PIC24F32KA302-E/SO - 32MHz 16-Bit Low-Power MCU
부품 번호: PIC24F32KA302-E/SO ✓ 활성PIC24F32KA302-E/SO 개요
A microcontroller is a programmable semiconductor that combines a processor core, nonvolatile program memory, data memory, and peripherals on one integrated circuit. The PIC24F32KA302 belongs to the hierarchy of 16-bit RISC microcontroller, embedded controller, and low-power system-on-chip. Its XLP design is intended for battery-powered instruments, portable monitoring equipment, industrial controls, and other systems where reducing energy use during inactive periods is as important as processing active workloads.
The PIC24F32KA302-E/SO combines a 32 MHz operating frequency with 16 MIPS performance, a 12-bit ADC, and 2 KB of SRAM. Its CTMU peripheral supports capacitive-sensing and measurement functions, while the real-time clock and calendar provides timekeeping for data logging and scheduled control. The deep-sleep-oriented DSBOR and DSWDT functions help reduce false wake-ups and system power consumption in compact embedded products.
The device uses the PIC24F 16-bit RISC architecture and stores firmware in 32 KB of Flash organized as 11K by 24 bits. On-chip data memory includes 2 KB of RAM and 512 bytes of EEPROM, allowing parameters, operating state, and calibration information to be retained without an external memory component. These resources are suitable for control loops, sensor acquisition, user-interface updates, and moderate protocol handling without requiring a higher-memory MCU.
Typical uses include battery-powered environmental sensors, industrial condition-monitoring nodes, portable medical accessories, smart-building controls, and compact instrument panels. Its 12-bit ADC is useful for analog front ends, while CTMU can reduce the component count in touch controls. The automotive-grade E temperature designation supports use across extended industrial temperature environments when the complete system qualification and operating limits are satisfied.
Design around the manufacturer’s recommended decoupling, programming, clock, and reset circuits. Place input and output capacitors close to their associated pins, keep analog routing away from switching nodes, and verify each wake source before enabling a low-power mode. The 28-pin SOIC footprint simplifies assembly but requires careful fanout and thermal review in compact enclosures.
This product page combines the manufacturer’s device information, family-level electrical characteristics, package details, sourcing links, and application-oriented design guidance. It also identifies the closest documented same-package family option while clearly separating confirmed engineering facts from items that require review against the manufacturer datasheet.
드롭인 대체품: PIC24F32KA302-E/SO — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24F32KA302-E/SO (동일 폼 팩터 및 풋프린트) — 차이점: Package, EEPROM, Low-Power Technology, Product Type.
PIC24F32KA302-I/SO
✅ 드롭인가격 문의
데이터시트 보기 →PIC24F32KA302-E/SO 최대 정격 & 전기적 특성
| Product Type | 16-bit flash microcontroller |
| Architecture | PIC RISC |
| Maximum CPU Frequency | 32 MHz |
| Maximum Instruction Throughput | 16 MIPS |
| Program Memory | 32 KB Flash (11K x 24 bits) |
| Data RAM | 2 KB |
| EEPROM | 512 bytes |
| ADC Resolution | 12 bits |
| CTMU Support | Yes |
| Low-Power Technology | PIC XLP |
| Deep-Sleep Peripheral | DSBOR and DSWDT |
| Real-Time Clock | RTCC |
| Temperature Grade | E grade |
| 패키지 | 28-pin SOIC |
| Package Width | 7.50 mm |
| 실장 유형 | Surface mount |
PIC24F32KA302-E/SO 7.50 mm 핀 구성 가이드
PIC24F32KA302-E/SO(7.50 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC24F32KA302-E/SO.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC24F32KA302-E/SO 적합 용도: 6 애플리케이션s: Battery-Powered Environmental Sensors, Industrial Condition-Monitoring Nodes, Portable Medical Accessories, Capacitive-Touch Control Panels, Smart-Building Control Modules, Data-Logging Instruments.
Battery-Powered Environmental Sensors
The PIC24F32KA302-E/SO fits compact environmental monitors because its 32 MHz, 16-bit core can process sensor readings while the XLP peripherals support deep-sleep operation. The 12-bit ADC supports analog measurements, while 32 KB of Flash and 2 KB of RAM provide room for acquisition, filtering, calibration, and communications code. The E temperature grade is preferable for sealed installations where internal heat can raise the ambient temperature. Using DSBOR and DSWDT effectively can reduce unintended wake-ups and extend battery life between scheduled measurements.
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Industrial Condition-Monitoring Nodes
PIC24F32KA302-E/SO is appropriate for distributed condition-monitoring equipment that combines analog acquisition, local decision logic, and low-power operation. Its 12-bit ADC can sample transducer signals, and the 16-bit instruction set supports calculations and filtering within a compact 28-pin SOIC footprint. The E-grade designation offers useful temperature margin for cabinets near power converters or motors. A robust implementation should include watchdog recovery, brownout handling, and a strategy for logging events when communications are unavailable.
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Portable Medical Accessories
The PIC24F32KA302-E/SO can serve as the controller in compact medical accessories that combine sensor measurement, user input, and low-power operation. The 12-bit ADC supports analog front-end acquisition, while CTMU may assist with capacitive controls on sealed interfaces. Its 32 KB Flash and 2 KB RAM are adequate for control loops and short diagnostic routines without an external memory device. Medical designs still require domain-specific risk analysis, validated isolation, electrical-safety testing, and confirmation that the complete product’s temperature and regulatory requirements are met.
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Capacitive-Touch Control Panels
PIC24F32KA302-E/SO is suitable for embedded capacitive-touch controls because CTMU provides a dedicated measurement peripheral alongside a 32 MHz 16-bit processing core. The MCU can scan touch electrodes, apply thresholding and debounce logic, update indicators, and communicate results while remaining in a low-power state between interactions. The 2 KB RAM can support scan buffers and state management, while 32 KB Flash accommodates interface firmware. Pay particular attention to guard traces, electrode spacing, grounding, and calibration in the final enclosure.
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Smart-Building Control Modules
The PIC24F32KA302-E/SO can implement low-cost smart-building endpoints that monitor inputs, operate local outputs, and sleep between activity. Its 12-bit ADC supports analog sensor interfaces, while DSBOR and DSWDT assist in controlling wake behavior and system robustness. The 28-pin SOIC package provides enough pins for digital I/O, communications, programming, and power in a compact module. For connected equipment, validate protocol timing, bus idle states, brownout recovery, and thermal performance inside the installed enclosure before field deployment.
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Data-Logging Instruments
PIC24F32KA302-E/SO is well suited to portable data loggers that periodically capture analog measurements and retain operating information. The 12-bit ADC acquires sensor data, the 16-bit core supports timestamp calculations and scaling, and 512 bytes of EEPROM can hold configuration or calibration values. Deep-sleep operation reduces energy consumption between sample cycles, while the RTCC supports time-based records and scheduled events. Firmware should include file-level wear management, write-cycle budgeting, and a power-fail strategy for long-duration logging applications.
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추천 제품 요약
엔지니어링 참조 데이터: PIC24F32KA302-E/SO — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24F32KA302-I/SO |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Package | 28-pin SOIC | 28-pin SOIC - same |
| CPU Architecture | 16-bit PIC RISC | 16-bit PIC RISC |
| Maximum CPU Frequency | 32 MHz | 32 MHz |
| Maximum Throughput | 16 MIPS | 16 MIPS |
| Program Memory | 32 KB Flash (11K x 24 bits) | 32 KB Flash (11K x 24 bits) |
| Data Memory | 2 KB RAM and 512 bytes EEPROM | 2 KB RAM and 512 bytes EEPROM |
| ADC Resolution | 12 bits | 12 bits |
| Temperature Grade | E grade | I grade |
| Low-Power Features | PIC XLP with DSBOR, DSWDT, CTMU, and RTCC | PIC XLP with DSBOR, DSWDT, CTMU, and RTCC |
주요 차별점
- Higher temperature grade than the closest same-package family alternative (vs PIC24F32KA302-I/SO)
- Same core performance and memory organization across the package-compatible family option (vs PIC24F32KA302-I/SO)
- Dedicated low-power and measurement resources in a compact footprint (vs PIC24F32KA302-I/SO)
설계 노트
Configure DSBOR and DSWDT for the actual supply range before entering deep sleep, then verify every wake source in hardware. External sensors and interface chips can hold the supply above the MCU’s retention threshold even when the MCU is asleep. Measure current during active, idle, and sleep periods with the final regulator and peripheral population because board-level leakage may dominate a low-power design.
Place all required decoupling capacitors directly between the corresponding power and ground pins, with the shortest and lowest-inductance return path available. Route sensitive analog inputs away from switching-regulator, relay, and high-current traces. For CTMU electrodes, use a stable reference ground, guarded surroundings, and unchanged panel construction; otherwise production calibration may not transfer reliably from the engineering sample.
Do not assume that another 28-pin SOIC MCU is a drop-in replacement. Confirm pin-by-pin assignments for power, ground, programming, reset, oscillator, ADC, communications, and CTMU functions. Likewise, do not substitute PIC24F32KA302-I/SO for the E/SO without checking the 40°C lower upper-temperature limit against worst-case enclosure temperature.
Follow the manufacturer’s analog-layout guidance for ADC and CTMU signals, including short traces, suitable grounding, and isolation from switching nodes. If an external ADC is used instead of the internal converter, account for acquisition time, reference noise, and the voltage range at the sensor input. Validate gain and offset accuracy across the full operating temperature range rather than calibrating only at room temperature.
규정 준수 정보
The automotive-grade E ordering designation is identified in product listings, but the manufacturer listings did not expose explicit AEC-Q100, RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements.
