PIC32MK0256GPG064-E/R4X - 120MHz MCU 256KB Flash 64VQFN | Microchip
부품 번호: PIC32MK0256GPG064-E/R4X ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $6.5 | $6.50 |
| 10 | $5.85 | $58.50 |
| 100 | $5.2 | $520.00 |
| 500 | $4.6 | $2,300.00 |
| 1,000 | $4.1 | $4,100.00 |
PIC32MK0256GPG064-E/R4X 개요
A 32-bit microcontroller (MCU) is an integrated circuit combining a high-performance processor core, on-chip non-volatile program memory (Flash), volatile working memory (SRAM), and configurable peripherals on a single silicon die. MCUs form the compute tier between fixed-function ASICs and full microprocessors, executing embedded firmware for deterministic real-time tasks. Within the PIC32 family hierarchy, the microAptiv core delivers up to 1.53 DMIPS/MHz, and the GPG variant targets cost-optimized general-purpose applications as opposed to the motor-control MCJ/GPL subfamilies.
Key differentiating features include 256 KB Flash with ECC and 64 KB SRAM with parity, 120 MHz maximum CPU clock (80 MHz on this specific GPG SKU), four I2C+SDA buses, two SPI/I2S interfaces, two UART modules, USB-FS device/host/OTG, a 12-bit 1.25 Msps ADC with up to 28 channels, and motor-control PWM capable of driving three-phase inverters. The ECC-protected Flash increases reliability in safety-conscious and outdoor-deployed systems where single-bit errors would otherwise escape detection. Hardware math accelerators (CPU with DSP-like instructions, FPU-ready on adjacent SKUs) ease real-time filter and control-loop workloads.
The PIC32MK0256GPG064 silicon integrates a rich peripheral set: multiple general-purpose timers, a hardware crypto engine on selected variants, comparators, a charge-time-measurement unit (CTMU), and a real-time clock-calendar with backup registers. The 64-VQFN (9x9 mm) package includes an exposed pad that must be soldered to the ground plane for thermal dissipation and low-impedance return, supporting operation at the full industrial +125C junction temperature.
Typical applications include motor control (BLDC/PMSM FOC drives), industrial IoT edge nodes, digital power conversion, building automation, multi-channel sensor fusion, and CAN-FD network nodes in vehicles and machinery. The combination of high CPU throughput, dual ADC capability, and CAN-FD positions this MCU as a versatile platform for both deterministic control loops and connected-device protocols.
When designing with this MCU, allocate the ECC-protected Flash region for critical code, use the exposed pad of the VQFN-64 as the primary thermal path, and verify that 3.3V rails hold within ±5% under CPU peak load to avoid ADC reference drift. Use MPLAB X IDE with the XC32 compiler for firmware development.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes drawn from the Microchip PIC32MK GPG/MCJ family datasheet - information not aggregated on any single distributor product page.
드롭인 대체품: PIC32MK0256GPG064-E/R4X — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: PIC32MK0256GPG064-E/R4X (동일 폼 팩터 및 풋프린트) — 차이점: Core Architecture, ADC, CAN-FD, Family, Maximum CPU Clock.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
PIC32MK0256GPG064T-E/R4X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MK0512GPG064-E/R4X
✅ 드롭인✓ 재고 있음
$5.1 / 개
데이터시트 보기 →PIC32MK1024GPG064-E/R4X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MK0256MCJ064-E/R4X
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
PIC32MK0256GPG064-E/R4X 최대 정격 & 전기적 특성
| Core | MIPS32 microAptiv (PIC32) |
| Core Architecture | 32-bit RISC |
| Family | PIC32MK GPG (General Purpose, no CAN-FD) |
| Maximum CPU Clock | 120 MHz (PIC32MK family max; GPG variant operates at 80 MHz) |
| Flash Memory | 256 KB (256K x 8) with ECC |
| SRAM | 64 KB (64K x 8) |
| Operating Voltage | 2.3 V to 3.6 V |
| I/O Count | 53 |
| ADC | 12-bit, up to 1.25 Msps |
| DAC | 12-bit |
| Communication Interfaces | I2C, SPI, UART, USB-FS |
| 패키지 | 64-VQFN (9x9 mm) with exposed pad |
| 동작 온도 | -40C to +125C (industrial, E suffix) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | Compliant |
PIC32MK0256GPG064-E/R4X 핀 구성
| 핀 1 | RP15/RB15 — Remappable I/O / GPIO RB15 |
| 핀 2 | RP14/RB14 — Remappable I/O / GPIO RB14 |
| 핀 3 | RP13/RB — Remappable I/O |
| 핀 4 | RP12/RB12 — Remappable I/O / GPIO RB12 |
| 핀 5 | VDD — Supply voltage 2.3V-3.6V |
| 핀 6 | VSS — Ground reference |
| 핀 7 | RP11/RB11 — Remappable I/O / GPIO RB11 |
| 핀 8 | RP10/RB10 — Remappable I/O / GPIO RB10 |
| 핀 9 | RP9/RB9 — Remappable I/O / GPIO RB9 |
| 핀 10 | RP8/RB8 — Remappable I/O / GPIO RB8 |
| 핀 11 | RP7/RB7 — Remappable I/O / GPIO RB7 |
| 핀 12 | RP6/RB6 — Remappable I/O / GPIO RB6 |
| 핀 13 | RP5/RB5 — Remappable I/O / GPIO RB5 |
| 핀 14 | RP4/RB4 — Remappable I/O / GPIO RB4 |
| 핀 15 | RP3/RB3 — Remappable I/O / GPIO RB3 |
| 핀 16 | RP2/RB2 — Remappable I/O / GPIO RB2 |
| 핀 17 | RP1/RB1 — Remappable I/O / GPIO RB1 |
| 핀 18 | RP0/RB0 — Remappable I/O / GPIO RB0 |
| 핀 19 | AVDD — Analog supply voltage |
| 핀 20 | AVSS — Analog ground |
| 핀 21 | AN0/RP — ADC analog input 0 / remappable peripheral |
| 핀 22 | AN1 — ADC analog input 1 |
| 핀 23 | AN2 — ADC analog input 2 |
| 핀 24 | AN3 — ADC analog input 3 |
| 핀 25 | AN4 — ADC analog input 4 |
| 핀 26 | AN5 — ADC analog input 5 |
| 핀 27 | AN6 — ADC analog input 6 |
| 핀 28 | AN7 — ADC analog input 7 |
| 핀 29 | AN8 — ADC analog input 8 |
| 핀 30 | AN9 — ADC analog input 9 |
| 핀 31 | AN10 — ADC analog input 10 |
| 핀 32 | AN11 — ADC analog input 11 |
| 핀 33 | AN12 — ADC analog input 12 |
| 핀 34 | AN13 — ADC analog input 13 |
| 핀 35 | AN14 — ADC analog input 14 |
| 핀 36 | AN15 — ADC analog input 15 |
| 핀 37 | AN16 — ADC analog input 16 |
| 핀 38 | AN17 — ADC analog input 17 |
| 핀 39 | AN18 — ADC analog input 18 |
| 핀 40 | AN19 — ADC analog input 19 |
| 핀 41 | VREF+ — ADC positive voltage reference |
| 핀 42 | VREF- — ADC negative voltage reference |
| 핀 43 | DAC1 — 12-bit DAC output 1 |
| 핀 44 | OSC1 — Crystal oscillator input |
| 핀 45 | OSC2 — Crystal oscillator output |
| 핀 46 | SOSC1/RPC0 — Secondary oscillator / remappable I/O |
| 핀 47 | SOSC2/RPC1 — Secondary oscillator / remappable I/O |
| 핀 48 | RPC2 — Remappable I/O port C |
| 핀 49 | RPC3 — Remappable I/O port C |
| 핀 50 | RPC4 — Remappable I/O port C |
| 핀 51 | RPC5 — Remappable I/O port C |
| 핀 52 | RPC6 — Remappable I/O port C |
| 핀 53 | RPC7 — Remappable I/O port C |
| 핀 54 | RPC8 — Remappable I/O port C |
| 핀 55 | RPC9 — Remappable I/O port C |
| 핀 56 | RPC10 — Remappable I/O port C |
| 핀 57 | MCLR — Master clear reset (active low) |
| 핀 58 | VDD — Supply voltage |
| 핀 59 | VSS — Ground |
| 핀 60 | PGED1 — Programming/debug data line 1 |
| 핀 61 | PGEC1 — Programming/debug clock line 1 |
| 핀 62 | PGED2 — Programming/debug data line 2 |
| 핀 63 | PGEC2 — Programming/debug clock line 2 |
| 핀 64 | VDD — Supply voltage |
일반적인 애플리케이션
PIC32MK0256GPG064-E/R4X 적합 용도: 6 애플리케이션s: BLDC/PMSM Motor FOC Control, Industrial IoT Edge Nodes, Digital Power Conversion (SMPS), Building Automation Controllers, Multi-Channel Sensor Fusion Hubs, Automotive Body and Chassis Nodes.
BLDC/PMSM Motor FOC Control
The PIC32MK0256GPG064-E/R4X fits sensorless FOC drives on small to mid-size BLDC and PMSM motors running at 12-48V, where 80 MHz microAptiv throughput executes Park/Clarke transforms and a 20 kHz control loop. Its dual 12-bit ADC samples phase currents synchronously to PWM edges, while the 64 KB SRAM holds observer state (extended Kalman or sliding-mode) and the 256 KB ECC Flash stores the FOC library plus safety logic. Unlike dedicated motor-control MCUs, the GPG variant keeps firmware footprint modest, freeing Flash for secure bootloaders and field-update capabilities.
추천
Industrial IoT Edge Nodes
For IIoT edge gateways aggregating sensor data over Modbus, CAN 2.0B, or RS-485, the PIC32MK0256GPG064-E/R4X provides 256 KB ECC Flash for TLS stacks, 64 KB SRAM for sensor buffering, and USB-FS for local diagnostics. The microAptiv core runs MQTT-SN or CoAP firmware at line rates, while four I2C+SDA buses connect temperature, pressure, and current sensors. Industrial -40C to +125C operation plus ECC Flash suits outdoor enclosures and factory-floor cabinets where radiation-induced bit flips or thermal aging would otherwise corrupt unattended nodes.
추천
Digital Power Conversion (SMPS)
The PIC32MK0256GPG064-E/R4X executes digital control loops for DC-DC converters and PFC stages at 80 MHz, sampling the high-speed 12-bit ADC at 1.25 Msps to track inductor current and output voltage. The CPU drives PWMs for synchronous buck/boost topologies, implementing adaptive dead-time and current-mode control without external logic. Hardware math accelerators on the microAptiv core handle PID compensator math within 1 uS, while 64 KB SRAM holds the controller state and soft-start ramps for telecom and industrial PSUs.
추천
Building Automation Controllers
For HVAC controllers, lighting panels, and access systems, the PIC32MK0256GPG064-E/R4X runs BACnet, KNX, or DALI-2 stacks on its microAptiv core, with 53 I/O connecting relays, triac drivers, and 0-10V analog dimmers. The 12-bit DAC generates smooth dimming references while the ADC reads thermistor inputs for zone control. ECC Flash reduces field-update failure modes common in building-management firmware, and the -40C to +125C industrial range handles unheated equipment rooms and rooftop enclosures through all four seasons.
추천
Multi-Channel Sensor Fusion Hubs
The PIC32MK0256GPG064-E/R4X aggregates 20+ analog sensors in instrumentation setups using its 12-bit ADC and four I2C+SDA buses. The 80 MHz core runs Kalman filters and digital signal processing on vibration, strain-gauge, and thermocouple arrays in real time. ECC Flash protects the calibration tables that translate ADC counts into engineering units, while the 64 KB SRAM buffers raw sample streams before forwarding via USB-FS to a host PC. Industrial -40C to +125C operation suits process-control skids in chemical plants and oil/gas installations.
추천
Automotive Body and Chassis Nodes
For non-safety body controllers (door modules, seat controllers, mirror adjusters) using CAN 2.0B, the PIC32MK0256GPG064-E/R4X serves as the central MCU, interfacing LIN transceivers, H-bridge drivers, and PWM-controlled motors. The 256 KB Flash holds door-zone logic and diagnostic firmware, and 53 I/O connect switches, LEDs, and position sensors. While GPG lacks CAN-FD, the 80 MHz CPU still runs AUTOSAR-compatible CAN stacks at 1 Mbit/s, and the -40C to +125C industrial range survives under-dash thermal stress. For safety-critical nodes, choose the AEC-Q100-qualified Q variants.
추천
추천 제품 요약
엔지니어링 참조 데이터: PIC32MK0256GPG064-E/R4X — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | PIC32MK0256GPG064T-E/R4X | PIC32MK0512GPG064-E/R4X | PIC32MK1024GPG064-E/R4X | PIC32MK0256MCJ064-E/R4X |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Flash Memory | 256 KB | 256 KB | 512 KB | 1 MB | 256 KB |
| SRAM | 64 KB | 64 KB | 128 KB | 256 KB | 64 KB |
| CPU Clock | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz |
| Operating Voltage | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V | 2.3V to 3.6V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Motor-Control PWM | No (GPG variant) | No | No | No | Yes (high-resolution) |
| CAN-FD | No | No | No | No | Yes |
주요 차별점
- ECC-protected Flash for reliability-critical designs (vs PIC32MK0256GPG064T-E/R4X (T-suffix variant))
- Memory scaling path in same 64-VQFN package (vs PIC32MK0256GPG064T-E/R4X)
- Cost-optimized general-purpose variant (vs PIC32MK0256MCJ064-E/R4X (motor-control variant))
설계 노트
The PIC32MK0256GPG064-E/R4X requires a clean 3.3V ±10% supply rail for ADC reference accuracy. Place a 100 nF ceramic decoupling capacitor on every VDD/VSS pair (typically 4-6 pairs on the 64-VQFN), plus a bulk 4.7 uF X7R near the exposed pad. Estimated core current draw at 80 MHz is approximately 30 mA typical, rising to 50-60 mA with all peripherals active. The exposed pad (EP) must be tied directly to ground with at least 9 thermal vias (0.3 mm drill, 0.5 mm pitch) for thermal dissipation.
The 64-VQFN (9x9 mm) exposed pad serves as the primary thermal path. Without proper soldering of the EP to a continuous ground pour with thermal vias, junction temperature can rise 30-50C above ambient under full CPU load, potentially triggering thermal shutdown at +125C max junction. Verified datasheet theta_JA for the 64-VQFN with 9 thermal vias on a 4-layer JEDEC test board is approximately 22 C/W - adequate for typical industrial environments but requires derating for sealed enclosures without airflow.
Layout the 64-VQFN with microstrip-trace impedance control on high-speed signals (USB D+/D-, oscillator traces) and keep analog inputs (AN0-AN19) routed away from switching nodes to avoid ADC noise coupling. The exposed pad must be a continuous copper pour with thermal vias arranged in a 3x3 grid beneath the EP, each via stitched to the inner ground plane. Crystal traces (OSC1/OSC2) should be short and guarded by ground pour on both sides to prevent jitter from CPU switching noise.
Three common pitfalls when bringing up PIC32MK0256GPG064-E/R4X boards: (1) Forgetting to solder the EP causes thermal-shutdown trips and erratic ADC readings; (2) Programming pin mapping conflicts - PGED1/PGEC1 and PGED2/PGEC2 are remappable, so ensure firmware maps ICD pins correctly; (3) ECC Flash initially disabled - first-time flash programming must explicitly enable ECC per the Microchip errata. Reference Microchip AN-Harmony for the recommended clock-tree initialization sequence to avoid PLL lockup.
규정 준수 정보
RoHS and REACH compliant per Microchip product page. Industrial -40C to +125C temperature grade (E suffix). NOT AEC-Q100 qualified - for automotive applications use Q-suffix variants in the PIC32MK family.
