PIC18LF25K83T-I/ML - 32KB Flash 8-bit MCU with CAN | Microchip
부품 번호: PIC18LF25K83T-I/ML ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $2.42 | $2.42 |
| 10 | $2.18 | $21.80 |
| 100 | $1.85 | $185.00 |
| 500 | $1.65 | $825.00 |
| 1,000 | $1.48 | $1,480.00 |
| 3,000 | $1.32 | $3,960.00 |
PIC18LF25K83T-I/ML 개요
An 8-bit PIC microcontroller (MCU) integrates a CPU, Flash program memory, SRAM, peripherals (timers, ADC, communication blocks), and I/O into a single chip. PIC18-family devices add enhanced instruction set, C-optimized architecture, and nanoWatt XLP power-saving modes, sitting in the hierarchy: MCU -> microcontroller -> 8-bit MCU -> PIC18 -> PIC18 K83 sub-family. The 'LF' prefix denotes the low-voltage (F) variant.
Key features include 32KB Flash program memory (16K x 16 words), 2KB data RAM, 1024 bytes data EEPROM, seven CCP/ECCP timers, two DMA channels, two comparators, and a 5-bit DAC. Communication peripherals include CAN 2.0B, I2C, SPI, UART with LIN support, and the 12-bit ADC2 supports Capacitive Voltage Divider (CVD) for touch sensing. The QFN-28 6x6mm exposed-pad package provides efficient thermal dissipation for full 64MHz operation.
The 12-bit ADC2 with computation offloads averaging, oversampling, and filtering from the CPU, enabling low-power touch and sensor applications. The integrated CAN 2.0B controller and on-chip transceiver support bit rates up to 1 Mbps for automotive and industrial networks. XLP nanoWatt technology with IDLE/DOZE/SLEEP modes reduces quiescent current to microamp levels, extending battery life.
Typical applications include automotive body and sensor networks (CAN nodes, lighting, HVAC), capacitive touch user interfaces (CVD with ADC2), battery-powered IoT sensor nodes, industrial control and HMI panels, and LIN/CAN-based distributed embedded systems. The combination of CAN, ADC2, and XLP modes is particularly suited to space-constrained automotive ECUs and portable medical devices.
When designing with this device, ensure the CAN bus includes proper termination (120 ohm at each end) and that the exposed pad is soldered to a sufficient copper pour for thermal management. The ADC2 reference voltage selection impacts conversion accuracy; use a low-noise source for precision measurements.
This page synthesizes distributor pricing, drop-in compatible variants from the same PIC18 K83 family, package-specific alternatives, and practical design notes not consolidated in the manufacturer datasheet.
드롭인 대체품: PIC18LF25K83T-I/ML — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC18LF25K83T-I/ML (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Maximum CPU Speed, Core, Operating Temperature Range.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC18LF25K83-I/ML
✅ 드롭인✓ 재고 있음
$1.86 / 개
데이터시트 보기 →PIC18LF26K83T-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F25K83T-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18F25K83-I/SS
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
PIC18LF25K83-I/SS
✅ 드롭인✓ 재고 있음
$1.62 / 개
데이터시트 보기 →PIC18F26K83T-I/ML
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC18LF25K83T-I/ML 최대 정격 & 전기적 특성
| Core | PIC18 8-bit RISC |
| Program Memory (Flash) | 32 KB (16K x 16) |
| Data SRAM | 2 KB |
| Data EEPROM | 1 KB |
| Maximum CPU Speed | 64 MHz |
| Operating Voltage Range | 1.8 V to 3.6 V |
| ADC | 12-bit ADC2 with Computation (CVD) |
| DAC | 5-bit, 1 channel |
| Comparators | 2 |
| Timers (CCP/ECCP) | 7 |
| DMA Channels | 2 |
| CAN | CAN 2.0B |
| Communication Interfaces | I2C, SPI, UART (LIN), CAN |
| 패키지 | QFN-28 (ML) 6x6 mm with exposed pad |
| 동작 온도 범위 | -40 C to +85 C (Industrial) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| MSL 레벨 | 3 (168 hours) |
PIC18LF25K83T-I/ML 핀 구성
| 핀 1 | RA2 — Port A bit 2 / analog input / CVREF+ |
| 핀 2 | RA3 — Port A bit 3 / analog input |
| 핀 3 | RA4 — Port A bit 4 / analog input / CCP5 |
| 핀 4 | RA5 — Port A bit 5 / analog input |
| 핀 5 | RA6 — Port A bit 6 / oscillator output |
| 핀 6 | RA7 — Port A bit 7 / oscillator input |
| 핀 7 | VSS — Ground reference |
| 핀 8 | VDD — Positive supply voltage (1.8V-3.6V) |
| 핀 9 | RB0 — Port B bit 0 / interrupt-on-change |
| 핀 10 | RB1 — Port B bit 1 |
| 핀 11 | RB2 — Port B bit 2 |
| 핀 12 | RB3 — Port B bit 3 |
| 핀 13 | RB4 — Port B bit 4 |
| 핀 14 | RB5 — Port B bit 5 |
| 핀 15 | RB6 — Port B bit 6 / ICSP clock |
| 핀 16 | RB7 — Port B bit 7 / ICSP data |
| 핀 17 | RC0 — Port C bit 0 |
| 핀 18 | RC1 — Port C bit 1 / CCP2 |
| 핀 19 | RC2 — Port C bit 2 / CCP1 / PWM |
| 핀 20 | RC3 — Port C bit 3 / SCL (I2C) |
| 핀 21 | RC4 — Port C bit 4 / SDA (I2C) |
| 핀 22 | RC5 — Port C bit 5 |
| 핀 23 | RC6 — Port C bit 6 / TX (UART) |
| 핀 24 | RC7 — Port C bit 7 / RX (UART) |
| 핀 25 | RE3 — Port E bit 3 / MCLR (reset, active-low) |
| 핀 26 | RD0 — Port D bit 0 |
| 핀 27 | RD1 — Port D bit 1 |
| 핀 28 | NC — Not connected (per datasheet QFN-28 pinout) |
일반적인 애플리케이션
PIC18LF25K83T-I/ML 적합 용도: 6 애플리케이션s: Automotive CAN Body Electronics, Capacitive Touch HMI Panels, Industrial Sensor Nodes, Battery-Powered IoT Edge Devices, LIN-Based Automotive Sub-Networks, Portable Medical and Wellness Devices.
Automotive CAN Body Electronics
The PIC18LF25K83T-I/ML fits automotive body and sensor nodes through its integrated CAN 2.0B controller, 64MHz CPU, and 1.8V-3.6V supply range suitable for 3.3V vehicle rails. The 32KB Flash holds CANopen or J1939 stacks plus application logic, while 2KB RAM supports message buffering. Compared to PIC18F variants, the LF version draws lower quiescent current in XLP nanoWatt sleep modes (under 1 uA typical), reducing quiescent drain on battery-backed modules. The exposed-pad QFN-28 6x6mm package provides good thermal dissipation for continuously active ECUs in tight body-control housings. Place a MCP2561 CAN transceiver between the MCU and the bus; terminate the bus with 120 ohm at each end and add ESD protection per OEM requirements.
추천
Capacitive Touch HMI Panels
The PIC18LF25K83T-I/ML is designed for capacitive touch user interfaces via its 12-bit ADC2 with Computation engine that automates Capacitive Voltage Divider (CVD) techniques. The ADC2 offloads averaging, oversampling, and filtering from the CPU, freeing 64MHz MIPS for application logic and communication. Touch buttons, sliders, and proximity sensors can be implemented without an external touch controller, reducing BOM cost in appliances, industrial controls, and consumer devices. The 32KB Flash accommodates Microchip's mTouch libraries, while 2KB RAM holds scan buffers. XLP nanoWatt sleep modes enable battery-powered touch remotes and wall switches that idle in microamp-level current between user interactions.
추천
Industrial Sensor Nodes
The PIC18LF25K83T-I/ML supports distributed industrial sensor networks through its combination of CAN 2.0B, UART with LIN, I2C, SPI, and the 12-bit ADC2 for sensor interfacing. At 64MHz, the MCU handles sensor conditioning, calibration, and protocol framing for industrial 4-20mA bridge replacement nodes or field instruments. The 1.8V-3.6V supply range aligns with 3.3V industrial rails, and the XLP modes enable energy harvesting or battery-powered wireless sensor designs. The 28-pin QFN provides a compact footprint for DIN-rail mounted modules, with the exposed pad enabling thermal dissipation at sustained 16 MIPS throughput. Programming is supported by Microchip's MPLAB X IDE with the free XC8 compiler.
추천
Battery-Powered IoT Edge Devices
The PIC18LF25K83T-I/ML targets battery-powered IoT edge devices through its 1.8V-3.6V supply range, low XLP nanoWatt sleep current, and integrated peripherals that minimize external components. The 12-bit ADC2 monitors battery voltage and sensor inputs while the DMA moves data without waking the core, dramatically reducing average power consumption. UART, I2C, and SPI interfaces connect to radio modules (LoRa, BLE, sub-GHz) for remote sensing deployments. The 32KB Flash fits lightweight MQTT-SN or proprietary protocol stacks, and 1KB EEPROM stores calibration and configuration data across power cycles. The QFN-28 6x6mm package suits compact wearable and remote sensor form factors.
추천
LIN-Based Automotive Sub-Networks
The PIC18LF25K83T-I/ML is well-suited to LIN (Local Interconnect Network) sub-nodes in automotive body and chassis systems, leveraging its UART with LIN support, 12-bit ADC2, and CCP/ECCP timers. The MCU operates as a LIN slave responding to master requests via the standardized LIN protocol, controlling window regulators, seat modules, mirror adjusters, or mirror heating. The 32KB Flash holds the LIN stack plus application logic, while 2KB RAM handles message buffers and PWM channels. The 1.8V-3.6V supply range supports direct connection to 12V vehicle rails through a LIN transceiver and 3.3V regulator like MCP1700.
추천
Portable Medical and Wellness Devices
The PIC18LF25K83T-I/ML enables portable medical and wellness devices with its low-voltage operation, XLP nanoWatt modes, and integrated peripherals for sensor signal conditioning. The 12-bit ADC2 with computation engine digitizes biomedical signals (pulse oximetry, temperature, ECG leads) while DMA offloads data movement from the core, reducing average power for longer battery life. The 64MHz CPU supports RTOS-based scheduling for multi-sensor monitoring, and 32KB Flash fits protocol stacks like Bluetooth Low Energy command layers. The QFN-28 6x6mm exposed-pad package suits compact wearable form factors with sufficient thermal margin for the 16 MIPS core.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC18LF25K83T-I/ML — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC18LF25K83-I/ML | PIC18LF26K83T-I/ML | PIC18F25K83T-I/ML | PIC18LF25K83-I/SS | PIC18F26K83T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-28 (ML) 6x6 mm | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same | QFN-28 (ML) 6x6 mm - same | SSOP-28 (SS) - different | QFN-28 (ML) 6x6 mm - same |
| Flash Memory | 32 KB | 32 KB | 64 KB | 32 KB | 32 KB | 64 KB |
| SRAM | 2 KB | 2 KB | 4 KB | 2 KB | 2 KB | 4 KB |
| Supply Voltage | 1.8V to 3.6V | 1.8V to 3.6V | 1.8V to 3.6V | 2.3V to 5.5V | 1.8V to 3.6V | 2.3V to 5.5V |
| Max CPU Speed | 64 MHz (16 MIPS) | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| CAN | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B |
| ADC | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) | 12-bit ADC2 (CVD) |
주요 차별점
- Integrated CAN 2.0B controller at 1.8V minimum supply (vs PIC18F25K83T-I/ML)
- 12-bit ADC2 with computation engine for hardware CVD touch sensing (vs PIC18LF25K83-I/SS)
- 2KB SRAM with two DMA channels for low-power data movement (vs PIC18F25K83-I/SS)
설계 노트
The PIC18LF25K83T-I/ML operates from 1.8V to 3.6V. Place a 100nF decoupling capacitor as close as possible to the VDD pin (pin 8) and a bulk 4.7uF or larger tantalum/ceramic capacitor on the supply rail. The exposed pad (EP) must be soldered to the ground plane for thermal dissipation. For battery-powered designs, use a low-quiescent LDO such as MCP1700 (1.6uA Iq) to minimize sleep current drain. The MCU's IDLE and SLEEP modes reduce core current to microamp levels, but peripherals must be individually disabled via PMD registers to achieve datasheet quiescent numbers.
For CAN bus designs, place the MCP2561 or MCP2551 CAN transceiver within 25mm of the MCU CANTX/CANRX pins (RC6/RC7) to minimize stub length. The bus should be routed as a twisted pair with 120 ohm termination at each end, and a common-mode choke near the connector for EMI suppression. Keep the analog and digital grounds separated at the ADC2 reference and joined at a single point near the MCU. The ADC2 reference voltage (VDD or external) should be decoupled with a 100nF ceramic capacitor for accurate conversions.
Do not confuse PIC18F25K83 (2.3V-5.5V) with PIC18LF25K83 (1.8V-3.6V); using the LF part at 5V will damage the MCU. The MCLR pin (RE3) must be pulled high through a 10k resistor for normal operation. In-Circuit Serial Programming (ICSP) requires dedicated access to RB6 (ICSPCLK) and RB7 (ICSPDAT); do not assign these pins to peripheral functions that would block programming. The ADC2 acquisition time must be configured per the source impedance; high-impedance sources need longer acquisition for accurate 12-bit readings.
Estimated: at 64MHz CPU and 3.6V supply with all peripherals active, core current is approximately 15-20 mA, yielding 54-72 mW dissipation. With the QFN-28 package thermal resistance of approximately 30 C/W (4-layer JEDEC test board), junction temperature rise is roughly 1.6-2.2 C above ambient at room temperature, well within the -40C to +85C industrial operating range. For sustained high-throughput applications, ensure the PCB copper area beneath the exposed pad is at least 100 mm^2 for adequate heat spreading.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Standard industrial grade; AEC-Q100 qualification not available for this part number - consider PIC18F25K83-E/ML (extended temperature) or PIC18 K83 AEC-Q100 qualified variants for automotive applications. Halogen-free and lead-free per Microchip environmental compliance documentation.
