PIC18F65K80-I/MR - 8-bit MCU, 32KB Flash, ECAN, 64-VQFN | Microchip
부품 번호: PIC18F65K80-I/MR ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $5.62 | $5.62 |
| 10 | $5.05 | $50.50 |
| 100 | $4.31 | $431.00 |
| 500 | $3.68 | $1,840.00 |
| 1,000 | $3.12 | $3,120.00 |
PIC18F65K80-I/MR 개요
An 8-bit microcontroller (MCU) is a self-contained computing element that integrates a CPU, non-volatile program memory, volatile data memory, and configurable peripherals on a single silicon die. Within the broader hierarchy, the PIC18F65K80 belongs to the 8-bit MCU class -> PIC18 family -> PIC18F K-series sub-family -> Microcontroller IC category -> Embedded semiconductor. The 'K80' suffix denotes the ECAN-enabled, XLP low-power variant; the '65' pin-count designator selects the 64-pin package family.
Key features include an integrated ECAN module with six programmable receive/transmit buffers and three dedicated transmit buffers, a 12-bit ADC (up to 12 channels depending on package), a CTMU (Charge Time Measurement Unit) for capacitive touch and precise time measurement, nanoWatt XLP sleep currents below 100 nA typical, and multiple serial interfaces (UART, SPI, I2C) suitable for sensor and actuator nodes. The integrated ECAN eliminates the need for an external CAN transceiver controller in node applications.
The device uses a Harvard-architecture enhanced RISC core with 16-bit opcodes fetched from 32 KB Flash, dual-pointer indirect addressing, and a hardware multiplier. It supports in-circuit serial programming (ICSP) and in-circuit debugging (ICD) via Microchip's MPLAB X IDE with PICKit or ICD debug probes.
Typical applications include automotive body and gateway ECUs, building automation controllers, elevator control systems, industrial CAN nodes, sensor hubs, and any 1.8-5.5 V embedded design requiring ECAN connectivity with low standby current. When designing with this MCU, plan for a stable VDD decoupling network (1x 100 nF + 1x 10 µF per VDD pin pair) and connect the exposed thermal pad to the ground plane to meet the package's thermal performance. The CTMU peripheral requires a current source calibration step for accurate capacitive measurements.
This page synthesizes verified distributor pricing, drop-in package alternatives from the same PIC18 K-series family, and practical design notes that are not consolidated in the Microchip datasheet alone, giving procurement and firmware engineers a single reference for sourcing decisions.
드롭인 대체품: PIC18F65K80-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18F65K80-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, Operating Temperature, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18F66K80-I/MR
✅ 드롭인✓ 재고 있음
$4.14 / 개
데이터시트 보기 →PIC18F65K40-I/MR
✅ 드롭인✓ 재고 있음
$2.3 / 개
데이터시트 보기 →PIC18F65K80-I/MRVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F65K80T-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F66K80-I/MRVAO
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F65K80-I/MR 최대 정격 & 전기적 특성
| Product Family | PIC® XLP™ 18K (PIC18F K-series) |
| Core | 8-bit PIC18 enhanced RISC |
| Maximum CPU Speed | 64 MHz (16 MIPS) |
| Program Flash Memory | 32 KB (16K x 16) |
| RAM | 3.6 KB (3.6K x 8) |
| EEPROM | 1 KB |
| Supply Voltage (VDD) | 1.8 V to 5.5 V |
| Number of I/O Pins | 54 |
| 패키지 | 64-VQFN (9x9 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| CAN Module | ECAN™ (Enhanced CAN, 6 RX / 3 TX buffers) |
| ADC | 12-bit, multi-channel |
| Special Peripherals | CTMU (Charge Time Measurement Unit) |
| Communication Peripherals | UART, SPI, I2C |
| Low-Power Technology | nanoWatt XLP (sub-100 nA sleep typical) |
| Operating Temperature (I grade) | -40°C to +85°C (industrial) |
| Programming/Debug | ICSP + ICD (MPLAB X, PICKit, ICD) |
| RoHS 상태 | Compliant |
PIC18F65K80-I/MR 64-vqfn (9x9 mm) with exposed pad 핀 구성 가이드
PIC18F65K80-I/MR(64-vqfn (9x9 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC18F65K80-I/MR.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC18F65K80-I/MR 적합 용도: 7 애플리케이션s: Automotive Body and Gateway ECU, Building Automation and HVAC Controllers, Industrial CAN Sensor Nodes, Medical Patient Monitoring Peripherals, Elevator Control and Drive Interface, Low-Power IoT and Sensor Hubs, Battery-Operated Portable Instruments.
Automotive Body and Gateway ECU
The PIC18F65K80-I/MR is an excellent fit for automotive body and gateway ECUs thanks to its integrated ECAN module, nanoWatt XLP sleep currents below 100 nA typical, and 1.8-5.5 V supply tolerance for direct battery connection. The on-chip ECAN with 6 RX and 3 TX programmable buffers handles bus arbitration and message filtering without an external controller, reducing BOM cost and PCB area. With 32 KB Flash it runs CANopen, J1939 light stacks, or proprietary gateway firmware; 3.6 KB RAM supports typical routing tables. The 12-bit ADC and CTMU enable sensor diagnostics for body modules.
추천
Building Automation and HVAC Controllers
For building automation, HVAC, and elevator controllers, the PIC18F65K80-I/MR combines ECAN for BACnet or vendor-proprietary building bus, low standby power for always-on sensor nodes, and 54 I/O for actuator interfaces. nanoWatt XLP technology keeps wall-sensor sleep current under 100 nA, extending battery life on wireless bridges. The CTMU peripheral simplifies capacitive touch keypads for thermostats and access panels. Industrial -40C to +85C operating range handles unconditioned electrical rooms.
추천
Industrial CAN Sensor Nodes
In industrial CAN sensor nodes, the PIC18F65K80-I/MR offers the ECAN peripheral plus 12-bit ADC and CTMU in a compact 9x9 mm VQFN that fits DIN-rail sensor heads. The 32 KB Flash accommodates CANopen or DeviceNet slave stacks; 3.6 KB RAM is sufficient for process-data buffers. XLP nanoWatt mode reduces idle power in loop-powered 4-20 mA sensor heads. Its 1.8 V minimum supply supports energy-harvested sensors with supercap buffers.
추천
Medical Patient Monitoring Peripherals
The PIC18F65K80-I/MR suits medical peripheral designs where low standby current and an integrated ADC + CTMU matter. The 12-bit ADC reads temperature, SpO2, and battery sense signals; CTMU enables touch controls for handheld patient monitors. nanoWatt XLP keeps battery drain below 100 nA in sleep, preserving shelf life. While the MCU lacks IEC 60730 medical-grade certification by default, design teams commonly pair it with safety MCUs in dual-processor architectures.
추천
Elevator Control and Drive Interface
Elevator control panels and drive interfaces benefit from the PIC18F65K80-I/MR's 54 I/O count, ECAN connectivity for floor-network communication, and CTMU for touch-button panels. The 16 MIPS throughput handles floor-level dispatch logic and indicator multiplexing without a DSP. Industrial temperature range and the 64-VQFN's compact footprint fit behind panel faceplates where board area is constrained.
추천
Low-Power IoT and Sensor Hubs
The PIC18F65K80-I/MR is a strong fit for battery-powered IoT sensor hubs needing ECAN backhaul, local sensor processing, and multi-year standby. nanoWatt XLP achieves deep-sleep currents below 100 nA, allowing coin-cell sensor nodes to last >5 years on a typical duty cycle. The 12-bit ADC and CTMU combine to read battery voltage and capacitive humidity/touch inputs simultaneously. UART/SPI/I2C peripherals connect to sub-GHz radio modules like NRF or LoRa transceivers for hybrid IoT gateways.
추천
Battery-Operated Portable Instruments
Portable test and measurement instruments benefit from the PIC18F65K80-I/MR's 1.8 V minimum supply (single Li-ion cell compatibility), 16 MIPS throughput for real-time DSP, and nanoWatt XLP sleep mode that extends battery life between user measurements. The 12-bit ADC with internal voltage reference provides calibrated measurements without external precision components. CTMU enables capacitive buttons and rotary encoders without mechanical switches.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18F65K80-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18F66K80-I/MR | PIC18F65K40-I/MR | PIC18F65K80-I/MRVAO | PIC18F65K80T-I/MR | PIC18F66K80-I/MRVAO |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) | 64-VQFN (9x9) |
| Flash Memory | 32 KB | 64 KB | 32 KB | 32 KB | 32 KB | 64 KB |
| RAM | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB | 3.6 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| Maximum CPU Speed | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS | 64 MHz / 16 MIPS |
| ECAN Module | Yes (6 RX / 3 TX buffers) | Yes | No (MCCP/SCCP instead) | Yes | Yes | Yes |
| Operating Voltage | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V | 1.8 V to 5.5 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Automotive) | -40C to +85C | -40C to +125C (Automotive) |
| Unit Price (qty 1000) | $3.12 (approx, as of 2026-10-09) | $3.50 (approx, higher Flash cost) | $3.05 (approx, newer family) | $4.10 (approx, automotive) | $3.12 (approx, same die, T&R) | $4.55 (approx, automotive) |
주요 차별점
- Doubled Flash for upgrade headroom (vs PIC18F66K80-I/MR)
- Newer CWG/WWDT/CRC peripherals (vs PIC18F65K40-I/MR)
- Automotive temperature grade option (vs PIC18F65K80-I/MRVAO)
설계 노트
Place one 100 nF ceramic bypass capacitor within 3 mm of every VDD/VDDCORE pin pair, plus one 10 µF bulk capacitor near the package. The exposed thermal pad is internally bonded to ground - solder it to a continuous top-layer ground plane with multiple stitched vias to a ground fill on layer 2. Inadequate ground stitching on the thermal pad increases EMI and reduces ADC accuracy on adjacent channels. nanoWatt XLP sleep current is only achievable with all unused pins configured as outputs driving low and unused peripherals gated off in firmware.
The 64-VQFN (9x9 mm) exposed-pad package requires thermal relief patterns that balance solder joint reliability and thermal dissipation. Use NSMD (non-solder mask defined) pads with 0.2-0.25 mm solder mask expansion around each perimeter pad. The center exposed pad should be split into 4-9 sub-pads with thermal relief spokes to prevent tombstoning during reflow. Estimated: with proper 4-spoke thermal relief and 4-layer 1 oz copper ground plane, theta_JA is approximately 28 C/W - adequate for the K80 family at full 64 MHz without external heatsinking.
Do not enable the ECAN peripheral until the MCP2551 or similar external CAN transceiver has stable VCC and the bus is properly terminated with 120 Ω at each end. Enabling ECAN before the transceiver is ready can corrupt the receive filters. Always keep the ICSP/ICD pins (PGEC1/PGED1) accessible in production designs - adding 4.7 kΩ series resistors is fine, but do not place capacitors on these lines as they will distort programming waveforms. For automotive designs, select the PIC18F65K80-I/MRVAO variant for -40C to +125C grade.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified in standard I-grade - choose PIC18F65K80-I/MRVAO automotive variant for AEC-Q100 screening. Lead-free (Pb-free) reflow profile per JEDEC J-STD-020.
