PIC24FJ512GB606T-I/PT - 512KB Flash 32MHz USB-OTG MCU TQFP-64 | Microchip
부품 번호: PIC24FJ512GB606T-I/PT ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $8.96 | $8.96 |
| 10 | $8.06 | $80.60 |
| 100 | $7.17 | $717.00 |
| 500 | $6.45 | $3,225.00 |
| 1,000 | $5.74 | $5,740.00 |
PIC24FJ512GB606T-I/PT 개요
A microcontroller (MCU) is a single-chip computer integrating a CPU core, Flash program memory, SRAM, and peripherals on one die. The PIC24F family is Microchip's 16-bit modified-Harvard architecture positioned between 8-bit PIC16/PIC18 devices and 32-bit PIC32 parts, optimized for low-power operation with features such as nanoWatt XLP technology, multiple power-saving modes, and peripheral pin select for flexible signal routing.
Key features of the PIC24FJ512GB606 include 512 KB self-programmable Flash split into dual partitions for Live Update firmware upgrades, 32 KB SRAM, 6 UART modules with IrDA and LIN support, 6 PWM channels, 7 timers, 3 analog comparators, 8 DMA channels, USB-OTG full-speed, Configurable Logic Cells (CLC), and a Charge Time Measurement Unit (CTMU) for capacitive touch or precise timing. The dual-partition Flash is a notable differentiator versus single-bank MCUs, allowing field firmware updates without device downtime.
Typical applications include industrial HMI and sensor hubs, portable medical/fitness devices with USB logging, USB peripherals such as HID or CDC bridges, low-power IoT sensor nodes, and consumer products that must be field-upgradable over USB. The combination of 512 KB Flash, USB-OTG, and extensive analog/digital peripherals removes the need for an external memory device in most designs.
When designing with this part, confirm that your linker script reserves equal dual partitions (Live Update requirement), select the appropriate oscillator configuration (e.g., 8 MHz primary with 32 MHz PLL), and follow Microchip's MPLAB Harmony code framework for USB stack integration to shorten development time.
드롭인 대체품: PIC24FJ512GB606T-I/PT — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC24FJ512GB606T-I/PT (동일 폼 팩터 및 풋프린트) — 차이점: Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC24FJ512GB606-I/PT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FJ512GB606-E/PT
✅ 드롭인✓ 재고 있음
$4.1 / 개
데이터시트 보기 →PIC24FJ512GB610-I/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.92 / 개
데이터시트 보기 →PIC24FJ512GA610T-I/PT
✅ 드롭인✓ 재고 있음
$5.4 / 개
데이터시트 보기 →PIC24FJ512GA606-I/PT
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$5.5 / 개
데이터시트 보기 →PIC24FJ512GB606T-E/PT
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC24FJ512GB606T-I/PT 최대 정격 & 전기적 특성
| Core Architecture | PIC24F 16-bit RISC (modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash Memory | 512 KB dual-partition with Live Update |
| Data SRAM | 32 KB |
| Operating Voltage Range | 2.0 V to 3.6 V |
| 동작 온도 범위 | -40 C to +85 C (Industrial -I grade) |
| 패키지 | 64-pin TQFP (PT) 10x10 mm |
| 실장 유형 | Surface Mount |
| USB | USB-OTG full-speed on-chip |
| UART Modules | 6 (with IrDA and LIN support) |
| PWM Channels | 6 |
| Timers | 7 |
| Analog Comparators | 3 |
| DMA Channels | 8 |
| Configurable Logic Cells (CLC) | Yes |
| Charge Time Measurement Unit (CTMU) | Yes |
| RoHS 상태 | Compliant |
| Lead-Free / Halogen-Free | Yes |
| MSL 레벨 | 3 |
| Qualification | Industrial grade (AEC-Q100 not qualified) |
PIC24FJ512GB606T-I/PT 64-pin tqfp (pt) 10x10 mm 핀 구성 가이드
PIC24FJ512GB606T-I/PT(64-pin tqfp (pt) 10x10 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: PIC24FJ512GB606T-I/PT.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
PIC24FJ512GB606T-I/PT 적합 용도: 7 애플리케이션s: USB-OTG Peripheral Bridge Device, Industrial HMI and Sensor Hub, Portable Medical and Fitness Devices, Field-Upgradable IoT Sensor Node, USB CDC/HID Bridge Device, Capacitive Touch User Interface, Low-Power Data Logger.
USB-OTG Peripheral Bridge Device
The PIC24FJ512GB606T-I/PT fits USB-OTG bridge applications because of its on-chip full-speed USB-OTG transceiver, 512 KB dual-partition Flash for protocol stacks, and 32 KB SRAM for descriptor buffers. With 32 MHz CPU it comfortably runs Microchip's USB device stack while leaving CPU headroom for application logic. Placed as the sole MCU on the board with a USB Type-A/B connector, it eliminates external transceivers and the firmware can be Live-Updated in the field over the same USB port.
추천
Industrial HMI and Sensor Hub
The PIC24FJ512GB606T-I/PT serves industrial HMI controllers thanks to its 6 UART ports with IrDA and LIN, 6 PWM channels for backlight and motor control, 3 analog comparators for sensor conditioning, and 512 KB Flash for HMI graphics libraries. Industrial temperature grade and 2.0-3.6 V operation tolerate factory-floor 24 V-rail buck-derived power. Pin-compatible GB610 family variants allow upgrades if a higher-pin-count design is needed.
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Portable Medical and Fitness Devices
Medical wearables and fitness monitors benefit from the PIC24FJ512GB606T-I/PT's nanoWatt XLP sleep modes for sub-uA standby, 512 KB Flash for waveform compression algorithms, and CTMU for precise capacitive touch sensor measurement. USB-OTG enables direct charging and data sync without extra interface chips. The 2.0 V minimum supply allows single-cell lithium operation with low-battery headroom.
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Field-Upgradable IoT Sensor Node
The PIC24FJ512GB606T-I/PT is ideal for IoT sensor nodes requiring OTA updates because its dual-partition Flash supports Live Update, where one bank runs while the other is reprogrammed - eliminating downtime. 8 DMA channels offload sensor acquisition, 6 PWM drive analog dimming/valve actuators, and 32 KB SRAM holds calibration tables. 2.0-3.6 V operation works with 3.6 V lithium primary cells for multi-year deployment.
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USB CDC/HID Bridge Device
USB-to-UART bridges and HID controllers leverage the PIC24FJ512GB606T-I/PT's on-chip USB-OTG full-speed and 6 UART modules for simultaneous bridging to multiple serial peripherals. The 512 KB Flash stores CDC/HID/composite class stacks with custom vendor commands, while 32 KB SRAM handles USB endpoint buffers plus application scratch. Live Update allows vendors to patch CDC bugs in deployed units without factory recall.
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Capacitive Touch User Interface
Consumer products requiring capacitive touch buttons or sliders benefit from the PIC24FJ512GB606T-I/PT's Charge Time Measurement Unit (CTMU) for high-resolution time measurement, Configurable Logic Cells (CLC) for hardware event triggers, and 32 KB SRAM for gesture recognition tables. The 512 KB Flash holds mTouch libraries and product UI flow. USB-OTG enables touch-tuning data upload from PC tools.
추천
Low-Power Data Logger
Battery-powered data loggers use the PIC24FJ512GB606T-I/PT for its 512 KB Flash enabling local storage of 170K x 24-bit samples (matches the dual-partition Live Update map), nanoWatt XLP for year-long standby, USB-OTG for offload to PC, and CTMU for sensor timing. The 6 UART ports accommodate multiple sensor buses simultaneously; DMA channels move data to Flash with zero CPU overhead.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC24FJ512GB606T-I/PT — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC24FJ512GB606-I/PT | PIC24FJ512GB606-E/PT | PIC24FJ512GB610-I/PT | PIC24FJ512GA610T-I/PT | PIC24FJ512GB606T-E/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-64 (PT) | TQFP-64 (PT) | TQFP-64 (PT) | TQFP-64 (PT) | TQFP-64 (PT) | TQFP-64 (PT) |
| Flash Memory | 512 KB dual-partition | 512 KB dual-partition | 512 KB dual-partition | 512 KB dual-partition | 512 KB | 512 KB dual-partition |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) | 32 MHz (16 MIPS) |
| USB | USB-OTG full-speed | USB-OTG full-speed | USB-OTG full-speed | USB-OTG + Host | No USB | USB-OTG full-speed |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +125C (Extended) |
| Price (qty-1, USD) | 8.96 | 8.90 | 9.50 | 9.20 | 8.50 | 9.55 |
주요 차별점
- Dual-partition Flash with Live Update capability (vs PIC24FJ512GA610T-I/PT)
- On-chip USB-OTG full-speed transceiver (vs PIC24FJ512GA606-I/PT)
- Wide 2.0 V to 3.6 V supply for single-cell lithium operation (vs PIC24FJ512GB610-I/PT)
설계 노트
Estimated: at 32 MHz active and 3.3 V supply, the PIC24FJ512GB606T-I/PT typically draws 15-25 mA active core current; in sleep with nanoWatt XLP enabled, current drops below 1 uA. Decouple VDD/VSS pairs with 100 nF ceramic as close to each pin pair as possible, and add a bulk 10 uF tantalum or ceramic at the regulator output to suppress USB inrush transients during hot-plug events.
Route the 32.768 kHz crystal traces symmetrically within 5 mm of the SOSCO/SOSCI pins with a guard ring tied to ground; place the USB D+/D- traces as a 90 ohm differential pair matched within 2 mm to minimize reflections. Keep the ICSP programming signals away from PWM outputs to avoid debugger noise coupling.
Do not enable Live Update in software until the dual-partition linker script reserves two equal-sized Flash banks; mismatched partitions will silently disable Live Update at runtime. Forgetting the CTMU calibration routine will produce non-linear touch measurements; run the mTouch CTMU auto-calibration on every boot for production units.
Estimated: at 32 MHz active and 3.3 V, the TQFP-64 package dissipates roughly 80 mW worst case; with theta_JA of ~50 C/W on a 4-layer JEDEC board, junction rise is ~4 C above ambient - well within the 125 C limit. No heatsink is required for normal industrial use; however, in enclosed IP67 housings, derate clock to 16 MHz if ambient exceeds 70 C.
규정 준수 정보
RoHS and lead-free compliant per Microchip product page; industrial temperature grade only - not AEC-Q100 qualified. Choose PIC24FJ automotive-grade parts for vehicle applications.