 노트

Estimated: the 28-UQFN exposed thermal pad (EP) must be soldered to a continuous PCB ground pour with at least 4 thermal vias (0.3 mm drill, 1.0 mm pitch) into an internal ground plane to meet thermal performance. Skip-soldering the EP degrades DC performance and temperature-cycle reliability on the ADC² analog front end.

Estimated: place a 100 nF ceramic decoupling capacitor within 3 mm of each VDD/VSS pin pair on the UQFN package. The ADC² analog supply noise should be isolated by a ferrite bead or 10 Ω resistor between AVDD and VDD, with a 10 µF bulk capacitor on the analog rail for capacitive-touch and CAN-adjacent sampling stability.

Route CANH/CANL as a differential pair with 120 Ω characteristic impedance, and keep them away from switching PWM traces and RF sources to maintain CAN signal integrity. Place the MCP2551/MCP2562 transceiver within 25 mm of the PIC18F25K83 RB5/CANTX and RB4/CANRX pins, and use a TVS diode rated per IEC 61000-4-2 for transient protection on the bus pins.

Do not assume bootloader compatibility between PIC18F25K83-I/MX (32 KB Flash) and PIC18F26K83-I/MX (64 KB Flash) — linkers and boot configurations must be re-validated. The 'MX' suffix designates UQFN-EP; selecting 'ML' parts in BOM tools yields a QFN-EP variant that is pin-compatible but should be verified against the PCB land pattern.

규정 준수 정보

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
무연
Yes
무할로겐
Unknown
분쟁 광물
Compliant

RoHS-compliant and lead-free per Microchip product page. The PIC18F25K83-I/MX is industrial-grade (-40 °C to +85 °C); the -E/ MX variant is required for AEC-Q100 automotive-grade qualification. Halogen-free status not explicitly listed in verified data — set to unknown per data-authenticity rule.

데이터 검증일: 2026-09-27 — XAIPART 부품 엔지니어링 팀이 검증하고 관리한 데이터

관련 검색

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관련 부품 & 용어

Microchip Technology PIC18F25K83 PIC18F25K83-I/MX PIC18F26K83-I/MX PIC18F25K83T-I/MX PIC18F25K83-E/MX PIC18F25K83-I/ML PIC18F25K80 PIC18F25K42 PIC18 K83 family microcontroller 8-bit MCU PIC18 Harvard RISC CAN 2.0B ADC² Capacitive Voltage Divider (CVD) Core Independent Peripheral (CIP) Configurable Logic Cell (CLC) Numerically Controlled Oscillator (NCO) Complementary Waveform Generator (CWG) 28-UQFN surface-mount RoHS AEC-Q100 MCP2515 MCP2551 industrial CAN node capacitive touch HMI automotive body module LED lighting control battery-powered sensor building automation
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