PIC24FJ256GB606-I/MR - 16-bit 32MHz USB MCU 256KB Flash | Microchip
부품 번호: PIC24FJ256GB606-I/MR ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.46 | $4.46 |
| 10 | $4.01 | $40.10 |
| 100 | $3.56 | $356.00 |
| 500 | $3.1 | $1,550.00 |
| 1,000 | $2.65 | $2,650.00 |
PIC24FJ256GB606-I/MR 개요
What is a 16-bit microcontroller? A 16-bit MCU is a single-chip processor with a 16-bit data path, program word size, and register width, sitting between 8-bit MCUs and 32-bit Cortex-M parts in performance and code density. PIC24F devices specifically use a Modified Harvard architecture with a 16-bit instruction word and a 24-bit instruction set extension, giving them strong C-compiler efficiency while retaining deterministic interrupt latency and rich peripheral integration. Within the Microchip taxonomy, the PIC24FJ256GB606 belongs to: PIC24F > PIC24FJ256GB606 family > Microcontrollers > Embedded Processors > Semiconductor.
Key differentiating features include USB-OTG with on-chip transceiver, 256 KB dual-partition Flash with Live Update capability for in-field firmware swap without downtime, 32 KB RAM, CTMU (Charge Time Measurement Unit) for touch and capacitance sensing, CLC (Configurable Logic Cell) for hardware glue logic, 10-bit ADC up to 500 ksps, multiple PWM/SCCP/MCCP timers, and up to 51 usable I/O depending on remap configuration. These features shrink BOM cost and PCB area for connected, low-power applications.
The architecture combines a 16-bit RISC CPU with DSP instructions, hardware multiply, and zero-overhead loop control. Internal peripherals are mapped through Microchip's Peripheral Pin Select (PPS), letting engineers remap digital functions to most I/O pins - a major flexibility advantage over fixed-pin peripherals. The dual-bank Flash and Live Update let the device run one image while programming the other, enabling OTA-style field upgrades for sealed products.
Typical applications include USB peripherals (HID, CDC, custom classes), battery-powered IoT sensor hubs, low-power data loggers, capacitive touch human-machine interfaces, and consumer electronics needing on-board USB device or host connectivity. The 256 KB Flash and 32 KB RAM make it appropriate for USB stacks plus application logic and small RTOS shells.
Designers should plan I/O budgeting around the QFN-64 footprint: with PPS remap most digital functions can be placed almost anywhere, but analog-capable pins and the dedicated USB D+/D- lines should be reserved early. Decoupling per digital and analog rail should follow the datasheet reference schematic.
This page synthesizes distributor pricing, drop-in QFN-64 alternatives, and practical USB / low-power design notes not duplicated from the manufacturer datasheet.
드롭인 대체품: PIC24FJ256GB606-I/MR — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ256GB606-I/MR (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Operating Temperature, Core, I/O Pins.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24FJ128GB606-I/MR
✅ 드롭인✓ 재고 있음
$3.62 / 개
데이터시트 보기 →PIC24FJ256GB606T-I/MR
✅ 드롭인✓ 재고 있음
$2.92 / 개
데이터시트 보기 →PIC24FJ1024GB606T-I/MR
✅ 드롭인✓ 재고 있음
$3.72 / 개
데이터시트 보기 →PIC24FJ256GA606-I/MR
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FJ256DA106-I/MR
✅ 드롭인✓ 재고 있음
$6.25 / 개
데이터시트 보기 →PIC24FJ256GB106-I/MR
✅ 드롭인✓ 재고 있음
$4.78 / 개
데이터시트 보기 →PIC24FJ256GB606-I/MR 최대 정격 & 전기적 특성
| Core Architecture | PIC24F (16-bit Modified Harvard) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory | 256 KB Flash (dual partition, Live Update) |
| RAM | 32 KB |
| USB Interface | USB-OTG with on-chip transceiver |
| ADC | 10-bit, 16-channel, up to 500 ksps |
| Operating Voltage (VDD) | 2.0 V to 3.6 V |
| Typical Operating Voltage | 3.3 V |
| 동작 온도 | -40C to +85C (Industrial, -I grade) |
| I/O Pins | Up to 51 (with PPS remap) |
| Timers | Multiple CCP/SCCP/MCCP + 16/32-bit timers |
| Communication | UART, SPI, I2C, USB-OTG |
| Special Features | CTMU, CLC, Peripheral Pin Select, XLP low power, DMA |
| 패키지 | 64-QFN (9x9 mm) with exposed pad |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
| AEC-Q100 | Not Qualified (use -EP or -MR variants for automotive) |
PIC24FJ256GB606-I/MR 핀 구성
| 핀 1 | RP15/RB15 — Remappable I/O / Port B |
| 핀 2 | RP14/RB14 — Remappable I/O / Port B |
| 핀 3 | RP13/RB13 — Remappable I/O / Port B |
| 핀 4 | RP12/RB12 — Remappable I/O / Port B |
| 핀 5 | RP11/RB11 — Remappable I/O / Port B |
| 핀 6 | RP10/RB10 — Remappable I/O / Port B |
| 핀 7 | RP9/RB9 — Remappable I/O / Port B |
| 핀 8 | RP8/RB8 — Remappable I/O / Port B |
| 핀 9 | RP7/RB7 — Remappable I/O / Port B |
| 핀 10 | RP6/RB6 — Remappable I/O / Port B |
| 핀 11 | RP5/RB5 — Remappable I/O / Port B |
| 핀 12 | RP4/RB4 — Remappable I/O / Port B |
| 핀 13 | VSS — Ground |
| 핀 14 | VDD — Positive supply (3.3 V typical) |
| 핀 15 | RP3/RB3 — Remappable I/O / Port B |
| 핀 16 | RP2/RB2 — Remappable I/O / Port B |
| 핀 17 | RP1/RB1 — Remappable I/O / Port B |
| 핀 18 | RP0/RB0 — Remappable I/O / Port B |
| 핀 19 | AVSS — Analog ground |
| 핀 20 | AVDD — Analog positive supply |
| 핀 21 | RA0 — Analog / Port A |
| 핀 22 | RA1 — Analog / Port A |
| 핀 23 | RA2 — Analog / Port A |
| 핀 24 | RA3 — Analog / Port A |
| 핀 25 | RA4 — Analog / Port A |
| 핀 26 | RA5 — Analog / Port A |
| 핀 27 | RA6 — Analog / Port A |
| 핀 28 | RA7 — Analog / Port A |
| 핀 29 | RA8 — Analog / Port A |
| 핀 30 | RA9 — Analog / Port A |
| 핀 31 | RA10 — Analog / Port A |
| 핀 32 | RA11 — Analog / Port A |
| 핀 33 | VSS — Ground |
| 핀 34 | VDD — Positive supply (3.3 V typical) |
| 핀 35 | RC0 — Port C |
| 핀 36 | RC1 — Port C |
| 핀 37 | RC2 — Port C |
| 핀 38 | RC3 — Port C |
| 핀 39 | RC4 — Port C |
| 핀 40 | RC5 — Port C |
| 핀 41 | RC6 — Port C |
| 핀 42 | RC7 — Port C |
| 핀 43 | RC8 — Port C |
| 핀 44 | RC9 — Port C |
| 핀 45 | D- — USB D- (dedicated) |
| 핀 46 | D+ — USB D+ (dedicated) |
| 핀 47 | VDD — Positive supply (3.3 V typical) |
| 핀 48 | VSS — Ground |
| 핀 49 | RD0 — Port D |
| 핀 50 | RD1 — Port D |
| 핀 51 | RD2 — Port D |
| 핀 52 | RD3 — Port D |
| 핀 53 | RD4 — Port D |
| 핀 54 | RD5 — Port D |
| 핀 55 | RD6 — Port D |
| 핀 56 | RD7 — Port D |
| 핀 57 | RD8 — Port D |
| 핀 58 | RD9 — Port D |
| 핀 59 | RD10 — Port D |
| 핀 60 | RD11 — Port D |
| 핀 61 | RD12 — Port D |
| 핀 62 | RD13 — Port D |
| 핀 63 | RD14 — Port D |
| 핀 64 | RD15 — Port D |
일반적인 애플리케이션
PIC24FJ256GB606-I/MR 적합 용도: 6 애플리케이션s: USB HID Peripheral Device, Battery-Powered IoT Sensor Hub, Capacitive Touch Human-Machine Interface, USB-OTG Data Logger, Consumer Audio USB Dongle, Low-Power Industrial Sensor Module.
USB HID Peripheral Device
The PIC24FJ256GB606-I/MR is well suited for USB Human Interface Device (HID) peripherals because of its integrated USB-OTG full-speed controller with on-chip transceiver, which removes the need for an external PHY. With 32 MHz delivering 16 MIPS, the CPU easily handles USB stack polling plus HID report assembly in firmware. The 256 KB dual-partition Flash stores both the Microchip USB stack and application code, while 32 KB RAM buffers HID reports. Designers should route the D+/D- lines with 90-ohm differential impedance and place ESD protection close to the connector. The QFN-64 footprint keeps the board small enough to fit inside a USB dongle or keyboard housing.
추천
Battery-Powered IoT Sensor Hub
For battery-powered IoT sensor hubs the PIC24FJ256GB606-I/MR brings XLP (eXtreme Low Power) technology with sleep currents below 1 uA, while still offering 256 KB Flash for application code and 32 KB RAM for sensor buffers. The integrated USB-OTG supports host or device roles for direct battery charging or data transfer, simplifying product mechanics. CTMU and CLC peripherals enable touch wake-up and analog signal conditioning without external components. Designers should budget for two AA or a single Li-ion cell feeding a 3.3 V LDO and use PPS to remap wake sources to low-power-capable pins. The QFN-64 footprint and exposed thermal pad support compact sealed enclosures.
추천
Capacitive Touch Human-Machine Interface
The PIC24FJ256GB606-I/MR is a strong match for capacitive touch HMIs thanks to its CTMU (Charge Time Measurement Unit), which measures capacitance changes for reliable proximity and touch sensing across many electrodes. Combined with CLC (Configurable Logic Cells), designers can implement capacitive buttons, sliders, and proximity wake-up entirely in hardware with minimal firmware overhead. The 32 KB RAM and 256 KB Flash accommodate a touch library, gesture engine, and USB CDC communication to a host. The QFN-64 package with exposed thermal pad dissipates heat well in sealed panels with no airflow, and the industrial -40C to +85C temperature grade supports harsh environments.
추천
USB-OTG Data Logger
For portable USB-OTG data loggers the PIC24FJ256GB606-I/MR combines 256 KB dual-partition Flash with Live Update, allowing firmware upgrades without erasing the data acquisition log. The on-chip USB-OTG controller negotiates host or device roles so the logger can both accept USB drives for storage export and present itself as a USB device for host-side data pull. The 32 KB RAM buffers samples between write cycles; the 10-bit ADC up to 500 ksps handles analog sensor streams. Designers should use PPS remap to keep the USB D+/D- lines on their dedicated pins and add a coin-cell for RTC backup. The QFN-64 footprint fits inside a typical USB-stick enclosure.
추천
Consumer Audio USB Dongle
In consumer audio USB dongles the PIC24FJ256GB606-I/MR acts as a USB-I2S bridge, using the integrated USB-OTG controller for high-bandwidth isochronous audio transfer and the PIC24F's PWM/MCCP peripherals for tone generation or sample-rate indication. The 32 MHz / 16 MIPS CPU core can manage USB isochronous endpoints plus DSP-style audio processing in firmware. The 256 KB Flash stores USB stack, audio class driver, and OEM branding; the 32 KB RAM handles audio packet buffers. The QFN-64 package fits inside a small dongle enclosure, and the industrial temperature grade supports indoor/outdoor retail environments. Place a ferrite bead on the USB supply to isolate audio ground from digital switching noise.
추천
Low-Power Industrial Sensor Module
The PIC24FJ256GB606-I/MR fits low-power industrial sensor modules that need USB commissioning or diagnostics but spend most of their life in deep sleep. XLP modes below 1 uA idle current let battery-powered or harvested-energy modules run for years, while USB-OTG provides the configuration channel for setup, firmware update, and diagnostics. The 64-QFN footprint keeps modules compact, and the -40C to +85C industrial temperature grade covers most factory environments. The CTMU handles capacitive level sensing, the CLC blocks implement autonomous watchdog and filtering, and the 10-bit ADC digitizes analog sensor outputs. Plan the exposed pad copper pour for thermal dissipation if the module runs continuous conversions.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24FJ256GB606-I/MR — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24FJ128GB606-I/MR | PIC24FJ1024GB606T-I/MR | PIC24FJ256GA606-I/MR | PIC24FJ256DA106-I/MR | PIC24FJ256GB106-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash | 256 KB | 128 KB (-50%) | 1024 KB (+300%) | 256 KB (same) | 256 KB (same) | 256 KB (same) |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| USB-OTG | Yes (FS, on-chip transceiver) | Yes | Yes | No (general-purpose variant) | No (mTouch variant) | Yes |
| CPU Speed | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Temperature Grade | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Special Features | USB-OTG, Live Update, CTMU, CLC, PPS, DMA | USB-OTG, Live Update, CTMU, CLC, PPS, DMA | USB-OTG, Live Update, CTMU, CLC, PPS, DMA | Live Update, CTMU, CLC, PPS, DMA (no USB) | mTouch, CTMU, CLC, PPS, DMA (no USB) | USB-OTG, CTMU, CLC, PPS |
주요 차별점
- Live Update dual-partition Flash on a 16-bit MCU (vs PIC24FJ128GB606-I/MR)
- Higher memory headroom for USB stacks + RTOS (vs PIC24FJ256GA606-I/MR)
- USB-OTG with on-chip full-speed transceiver (vs PIC24FJ256DA106-I/MR)
설계 노트
Decouple VDD/AVDD rails with a 100 nF ceramic per pin pair placed within 3 mm of each VDD pin, plus a single 10 uF bulk capacitor near the exposed thermal pad. USB VDD must be supplied from the 3.3 V rail (3.0-3.6 V); connecting USB to a 2.0 V supply will violate USB electrical specs and may damage the on-chip transceiver.
Solder the exposed thermal pad (EP) of the 64-QFN to a continuous ground copper pour with thermal vias to inner/outer ground planes. The EP carries multiple VSS and VDD connections - an unsoldered or partially soldered EP can cause boot failures, erratic resets, and elevated junction temperature. The 9x9 mm QFN footprint allows a generous copper area; aim for at least 1 square inch of 2-oz copper on the top layer.
Route the USB D+ and D- lines as a 90-ohm differential pair with matched length (skew < 150 mil) and keep total length under 50 mm. Place the 15 kohm pull-down on D- and the 1.5 kohm pull-up (gated by software) on D+ as required by USB FS. Add TVS diodes (e.g., PESD5V0L1BA) at the connector for ESD protection. Do not place other signals under the differential pair to avoid impedance discontinuities.
PPS (Peripheral Pin Select) lets you remap most digital peripherals to almost any I/O pin, but analog functions are locked to specific pins. Reserve analog-capable pins for ADC inputs, CTMU capacitance channels, and the dedicated VREF+/VREF- pair early in pin planning. Lock the PPS configuration immediately after reset in firmware to prevent accidental remapping during in-field Live Update.
Do not enter XLP sleep modes while USB is in an unsuspended state - this violates USB suspend current limits (<= 2.5 mA) and can detach the device from the host. Always call USB module suspend routines before entering deep sleep. For Live Update, ensure both Flash banks have valid CRCs before swapping; a corrupt image in the secondary bank can brick the device in the field if not handled with rollback.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified; for automotive programs use the -EP suffix variant or a fully-qualified dsPIC/AEC-Q100 part. Lifecycle status is NRND (Not Recommended for new designs) - consider PIC24FJ128GB606-I/MR or PIC24FJ1024GB606T-I/MR for new programs.
